Patent search ap:("IBM") AND inv:"HARDING WILLIAM E" Page 1

1.

发明授权
Method of forming contacts on semiconductors 失效
Title translation: 在半导体上形成接触的方法

公开(公告)号：US3266127A

公开(公告)日：1966-08-16

申请号：US34034464

申请日：1964-01-27

Applicant: IBM

Inventor： HARDING WILLIAM E , LANGDON JACK L , PECORARO RAYMOND P

IPC: H01L21/00 , H01L23/485

CPC classification number: H01L21/00 , H01L23/485 , H01L2924/0002 , Y10S148/033 , Y10S428/929 , Y10T29/49149 , Y10T428/12528 , Y10T428/12611 , Y10T428/12736 , H01L2924/00

2.

发明授权
Method and apparatus for producing articles having arrays of similar patterns 失效
Title translation: 用于生产具有相似图案阵列的制品的方法和装置

公开(公告)号：US3288045A

公开(公告)日：1966-11-29

申请号：US46715965

申请日：1965-05-04

Applicant: IBM

Inventor： HARDING WILLIAM E

IPC: G03F7/20

CPC classification number: G03F7/70475

3.

发明授权
Continuous processing system 失效

公开(公告)号：US3889355A

公开(公告)日：1975-06-17

申请号：US32992073

申请日：1973-02-05

Applicant: IBM

Inventor： ARONSTEIN JESSE , HARDING WILLIAM E

IPC: H01L21/30 , B23Q41/06 , H01L21/02 , H01L21/027 , H01L21/50 , H01L21/677 , H01L21/70 , B01J17/00

CPC classification number: B23Q41/06 , Y10T29/41 , Y10T29/5124

Abstract: A manufacturing system utilizing a plurality of satellite functional processing stations or sectors, each capable of standalone operation. The stations are interconnected by a handler or conveyor, which will transport individual ones of work-pieces from one processing station to the next in accordance with a prescribed sequence corresponding to the processing requirements for the workpiece.

4.

发明授权
High resolution multiple image camera and method of fabricating integrated circuit masks 失效
Title translation: 高分辨率多图像摄像机和整合电路面板的制作方法

公开(公告)号：US3449049A

公开(公告)日：1969-06-10

申请号：US3449049D

申请日：1966-01-14

Applicant: IBM

Inventor： HARDING WILLIAM E , PERRI JOHN A , RISEMAN JACOB , RUDER WINFIELD S

IPC: G03B27/32 , G03B19/02 , G03F7/20 , H01L21/027 , H01L21/30 , G03B27/42

CPC classification number: G03F7/70475 , G03B19/023

5.

发明授权
Method of selectively coating semiconductor chips 失效
Title translation: 选择性地涂覆半导体芯片的方法

公开(公告)号：US3280019A

公开(公告)日：1966-10-18

申请号：US29258663

申请日：1963-07-03

Applicant: IBM

Inventor： HARDING WILLIAM E , SCHWARTZ ROBERT S

IPC: H01L21/288 , H01L21/304 , H01L21/316 , H01L21/56 , H01L21/68 , H01L21/78 , H01L23/29 , H01L23/31

CPC classification number: H01L21/6835 , H01L21/2885 , H01L21/3043 , H01L21/316 , H01L21/56 , H01L21/78 , H01L23/291 , H01L23/3157 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2924/01012 , H01L2924/01014 , H01L2924/01019 , H01L2924/01066 , H01L2924/01078 , Y10T29/49789

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