公开(公告)号：US3458925A

公开(公告)日：1969-08-05

申请号：US3458925D

申请日：1966-01-20

Applicant: IBM

Inventor： NAPIER JOHN ,  SOPHER RAEMAN P ,  TOTTA PAUL A ,  WITT DAVID DE ,  KARAN CLARENCE

IPC: H01L21/00 ,  H01L21/60 ,  H01L23/485 ,  H01R12/55 ,  B01J17/00 ,  B23K31/02

CPC classification number: H01L21/67121 ,  H01L23/485 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：US3388457A

公开(公告)日：1968-06-18

申请号：US55390066

申请日：1966-05-31

Applicant: IBM

Inventor： TOTTA PAUL A

IPC: H01L21/00 ,  H01L23/29 ,  H01L23/522

CPC classification number: H01L23/291 ,  H01L21/00 ,  H01L23/522 ,  H01L2924/0002 ,  Y10T29/49004 ,  Y10T29/49155 ,  H01L2924/00

公开(公告)号：US3303393A

公开(公告)日：1967-02-07

申请号：US33386363

申请日：1963-12-27

Applicant: IBM

Inventor： HYMES IRWIN M ,  SOPHER RAEMAN P ,  TOTTA PAUL A

IPC: B23K1/19 ,  H01B1/02 ,  H01L21/60 ,  H01R12/55 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01B1/02 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01R12/52 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613

公开(公告)号：US3617816A

公开(公告)日：1971-11-02

申请号：US3617816D

申请日：1970-02-02

Applicant: IBM

Inventor： RISEMAN JACOB ,  TOTTA PAUL A

IPC: H01L23/485 ,  H01L23/532 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L24/02 ,  H01L23/53242 ,  H01L23/53252 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00

Abstract: A metallurgy interconnection system for semiconductor devices made up of laminar stripes, each having a layer of gold disposed between layers of tantalum.

公开(公告)号：US3615951A

公开(公告)日：1971-10-26

申请号：US3615951D

申请日：1969-06-20

Applicant: IBM

Inventor： FRANCO JACK R ,  TOTTA PAUL A ,  WHITE JAMES F

IPC: C23F1/02 ,  H01L21/00 ,  H01L23/522 ,  H05K3/06

CPC classification number: H05K3/067 ,  C23F1/02 ,  H01L21/00 ,  H01L23/522 ,  H01L2924/0002 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/1142 ,  H05K2203/1157 ,  H01L2924/00

Abstract: A method for subtractive etching copper adapted to form very fine line patterns. In the method a mask is deposited on the copper surface, the copper surface exposed to an environment containing an oxidizing agent which causes the formation of an adherent self thickness limiting coating of a copper compound on the exposed surface, the resultant adherent coating removed in a second environment, and the steps of forming the coating and removing repeated until the desired amount of copper has been removed.

公开(公告)号：US3507248A

公开(公告)日：1970-04-21

申请号：US3507248D

申请日：1967-06-15

Applicant: IBM

Inventor： SEELEY GERARD ,  TOTTA PAUL A ,  WALD GEORGE

IPC: C23C14/02 ,  C23C14/54 ,  C23C13/12

CPC classification number: C23C14/022 ,  C23C14/541 ,  Y10S148/169

公开(公告)号：US3488840A

公开(公告)日：1970-01-13

申请号：US3488840D

申请日：1966-10-03

Applicant: IBM

Inventor： HYMES IRWIN M ,  SOPHER RAEMAN P ,  TOTTA PAUL A

IPC: H01B1/02 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01B1/02 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49144

公开(公告)号：US3461357A

公开(公告)日：1969-08-12

申请号：US3461357D

申请日：1967-09-15

Applicant: IBM

Inventor： MUTTER WALTER E ,  TOTTA PAUL A

IPC: H01L21/00 ,  H01L23/485 ,  H01L23/522 ,  H01L3/12 ,  H01L5/06

CPC classification number: H01L24/10 ,  H01L21/00 ,  H01L23/485 ,  H01L23/522 ,  H01L24/13 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：US3401055A

公开(公告)日：1968-09-10

申请号：US42258664

申请日：1964-12-31

Applicant: IBM

Inventor： LANGDON JACK L ,  CLARENCE KARAN ,  PECORARO RAYMOND P ,  TOTTA PAUL A

IPC: B23K35/00 ,  C23C14/04 ,  H01L21/60 ,  H01L23/485

CPC classification number: H01L24/11 ,  B23K35/001 ,  C23C14/042 ,  H01L23/485 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014