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    DISPLAY DEVICE
    3.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号：US20190088196A1

    公开(公告)日：2019-03-21

    申请号：US16114633

    申请日：2018-08-28

    Applicant: InnoLux Corporation

    Inventor： Wei-Cheng CHU ,  Ming-Fu JIANG ,  Chia-Cheng LIU ,  Shun-Yuan HU ,  Ming-I CHAO

    IPC: G09G3/32 ,  G09G3/20 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50

    Abstract: A display device is provided. The display device includes a first light-emitting diode and a second light-emitting diode. The first light-emitting diode includes a first conductive pad, a second conductive pad adjacent to the first conductive pad, and a first light-emitting portion disposed on the first conductive pad. The second light-emitting diode includes a third conductive pad, a fourth conductive pad adjacent to the third conductive pad, and a second light-emitting portion disposed on the third conductive pad. A distance between the first conductive pad and the third conductive pad is less than a distance between the second conductive pad and the fourth conductive pad.

    ELECTRONIC DEVICE
    4.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20210298181A1

    公开(公告)日：2021-09-23

    申请号：US17188554

    申请日：2021-03-01

    Applicant: InnoLux Corporation

    Inventor： Wei-Cheng CHU ,  Chia-Cheng LIU ,  Ming-Fu JIANG

    IPC: H05K3/20 ,  H05K1/11

    Abstract: An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.

    Electronic element and electronic device comprising the same
    5.
    发明申请
    Electronic element and electronic device comprising the same 审中-公开

    公开(公告)号：US20190148320A1

    公开(公告)日：2019-05-16

    申请号：US16148253

    申请日：2018-10-01

    Applicant: InnoLux Corporation

    Inventor： Wei-Cheng CHU ,  Ming-Fu JIANG ,  Chia-Cheng LIU ,  Tong-Jung WANG

    IPC: H01L23/00 ,  H01L25/10 ,  H01L25/18

    Abstract: A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 μm and less than or equal to 14 μm. In addition, the disclosure further provides an electronic device including the first electronic element.

    ELECTRONIC DEVICE
    7.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240055419A1

    公开(公告)日：2024-02-15

    申请号：US18493941

    申请日：2023-10-25

    Applicant: InnoLux Corporation

    Inventor： Wei-Cheng CHU ,  Ming-Fu JIANG ,  Chia-Cheng LIU ,  Chih-Yuan LEE

    IPC: H01L25/16 ,  H01L33/58 ,  H01L25/075

    CPC classification number: H01L25/167 ,  H01L33/58 ,  H01L25/0753 ,  H01L33/62

    Abstract: An electronic device is provided. The electronic device includes a substrate, a plurality of diodes, at least one transistor, a chip, a conductive layer and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The plurality of diodes are disposed on the first surface of the substrate. The at least one transistor is disposed on the first surface of the substrate and electrically connected to at least one of the plurality of diodes. The chip is disposed on the second surface of the substrate and electrically connected to the at least one transistor. The conductive layer is disposed between the substrate and the chip. The protection layer is disposed between the conductive layer and the chip. Moreover, the protection layer has an opening and through which the chip is electrically connected to the conductive layer.

    ELECTRONIC DEVICE
    8.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20230037560A1

    公开(公告)日：2023-02-09

    申请号：US17968537

    申请日：2022-10-18

    Applicant: InnoLux Corporation

    Inventor： Wei-Cheng CHU ,  Chia-Cheng LIU ,  Ming-Fu JIANG

    IPC: H05K3/20 ,  H05K1/11

    Abstract: A flexible circuit structure includes: a flexible substrate having a surface; a plurality of first pads disposed on the surface; and an insulating layer disposed on the surface and between two adjacent first pads of the plurality of first pads, wherein the insulating layer has a first maximum height in a normal direction of the surface, one of the plurality of first pads has a second maximum height in the normal direction of the surface, and the first maximum height is less than or equal to the second maximum height.

    DISPLAY DEVICE
    9.
    发明申请
    DISPLAY DEVICE 有权

    公开(公告)号：US20220293578A1

    公开(公告)日：2022-09-15

    申请号：US17827944

    申请日：2022-05-30

    Applicant: InnoLux Corporation

    Inventor： Wei-Cheng CHU ,  Ming-Fu JIANG ,  Chia-Cheng LIU ,  Chih-Yuan LEE

    IPC: H01L25/16 ,  H01L33/58 ,  H01L25/075

    Abstract: A device includes a substrate having a first surface and a second surface opposite to the first surface; a thin-film transistor array disposed on the first surface, including a plurality of transistors; a plurality of diodes disposed on the thin-film transistor array; a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes; a driver unit disposed on the second surface of the substrate; a patterned conductive layer disposed between the substrate and the driver unit; a protection layer disposed on the patterned conductive layer, wherein the protection layer has an opening that exposes the patterned conductive layer; and a conductive material disposed in the opening.

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