公开(公告)号：US20150334844A1

公开(公告)日：2015-11-19

申请号：US14713063

申请日：2015-05-15

Applicant: IBIDEN CO., LTD

Inventor： Toyotaka SHIMABE ,  Ryuichiro Tominaga

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/032 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/09045 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611

Abstract: A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the first and second cavities. The substrate has a first projection structure partitioning the first components in the first cavity and a second projection structure partitioning the second components in the second cavity, and the first and second cavities and the first and second projection structures are formed in the substrate such that T1

Abstract translation: 印刷电路板包括具有第一和第二空腔的衬底，容纳在第一腔中的第一电子部件，容纳在第二腔中的第二电子部件和形成在衬底上并包括绝缘夹层的堆积层， 覆盖第一和第二腔。 衬底具有分隔第一腔中的第一部件的第一突起结构和分隔第二腔中的第二部件的第二突出结构，并且第一和第二腔以及第一和第二突出结构形成在衬底中，使得T1 满足

公开(公告)号：US20150334842A1

公开(公告)日：2015-11-19

申请号：US14713064

申请日：2015-05-15

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka SHIMABE ,  Ryuichiro Tominaga

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0145 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10219 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T1

Abstract translation: 印刷电路板包括具有空腔的芯基板，容纳在空腔中的多个电子元件，以及形成在基板上并包括绝缘夹层的堆积层，使得中间层覆盖空腔。 所述部件包括第一部件，第二部件和第三部件，所述芯基板具有分隔所述空腔中的所述第一和第二部件的第一突起结构以及将所述腔体中的第二和第三部件分隔开的第二突起结构， 在基板上形成第一和第二结构，使得T1

公开(公告)号：US20150264815A1

公开(公告)日：2015-09-17

申请号：US14644289

申请日：2015-03-11

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka SHIMABE ,  Masahiro KANEKO ,  Toshiki FURUTANI

IPC: H05K1/18 ,  H01G4/12 ,  H01G2/06 ,  H05K3/12 ,  H05K1/02 ,  H01G4/008 ,  H05K3/32 ,  H05K3/42 ,  H01G4/30 ,  H05K1/11

CPC classification number: H05K1/185 ,  H01G2/06 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/30 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/10015 ,  Y10T29/43 ,  H01L2924/00

Abstract: A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 μm to 200 μm and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.

Abstract translation: 具有内置电容器的基板包括绝缘基材层，形成在绝缘基材层上并包括导体层和绝缘层的积层，以及位于基材的开口中的多层陶瓷电容器 并且包括内部电极，陶瓷电介质层和一对外部电极。 陶瓷电容器具有长边和短边的长方体形状，一对外部电极形成在相对的长边侧，使得外部电极分隔30μm至200μm的范围内的距离，并且每个外部电极 包括连接到各组内电极的导电膏层和覆盖导电膏层的镀铜层，导电膏层包括含有玻璃成分的Ni糊或Cu糊5〜40％的范围。

公开(公告)号：US20150282305A1

公开(公告)日：2015-10-01

申请号：US14669329

申请日：2015-03-26

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka SHIMABE ,  Shunsuke SAKAI

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/0284 ,  H01L21/568 ,  H01L24/19 ,  H01L24/25 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2924/15313 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0344 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A multilayer wiring board with a built-in electronic component includes a substrate, a conductor layer formed on surface of the substrate, one or more electronic components positioned in a cavity formed through the substrate, an insulating layer formed on the substrate such that the insulating layer is formed on the component in the cavity, and a wiring layer formed on the insulating layer. The conductor layer has an opening formed such that the cavity is formed in the opening of the conductor layer and that the conductor layer has a first side in the opening and a second side in the opening on the opposite side across the cavity, and the cavity is formed in the opening of the conductor layer such that width between the cavity and the first side of the conductor layer is greater than width between the cavity and the second side of the conductor layer.

Abstract translation: 具有内置电子部件的多层布线基板包括基板，形成在基板的表面上的导体层，位于通过基板形成的空腔中的一个或多个电子部件，形成在基板上的绝缘层， 在空腔中的部件上形成层，以及形成在绝缘层上的布线层。 导体层具有形成为使得空腔形成在导体层的开口中并且导体层在开口中具有第一侧的开口，并且在开口中的相对于空腔的开口中的第二侧，并且空腔 形成在导体层的开口中，使得空腔和导体层的第一侧之间的宽度大于导体层的空腔和第二侧之间的宽度。

公开(公告)号：US20150245492A1

公开(公告)日：2015-08-27

申请号：US14626085

申请日：2015-02-19

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka SHIMABE ,  Toshiki Furutani ,  Shunsuke Sakai

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H01L23/5389 ,  H01L21/4857 ,  H01L21/568 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2924/153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09972 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions.

Abstract translation: 具有内置电子部件的多层布线基板包括具有绝缘材料并具有多个开口部的基板，形成在基板的表面上的具有开口部的第一导体层，使得基板在开口部内部具有开口部 第一导体层的一部分，位于基板的开口部的多个电子部件和形成在基板上的绝缘层，使得绝缘层形成在电子部件上和第一导体层上。 开口部形成在基板上，使得开口部分包括两个开口部分，并且基板具有形成在两个开口部之间的分隔壁。

公开(公告)号：US20140042602A1

公开(公告)日：2014-02-13

申请号：US13963246

申请日：2013-08-09

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka SHIMABE ,  Keisuke SHIMIZU ,  Toshiki FURUTANI

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/495

CPC classification number: H05K1/183 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49589 ,  H01L23/49822 ,  H01L24/80 ,  H01L2924/12042 ,  H05K1/18 ,  H05K1/185 ,  H05K3/007 ,  H05K3/4602 ,  H05K2203/0156 ,  H01L2924/00

Abstract: A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less.

Abstract translation: 布线板包括具有空腔的基板和容纳在基板的空腔中的电子部件。 基板的厚度大于电子部件的厚度，使得基板的厚度与电子部件的厚度的比率设定在0.3以上且0.7以下的范围内。