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1.Method of forming openings using sequential sputtering and chemical etching 失效
Title translation: 使用顺序溅射和化学蚀刻形成开口的方法公开(公告)号:US3474021A
公开(公告)日:1969-10-21
申请号:US56748566
申请日:1966-07-25
Applicant: IBM
Inventor: DAVIDSE PIETER D , DHAKA VIR A , MAISSEL LEON I
CPC classification number: H01J37/3402
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公开(公告)号:US3285836A
公开(公告)日:1966-11-15
申请号:US29134763
申请日:1963-06-28
Applicant: IBM
Inventor: MAISSEL LEON I , STANDLEY CHARLES L
CPC classification number: H01L21/00 , C25D11/26 , H01L23/291 , H01L2924/0002 , H01L2924/00
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公开(公告)号:US3261082A
公开(公告)日:1966-07-19
申请号:US18281862
申请日:1962-03-27
Applicant: IBM
Inventor: MAISSEL LEON I , YOUNG DONALD R
IPC: H01C17/26
CPC classification number: H01C17/26 , H01C17/265 , H01C17/267 , Y10T29/49082 , Y10T29/49099
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公开(公告)号:US3240685A
公开(公告)日:1966-03-15
申请号:US17498562
申请日:1962-02-23
Applicant: IBM
Inventor: MAISSEL LEON I
CPC classification number: H01C17/262 , C25D11/022 , H01L49/02
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公开(公告)号:US3480922A
公开(公告)日:1969-11-25
申请号:US3480922D
申请日:1965-05-05
Applicant: IBM
Inventor: FLUR BARRY L , DAVIDSE PIETER D , MAISSEL LEON I
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6.
公开(公告)号:US3294661A
公开(公告)日:1966-12-27
申请号:US54193566
申请日:1966-04-06
Applicant: IBM
Inventor: MAISSEL LEON I
CPC classification number: C23C14/35 , H01L23/29 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
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7.Method for fabricating thin film circuit elements and resulting elements 失效
Title translation: 用于制造薄膜电路元件和所得元件的方法公开(公告)号:US3234442A
公开(公告)日:1966-02-08
申请号:US18203362
申请日:1962-03-23
Applicant: IBM
Inventor: MAISSEL LEON I , SILCOX NORMAN W
CPC classification number: H01G4/228 , C23C14/02 , H01G4/10 , Y10T29/435 , Y10T29/49099
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8.Imaging method using photoconductive element having a protective coating 失效
Title translation: 使用具有保护性涂层的光电元件的成像方法公开(公告)号:US3650737A
公开(公告)日:1972-03-21
申请号:US3650737D
申请日:1968-03-25
Applicant: IBM
Inventor: MAISSEL LEON I , NARKEN BERNT , SUNNERS BRIAN
Abstract: A transparent, protective coating overlies a photoconductive layer and is integral therewith. The coating, which has a resistivity at least equal to the dark resistivity of the photoconductive material, has a thickness in the range of 50A4000A. The coating is deposited on the photoconductive layer by sputtering through utilization of a high frequency alternating voltage whereby the properties of the coating may be controlled. When applying the high frequency alternating voltage, the power is kept low to produce a relatively high compressive stress of the coating. Controlling the power results in controlling the compressive stress of the coating. The temperature of the photoconductive layer may be maintained at a sufficiently low temperature so that the photoconductive layer retains its photoconductive properties.
Abstract translation: 透明的保护涂层覆盖光电导层并与其成为一体。 具有至少等于光电导材料的暗电阻率的电阻率的涂层具有在50A-4000A范围内的厚度。 通过利用高频交流电压通过溅射将涂层沉积在光电导层上,由此可以控制涂层的性质。 当应用高频交流电压时,功率保持较低以产生相对较高的涂层压缩应力。 控制功率可以控制涂层的压应力。 光电导层的温度可以保持在足够低的温度,使得光电导层保持其光电导性质。
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公开(公告)号:US3530055A
公开(公告)日:1970-09-22
申请号:US3530055D
申请日:1968-08-26
Applicant: IBM
Inventor: MAISSEL LEON I , SCHAIBLE PAUL M
CPC classification number: C23C14/024 , C23C14/0036 , C23C14/14 , H01J37/34
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10.
公开(公告)号:US3472074A
公开(公告)日:1969-10-14
申请号:US3472074D
申请日:1966-12-29
Applicant: IBM
Inventor: GLANG REINHARD , MAISSEL LEON I
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