公开(公告)号：US20210410328A1

公开(公告)日：2021-12-30

申请号：US17473896

申请日：2021-09-13

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a cold plate having fluidic channels within the cold plate. The fluidic channels have protective material thereon such that when liquid coolant flows through the fluidic channels the protective material is between the liquid coolant and the cold plate's material, wherein, the protective material is to prevent reaction between the liquid coolant and the cold plate's material.

公开(公告)号：US20220117079A1

公开(公告)日：2022-04-14

申请号：US17555250

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Jeffory L. SMALLEY ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.

公开(公告)号：US20210410329A1

公开(公告)日：2021-12-30

申请号：US17475026

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Mengqi LIU ,  Phil GENG ,  Ralph V. MIELE ,  Sandeep AHUJA ,  David SHIA

IPC: H05K7/20 ,  H01L23/367

Abstract: An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

公开(公告)号：US20210410320A1

公开(公告)日：2021-12-30

申请号：US17473870

申请日：2021-09-13

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA

IPC: H05K7/20

Abstract: A method of operating an immersion cooling system is described. The method includes operating one or more electronic components that are immersed in a liquid coolant. The operating of the one or more electronic components causes the liquid coolant to boil. The method includes condensing vapor from the boiling liquid coolant in an ambient region of a chamber. The method includes drawing gas from the ambient region of the chamber to reduce a pressure of the gas within the ambient region of the chamber. The reduction of the pressure of the gas is to reduce a boiling point of the liquid coolant. The reduction of the boiling point of the liquid coolant is to increase the cooling capacity of the immersion cooling system.

公开(公告)号：US20210219459A1

公开(公告)日：2021-07-15

申请号：US17195354

申请日：2021-03-08

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD

IPC: H05K7/20 ,  H01L23/427

Abstract: An apparatus is described. The apparatus includes a cold plate having columns of fluidic channels. The fluidic channels have a length such that coolant that flows through the fluidic channels will be composed less of vapor than of liquid and a mix of liquid and vapor over a rated power range of one or more semiconductor chips that are cooled by the cold plate.

公开(公告)号：US20250071938A1

公开(公告)日：2025-02-27

申请号：US18897955

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

IPC: H05K7/20

Abstract: Examples described herein relate to a cold plate. An example apparatus includes a first layer with one or more channels to receive fluid. The example apparatus further includes a second layer that is more rigid than the first layer. The second layer is to be mounted to the first layer and separated from the first layer by a gasket to reduce corrosion of the second layer.

公开(公告)号：US20220174843A1

公开(公告)日：2022-06-02

申请号：US17676100

申请日：2022-02-18

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA ,  Sandeep AHUJA ,  Jeffory L. SMALLEY

IPC: H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

公开(公告)号：US20210378099A1

公开(公告)日：2021-12-02

申请号：US17381092

申请日：2021-07-20

Applicant: Intel Corporation

Inventor： Phil GENG ,  Timothy Glen HANNA ,  Xiaoning YE ,  Sandeep AHUJA ,  Jacob MCMILLIAN ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY

IPC: H05K1/18 ,  H01L23/367 ,  H01L23/40 ,  H05K1/02

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

公开(公告)号：US20230260870A1

公开(公告)日：2023-08-17

申请号：US18137987

申请日：2023-04-21

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC: H01L23/427 ,  B05B1/14 ,  G01R31/26

CPC classification number: H01L23/427 ,  B05B1/14 ,  G01R31/2642

Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20220210950A1

公开(公告)日：2022-06-30

申请号：US17697894

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA

IPC: H05K7/20 ,  H01L23/40

Abstract: A molded ceramic layer of a multilayer cooling assembly back plate is described. The molded ceramic layer has an opening on a side of the molded ceramic layer that is to face a back side of a circuit board. The opening is aligned with a location of a back side component on the back side of the circuit board.