Abstract:
Described is an apparatus which comprises: a first capacitor coupled to a first input pad; a second capacitor coupled to second input pad; a first resistor coupled to the second capacitor; a third capacitor coupled in series with the first resistor; a second resistor coupled in series with the third capacitor and also coupled to the first capacitor; and a differential amplifier coupled to the first and second capacitors and to the first and second resistors.
Abstract:
Described is an apparatus which comprises: an amplifier; and a passive continuous-time linear equalizer integrated with a baseline wander (BLW) corrector, wherein the integrated equalizer and BLW corrector is coupled to the amplifier.
Abstract:
Techniques for embedded high speed serial interface methods are described herein. The techniques provide an apparatus for link equalization including an equalization control module to determine at least a first coefficient setting and a second coefficient setting at a remote transmitter based on an algorithm. The apparatus also includes a receiver margining module to determine a first margin value to be associated with the first coefficient setting and a second margin value to be associated with the second coefficient setting. The receiver margining module is to further determine if at least the first margin value is higher than the second margin value.
Abstract:
Described is an apparatus which comprises: an amplifier; and a passive continuous-time linear equalizer integrated with a baseline wander (BLW) corrector, wherein the integrated equalizer and BLW corrector is coupled to the amplifier.
Abstract:
A first state of an interconnect protocol is entered. A particular signal is sent according to the protocol to a device over a link. During the first state, it is detected that a response to the particular signal is received in the first state. It is determined that the device supports a configuration mode outside the protocol based on the received response. The configuration mode is entered based on the response. One or more in-band configuration messages are sent within the configuration mode.
Abstract:
Techniques and mechanisms for exchanging single-ended communications with a protocol stack of an integrated circuit package. In an embodiment, an integrated circuit (IC) chip includes a protocol stack comprising a transaction layer which performs operations compatible with a Peripheral Component Interconnect Express™ (PCIe™) specification. Transaction layer packets, exchanged between the transaction layer and a link layer of the protocol stack, are compatible with a PCIe™ format. In another embodiment, a physical layer of the protocol stack is to couple the IC chip to another IC chip for an exchange of the transaction layer packets via single-ended communications. A packaged device includes both of the IC chips.
Abstract:
A first state of an interconnect protocol is entered. A particular signal is sent according to the protocol to a device over a link. During the first state, it is detected that a response to the particular signal is received in the first state. It is determined that the device supports a configuration mode outside the protocol based on the received response. The configuration mode is entered based on the response. One or more in-band configuration messages are sent within the configuration mode.