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1.Method of connecting microminiaturized devices to circuit panels 失效
Title translation: 将微型设备连接到电路板的方法公开(公告)号:US3488840A
公开(公告)日:1970-01-13
申请号:US3488840D
申请日:1966-10-03
Applicant: IBM
Inventor: HYMES IRWIN M , SOPHER RAEMAN P , TOTTA PAUL A
CPC classification number: H01L24/81 , H01B1/02 , H01L2224/13111 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K2201/10234 , H05K2201/10992 , Y02P70/613 , Y10T29/49144
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公开(公告)号:US3458925A
公开(公告)日:1969-08-05
申请号:US3458925D
申请日:1966-01-20
Applicant: IBM
Inventor: NAPIER JOHN , SOPHER RAEMAN P , TOTTA PAUL A , WITT DAVID DE , KARAN CLARENCE
CPC classification number: H01L21/67121 , H01L23/485 , H01L24/11 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05171 , H01L2224/05572 , H01L2224/05644 , H01L2224/1147 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12033 , H01L2924/14 , H01L2924/00014 , H01L2924/00
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3.Terminals for microminiaturized devices and methods of connecting same to circuit panels 失效
Title translation: 用于微型设备的端子以及将其连接到电路板的方法公开(公告)号:US3303393A
公开(公告)日:1967-02-07
申请号:US33386363
申请日:1963-12-27
Applicant: IBM
Inventor: HYMES IRWIN M , SOPHER RAEMAN P , TOTTA PAUL A
CPC classification number: H01L24/81 , H01B1/02 , H01L2224/13111 , H01L2224/13147 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01R12/52 , H05K3/3436 , H05K3/3478 , H05K2201/10234 , H05K2201/10992 , Y02P70/613
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