Abstract:
A capacitor is formed for a monolithic integrated circuit with an increased capacitance without a decrease in breakdown voltage by forming the junction in a plurality of curved portions rather than a straight portion. The junction may be formed by either a single or double diffusion through parallel slots in a mask to permit diffusion. It also may be formed by either a single or double diffusion through orthogonal families of parallel slots. A resistor is formed by two diffusions to form the junction rather than a single diffusion whereby the gradient of the doping profile in the depletion layer of the junction is reduced. This reduces the parasitic capacitance at the junction for a given resistance whereby the resistor may be utilized at a higher cutoff frequency to permit the resistor to be utilized in higher frequency circuits.
Abstract:
An integrated lateral transistor which is easily made symmetrical. An NPN embodiment is constructed on a P- substrate which forms PN junctions with an adjacent N+ buried region and an N epitaxial region within which the N+ region is located. Integral with the substrate is a P+ isolation region which extends to the upper surface of the semiconductor to isolate the N epitaxial layer from adjacent devices. A base region is diffused into the epitaxial region to form a PN junction with the N+ buried region. N+ emitter and collector regions are diffused into the P type base region until the junctions they form with the base are within much less than one diffusion length of the base-buried region PN junction. The emitter and collector are also within two minority carrier diffusion lengths of each other. A similar PNP embodiment is also disclosed.
Abstract:
A process for producing in a transistor a slumped base profile wherein the base diffusion window is reoxidized, a layer of P2O5 is deposited over the oxide, an insulating layer deposited over the P2O5, an emitter window opened, and emitter diffusion made.