公开(公告)号：US10056314B2

公开(公告)日：2018-08-21

申请号：US14736120

申请日：2015-06-10

Applicant: INTEL CORPORATION

Inventor： Randall D. Lowe, Jr. ,  Syadwad Jain ,  James C. Matayabas, Jr.

IPC: H01L23/373 ,  C08L83/04 ,  C09C3/12 ,  H01L23/367 ,  H01L23/42 ,  B32B5/16 ,  C08K3/22 ,  C08K3/08 ,  C08K3/28

CPC classification number: H01L23/3737 ,  B32B5/16 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2003/282 ,  C08L83/04 ,  C09C3/12 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  C08K3/28 ,  C08K3/10

Abstract: A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

公开(公告)号：US08900919B2

公开(公告)日：2014-12-02

申请号：US13801059

申请日：2013-03-13

Applicant: Intel Corporation

Inventor： Randall D. Lowe, Jr. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, Jr. ,  Arjun Krishnan ,  Hitesh Arora

IPC: H01L21/44 ,  H01L23/02 ,  H01L23/28 ,  C09D11/107

CPC classification number: H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

Abstract translation: 本文公开了在光引发剂存在下使用UV诱导的聚合方法将聚丙烯酸酯聚合物共价且不可分割地锚定到氧化物表面的方法。 通过该方法制备的方法和组合物可用作用于微电子封装的不可擦除的标记材料，以及用作焊料和密封剂屏障以防止液体在微电子封装的氧化物表面上的过度扩散。 在通过连接剂与丙烯酸酯反应性基团键合的作为第一结构域的氧化物反应性甲硅烷基的粘合促进剂的印刷和UV固化过程中，聚丙烯酸酯聚合物共价连接到氧化物表面。