公开(公告)号：US3691290A

公开(公告)日：1972-09-12

申请号：US3691290D

申请日：1970-12-14

Applicant: IBM

Inventor： NAPIER JOHN

IPC: H01L23/498 ,  H01L23/538 ,  H01R12/00 ,  H05K1/00 ,  H05K3/04 ,  H05K3/22 ,  H05K3/38 ,  H05K1/02

CPC classification number: H05K3/225 ,  H01L23/498 ,  H01L23/5382 ,  H01L2924/0002 ,  H05K1/0293 ,  H05K3/043 ,  H05K3/388 ,  H05K2203/0195 ,  H05K2203/175 ,  H01L2924/00

Abstract: A deletable conductor line structure permits a variety of circuits to be made from a single master pattern. A thin film of metal, which has marginal adherence to the circuit supporting substrate material, is first deposited in a discontinuous pattern on the surface of the substrate. A master circuit pattern of conductive material is then deposited on the substrate such that portions of the master circuit conductor lines overlie the discontinuous metal pattern. A selected circuit is formed by deleting certain portions of the conductor lines at the point where they overlie portions of the metal film having marginal adherence to the substrate.

公开(公告)号：US3458925A

公开(公告)日：1969-08-05

申请号：US3458925D

申请日：1966-01-20

Applicant: IBM

Inventor： NAPIER JOHN ,  SOPHER RAEMAN P ,  TOTTA PAUL A ,  WITT DAVID DE ,  KARAN CLARENCE

IPC: H01L21/00 ,  H01L21/60 ,  H01L23/485 ,  H01R12/55 ,  B01J17/00 ,  B23K31/02

CPC classification number: H01L21/67121 ,  H01L23/485 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00