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公开(公告)号：US09560769B2
公开(公告)日：2017-01-31
申请号：US14713063
申请日：2015-05-15
Applicant: IBIDEN CO., LTD.
Inventor： Toyotaka Shimabe , Ryuichiro Tominaga
CPC classification number: H05K1/185 , H01L2224/16227 , H01L2924/15311 , H01L2924/3511 , H05K1/032 , H05K1/115 , H05K3/4602 , H05K2201/09045 , H05K2201/09854 , H05K2201/10015 , H05K2201/10636 , H05K2203/1469 , Y02P70/611
Abstract: A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the first and second cavities. The substrate has a first projection structure partitioning the first components in the first cavity and a second projection structure partitioning the second components in the second cavity, and the first and second cavities and the first and second projection structures are formed in the substrate such that T1
Abstract translation: 印刷电路板包括具有第一和第二空腔的衬底，容纳在第一腔中的第一电子部件，容纳在第二腔中的第二电子部件和形成在衬底上并包括绝缘夹层的堆积层， 覆盖第一和第二腔。 衬底具有分隔第一腔中的第一部件的第一突起结构和分隔第二腔中的第二部件的第二突出结构，并且第一和第二腔以及第一和第二突出结构形成在衬底中，使得T1 满足
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公开(公告)号：US20150334842A1
公开(公告)日：2015-11-19
申请号：US14713064
申请日：2015-05-15
Applicant: IBIDEN CO., LTD.
Inventor： Toyotaka SHIMABE , Ryuichiro Tominaga
CPC classification number: H05K1/183 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L2224/16227 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H05K1/0298 , H05K1/0313 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/0145 , H05K2201/09854 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10219 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , H01L2924/00
Abstract: A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T1
Abstract translation: 印刷电路板包括具有空腔的芯基板，容纳在空腔中的多个电子元件，以及形成在基板上并包括绝缘夹层的堆积层，使得中间层覆盖空腔。 所述部件包括第一部件，第二部件和第三部件，所述芯基板具有分隔所述空腔中的所述第一和第二部件的第一突起结构以及将所述腔体中的第二和第三部件分隔开的第二突起结构， 在基板上形成第一和第二结构，使得T1
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公开(公告)号：US20150334844A1
公开(公告)日：2015-11-19
申请号：US14713063
申请日：2015-05-15
Applicant: IBIDEN CO., LTD
Inventor： Toyotaka SHIMABE , Ryuichiro Tominaga
CPC classification number: H05K1/185 , H01L2224/16227 , H01L2924/15311 , H01L2924/3511 , H05K1/032 , H05K1/115 , H05K3/4602 , H05K2201/09045 , H05K2201/09854 , H05K2201/10015 , H05K2201/10636 , H05K2203/1469 , Y02P70/611
Abstract: A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the first and second cavities. The substrate has a first projection structure partitioning the first components in the first cavity and a second projection structure partitioning the second components in the second cavity, and the first and second cavities and the first and second projection structures are formed in the substrate such that T1
Abstract translation: 印刷电路板包括具有第一和第二空腔的衬底，容纳在第一腔中的第一电子部件，容纳在第二腔中的第二电子部件和形成在衬底上并包括绝缘夹层的堆积层， 覆盖第一和第二腔。 衬底具有分隔第一腔中的第一部件的第一突起结构和分隔第二腔中的第二部件的第二突出结构，并且第一和第二腔以及第一和第二突出结构形成在衬底中，使得T1 满足
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公开(公告)号：US09338891B2
公开(公告)日：2016-05-10
申请号：US14713064
申请日：2015-05-15
Applicant: IBIDEN CO., LTD.
Inventor： Toyotaka Shimabe , Ryuichiro Tominaga
CPC classification number: H05K1/183 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L2224/16227 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H05K1/0298 , H05K1/0313 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/0145 , H05K2201/09854 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10219 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , H01L2924/00
Abstract: A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T1
Abstract translation: 印刷电路板包括具有空腔的芯基板，容纳在空腔中的多个电子元件，以及形成在基板上并包括绝缘夹层的堆积层，使得中间层覆盖空腔。 所述部件包括第一部件，第二部件和第三部件，所述芯基板具有分隔所述空腔中的所述第一和第二部件的第一突起结构以及将所述腔体中的第二和第三部件分隔开的第二突起结构， 在基板上形成第一和第二结构，使得T1
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