公开(公告)号：US20180210079A1

公开(公告)日：2018-07-26

申请号：US15848943

申请日：2017-12-20

Applicant: Infineon Technologies AG

Inventor： Dirk Hammerschmidt ,  Herbert Jaeger ,  Rudolf Lachner

IPC: G01S13/93 ,  G01S7/35

CPC classification number: G01S13/931 ,  G01S7/03 ,  G01S7/35 ,  G01S13/48 ,  G01S2013/0254 ,  G01S2013/9389 ,  H01Q1/3233

Abstract: A radar system for a vehicle includes an antenna element installable at an outer shell of the vehicle, a dielectric waveguide, and a radar circuit configured to communicate with the antenna element via the dielectric waveguide.

公开(公告)号：US20180180730A1

公开(公告)日：2018-06-28

申请号：US15901108

申请日：2018-02-21

Applicant: Infineon Technologies AG

Inventor： Josef Boeck ,  Rudolf Lachner ,  Maciej Wojnowski ,  Walter Hartner

IPC: G01S13/86 ,  G01S7/02 ,  G01S7/00 ,  G01S13/00 ,  H04B1/40 ,  G01S7/03 ,  G01S13/87 ,  G01S13/93

CPC classification number: G01S13/86 ,  G01S7/006 ,  G01S7/02 ,  G01S7/032 ,  G01S13/003 ,  G01S13/878 ,  G01S13/931 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H04B1/40

Abstract: A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.

公开(公告)号：US20150177373A1

公开(公告)日：2015-06-25

申请号：US14135069

申请日：2013-12-19

Applicant: Infineon Technologies AG

Inventor： Josef Boeck ,  Rudolf Lachner ,  Maciej Wojnowski ,  Walter Hartner

IPC: G01S13/86 ,  G01S7/02 ,  H04B1/40

CPC classification number: G01S13/86 ,  G01S7/006 ,  G01S7/02 ,  G01S7/032 ,  G01S13/003 ,  G01S13/878 ,  G01S13/931 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H04B1/40

Abstract: A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module.

Abstract translation: 无线通信系统包括第一半导体模块和第二半导体模块。 第一半导体模块包括连接到天线结构的半导体管芯。 第一半导体模块的半导体管芯和第一半导体模块的天线结构布置在公共封装内。 第一半导体模块的半导体管芯包括被配置为通过第一半导体模块的天线结构发送无线通信信号的发射器模块。 第二半导体模块包括连接到天线结构的半导体管芯。 第二半导体模块的半导体管芯包括：接收器模块，被配置为通过第二半导体模块的天线结构从第一半导体模块接收无线通信信号。

公开(公告)号：US10884118B2

公开(公告)日：2021-01-05

申请号：US15848943

申请日：2017-12-20

Applicant: Infineon Technologies AG

Inventor： Dirk Hammerschmidt ,  Herbert Jaeger ,  Rudolf Lachner

IPC: G01S13/931 ,  G01S7/35 ,  G01S13/48 ,  G01S7/03 ,  G01S13/02 ,  H01Q1/32

Abstract: A radar system for a vehicle includes an antenna element installable at an outer shell of the vehicle, a dielectric waveguide, and a radar circuit configured to communicate with the antenna element via the dielectric waveguide. A vehicle includes a plurality of radar radio heads arranged at an outer shell of the vehicle, a plurality of waveguides, and a radar circuit configured to generate a common local oscillator signal and simultaneously provide respective radio frequency signal derived from the common local oscillator signal to the plurality of radar radio heads via the plurality of waveguides.

公开(公告)号：US10692824B2

公开(公告)日：2020-06-23

申请号：US16173702

申请日：2018-10-29

Applicant: Infineon Technologies AG

Inventor： Rudolf Lachner ,  Linus Maurer ,  Maciej Wojnowski

IPC: H01L23/66 ,  H01Q9/04 ,  H01L23/31 ,  H01L23/00 ,  H01Q1/22

Abstract: A semiconductor radar module includes an integrated circuit (IC) radar device embedded within a wafer level package compound layer, the wafer level package compound layer extending at least partially lateral to the IC radar device. An interface layer abutting the wafer level package compound layer comprises a redistribution layer coupled to the IC radar device for connecting the IC radar device externally. An underfill material extends between the interface layer and an external substrate and abuts the interface layer and the external substrate. The interface layer is disposed between the wafer level package compound layer and the underfill material.

公开(公告)号：US20160240495A1

公开(公告)日：2016-08-18

申请号：US15137594

申请日：2016-04-25

Applicant: Infineon Technologies AG

Inventor： Rudolf Lachner ,  Linus Maurer ,  Maciej Wojnowski

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/12 ,  H01L24/19 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q9/0457 ,  H01L2924/00

Abstract: A semiconductor module comprises an integrated circuit device, the IC device embedded in a compound material, wherein the compound material at least partially extends lateral to the IC device. The semiconductor module further comprises interconnect structures arranged lateral to the IC device to provide at least one external electrical contact; a patch antenna structure integrated in the semiconductor module and electrically connected to the IC device and a layer interfacing the IC device and the compound, wherein the layer comprises first and second planar metal structures coupled to the IC device, wherein the first planar metal structure is electrically connected to the IC device and the interconnect structures and wherein the second planar metal structure is electrically connected to the IC device and the patch antenna structure.

Abstract translation: 半导体模块包括集成电路器件，嵌入复合材料中的IC器件，其中复合材料至少部分地延伸到IC器件的侧面。 半导体模块还包括布置在IC器件侧面的互连结构以提供至少一个外部电触点; 集成在半导体模块中并且电连接到IC器件的贴片天线结构和与IC器件和化合物接口的层，其中该层包括耦合到IC器件的第一和第二平面金属结构，其中第一平面金属结构是 电连接到IC器件和互连结构，并且其中第二平面金属结构电连接到IC器件和贴片天线结构。

公开(公告)号：US20150333395A1

公开(公告)日：2015-11-19

申请号：US14807417

申请日：2015-07-23

Applicant: Infineon Technologies AG

Inventor： Gerhard Lohninger ,  Johann P. Forstner ,  Rudolf Lachner

IPC: H01Q1/40

CPC classification number: H01Q1/40 ,  G01S7/03 ,  H01L2224/48091 ,  H01Q1/38 ,  H01Q9/285 ,  H01Q23/00 ,  Y10T29/49016 ,  H01L2924/00014

Abstract: Electronic apparatus having an antenna chip with a substrate and an antenna structure, and a method of producing the same. The antenna chip is integrated or packaged in a package having a chip mounting surface for mounting the antenna chip, and an encapsulating material. The encapsulating material typically is a plastic mold used in the industrial packaging of integrated circuits. Between the antenna structure and the chip mounting surface, a first void is disposed in the substrate.

Abstract translation: 具有带基板的天线芯片和天线结构的电子设备及其制造方法。 天线芯片集成或封装在具有用于安装天线芯片的芯片安装表面的封装和封装材料中。 封装材料通常是用于集成电路工业封装的塑料模具。 在天线结构和芯片安装表面之间，在基板中设置第一空隙。

公开(公告)号：US08460967B2

公开(公告)日：2013-06-11

申请号：US13622058

申请日：2012-09-18

Applicant: Infineon Technologies AG

Inventor： Rudolf Lachner ,  Linus Maurer ,  Maciej Wojnowski

IPC: H01L21/60 ,  H01L21/56

CPC classification number: H01L23/66 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/12 ,  H01L24/19 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q9/0457 ,  H01L2924/00

Abstract: A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.

Abstract translation: 半导体模块包括一个晶片级封装中的部件。 该模块包括嵌入在封装模塑料中的集成电路（IC）芯片。 该封装包括耦合到界面层的成型复合封装层，用于将天线结构和接合互连结构集成到IC芯片。 接合互连结构包括三维互连。 天线结构和接合互连结构在相同的晶片制造过程中耦合到IC芯片并且集成在界面层内。

公开(公告)号：US20130017653A1

公开(公告)日：2013-01-17

申请号：US13622058

申请日：2012-09-18

Applicant: Infineon Technologies AG

Inventor： Rudolf Lachner ,  Linus Maurer ,  Maciej Wojnowski

IPC: H01L21/60 ,  H01L21/56

CPC classification number: H01L23/66 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/12 ,  H01L24/19 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q9/0457 ,  H01L2924/00

Abstract: A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.

Abstract translation: 半导体模块包括一个晶片级封装中的部件。 该模块包括嵌入在封装模塑料中的集成电路（IC）芯片。 该封装包括耦合到界面层的成型复合封装层，用于将天线结构和接合互连结构集成到IC芯片。 接合互连结构包括三维互连。 天线结构和接合互连结构在相同的晶片制造过程中耦合到IC芯片并且集成在界面层内。

公开(公告)号：US12176962B2

公开(公告)日：2024-12-24

申请号：US17335423

申请日：2021-06-01

Applicant: Infineon Technologies AG

Inventor： Dirk Hammerschmidt ,  Erich Kolmhofer ,  Rudolf Lachner

IPC: H04B17/10 ,  G01P3/44 ,  G01S13/50 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42 ,  H01Q21/00 ,  H04B17/27

Abstract: A system includes a movable part that is rotatably movable, the movable part comprising a first portion and a second portion; transceiver circuitry configured to transmit a radio signal towards the movable part and to receive a receive radio signal from the movable part; and evaluation circuitry configured to determine a rotational position of the movable part based on the receive radio signal. The first portion of the movable part has a first electromagnetic reflectivity for the radio signal and the second portion of the movable part has a second electromagnetic reflectivity for the radio signal. The first electromagnetic reflectivity differs from the second electromagnetic reflectivity.