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    Paste thermal interface materials
    3.
    发明授权
    Paste thermal interface materials 有权
    粘贴热界面材料

    公开(公告)号：US08896110B2

    公开(公告)日：2014-11-25

    申请号：US13801882

    申请日：2013-03-13

    Applicant: Intel Corporation

    Inventor： Wei Hu ,  Zhizhong Tang ,  Syadwad Jain ,  Rajen S. Sidhu

    IPC: H01L23/02 ,  H01L23/373

    CPC classification number: H01L23/3736 ,  H01L23/42 ,  H01L24/33 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/01322 ,  H01L2924/16251 ,  H01L2924/00

    Abstract: Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an IC package includes an IC component, a heat spreader, and a paste TIM disposed between the die and the heat spreader. The paste TIM may include particles of a metal material distributed through a matrix material, and may have a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例描述了用于糊状热界面材料（TIM）的技术和配置及其在集成电路（IC）封装中的应用。 在一些实施例中，IC封装包括设置在管芯和散热器之间的IC部件，散热器和粘合剂TIM。 糊料TIM可以包括通过基质材料分布的金属材料的颗粒，并且在固化后可以具有在约20微米和约100微米之间的粘合线厚度。 可以描述和/或要求保护其他实施例。

    Molded heat spreaders
    4.
    发明授权
    Molded heat spreaders 有权
    成型散热器

    公开(公告)号：US08866290B2

    公开(公告)日：2014-10-21

    申请号：US13836407

    申请日：2013-03-15

    Applicant: Intel Corporation

    Inventor： Zhizhong Tang ,  Syadwad Jain ,  Paul R. Start

    IPC: H01L23/367 ,  B29C39/10 ,  F28F3/00

    CPC classification number: H01L23/367 ,  B29C39/10 ,  H01L21/4882 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311

    Abstract: Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例描述了用于模制散热器的技术和配置。 在一些实施例中，散热器包括具有第一面和第一侧的第一插入件，第一面被定位成形成第一腔体的底面，第二插入件具有第二面和第二面，第二面 定位成形成第二腔的底表面。 第二腔可以具有与第一腔的深度不同的深度。 散热器还可以包括设置在第一和第二插入件之间并与第一侧和第二侧耦合的成型材料，模制材料形成第一空腔的侧壁的至少一部分和至少一部分 第二腔的侧壁。 可以描述和/或要求保护其他实施例。

    Heat spreaders with interlocked inserts
    7.
    发明授权
    Heat spreaders with interlocked inserts 有权

    公开(公告)号：US10969840B2

    公开(公告)日：2021-04-06

    申请号：US15768915

    申请日：2015-11-16

    Applicant: Intel Corporation

    Inventor： Aravindha R. Antoniswamy ,  Syadwad Jain ,  Zhizhong Tang ,  Wei Hu

    IPC: G06F1/20 ,  H01L21/48 ,  H01L23/40 ,  H01L23/373 ,  H01L23/367 ,  H01L23/36

    Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.

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