公开(公告)号：US20150166804A1

公开(公告)日：2015-06-18

申请号：US14556994

申请日：2014-12-01

申请人： Intel Corporation

发明人： Randall D. Lowe, JR. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, JR. ,  Arjun Krishnan ,  Hitesh Arora

IPC分类号： C09D11/107 ,  H01L21/56 ,  H01L23/544 ,  H01L23/29

CPC分类号： H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

摘要翻译： 本文公开了在光引发剂存在下使用UV诱导的聚合方法将聚丙烯酸酯聚合物共价且不可分割地锚定到氧化物表面的方法。 通过该方法制备的方法和组合物可用作用于微电子封装的不可擦除的标记材料，以及用作焊料和密封剂屏障以防止液体在微电子封装的氧化物表面上的过度扩散。 在通过连接剂与丙烯酸酯反应性基团键合的作为第一结构域的氧化物反应性甲硅烷基的粘合促进剂的印刷和UV固化过程中，聚丙烯酸酯聚合物共价连接到氧化物表面。

公开(公告)号：US20160343591A1

公开(公告)日：2016-11-24

申请号：US15225678

申请日：2016-08-01

申请人： INTEL CORPORATION

发明人： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen-Givoni ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/29

摘要： Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于具有以通常随机分布图案排列的填充颗粒的底部填充层的集成电路（IC）封装的技术和配置。 在一些实施例中，通过对IC封装组件的一个或多个部件上的静电电荷，通过对填料进行表面处理以减少填充剂电荷，可以通过施加电力来抵抗填料颗粒的大致随机分布图案 通过使用相对较低的最大填充剂粒度的底部填充材料和/或通过在相对低的温度下快速固化底部填充层，使底部填充材料的填料颗粒在与重力方向相反的方向上。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09640415B2

公开(公告)日：2017-05-02

申请号：US14556994

申请日：2014-12-01

申请人： Intel Corporation

发明人： Randall D Lowe, Jr. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, Jr. ,  Arjun Krishnan ,  Hitesh Arora

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/544 ,  C09D11/101 ,  C09D11/20

CPC分类号： H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

公开(公告)号：US09431274B2

公开(公告)日：2016-08-30

申请号：US13722886

申请日：2012-12-20

申请人： Intel Corporation

发明人： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

IPC分类号： H01L21/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L24/09 ,  H01L24/17 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于具有以通常随机分布图案排列的填充颗粒的底部填充层的集成电路（IC）封装的技术和配置。 在一些实施例中，通过对IC封装组件的一个或多个部件上的静电电荷，通过对填料进行表面处理以减少填充剂电荷，可以通过施加电力来抵抗填料颗粒的大致随机分布图案 通过使用相对较低的最大填充剂粒度的底部填充材料和/或通过在相对低的温度下快速固化底部填充层，使底部填充材料的填料颗粒在与重力方向相反的方向上。 可以描述和/或要求保护其他实施例。

公开(公告)号：US08900919B2

公开(公告)日：2014-12-02

申请号：US13801059

申请日：2013-03-13

申请人： Intel Corporation

发明人： Randall D. Lowe, Jr. ,  Suriyakala Suriya Ramalingam ,  Nisha Ananthakrishnan ,  James C. Matayabas, Jr. ,  Arjun Krishnan ,  Hitesh Arora

IPC分类号： H01L21/44 ,  H01L23/02 ,  H01L23/28 ,  C09D11/107

CPC分类号： H01L21/56 ,  C09D11/101 ,  C09D11/20 ,  H01L23/296 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.

摘要翻译： 本文公开了在光引发剂存在下使用UV诱导的聚合方法将聚丙烯酸酯聚合物共价且不可分割地锚定到氧化物表面的方法。 通过该方法制备的方法和组合物可用作用于微电子封装的不可擦除的标记材料，以及用作焊料和密封剂屏障以防止液体在微电子封装的氧化物表面上的过度扩散。 在通过连接剂与丙烯酸酯反应性基团键合的作为第一结构域的氧化物反应性甲硅烷基的粘合促进剂的印刷和UV固化过程中，聚丙烯酸酯聚合物共价连接到氧化物表面。