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    ADSORBING HEAT EXCHANGER
    2.
    发明申请
    ADSORBING HEAT EXCHANGER 有权
    吸附热交换器

    公开(公告)号：US20170030612A1

    公开(公告)日：2017-02-02

    申请号：US14813566

    申请日：2015-07-30

    Applicant: International Business Machines Corporation

    Inventor： Bruno Michel ,  Chin Lee Ong ,  Stephan Paredes ,  Patrick Ruch

    IPC: F25B15/02

    CPC classification number: F25B17/083 ,  F01K25/08 ,  F25B11/02 ,  F25B25/02 ,  F25B27/007 ,  F25B27/02 ,  F25B2400/14 ,  Y02A30/274 ,  Y02A30/278 ,  Y02B30/64

    Abstract: An apparatus and corresponding method for heat exchange. The heat exchange apparatus may include an adsorber device. The adsorber device is configured to draw heat from a first heat reservoir and transfer heat to a first heat sink. The heat exchange apparatus may include a heat exchanger fluidly connected to the adsorber device by the working fluid. The heat exchanger transfers heat to a second heat sink. The heat exchange apparatus may include an expansion device fluidly connected to the heat exchanger by the working fluid. The expansion device expands the working fluid, and exchanges heat with a second heat reservoir. The expansion device includes a turbine device for converting at least a part of an exergy of the working fluid during expansion into mechanical work. The heat exchange apparatus may include the adsorber device being fluidly connected to the expansion device by the working fluid.

    Abstract translation: 一种用于热交换的装置和相应的方法。 热交换装置可以包括吸附器装置。 吸附器装置构造成从第一储热器吸取热量并将热量传递到第一散热器。 热交换装置可以包括通过工作流体与吸附器装置流体连接的热交换器。 热交换器将热量传递到第二散热器。 热交换装置可以包括通过工作流体与热交换器流体连接的膨胀装置。 膨胀装置使工作流体膨胀，并与第二储热器交换热量。 膨胀装置包括涡轮机装置，用于在膨胀期间将工作流体的至少一部分的能量转换成机械作业。 热交换装置可以包括通过工作流体与膨胀装置流体连接的吸附器装置。

    CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW
    3.
    发明申请
    CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW 有权
    实现具有径向流动的两相冷却的芯片堆叠结构

    公开(公告)号：US20140071628A1

    公开(公告)日：2014-03-13

    申请号：US14015063

    申请日：2013-08-30

    Applicant: International Business Machines Corporation

    Inventor： Thomas J. Brunschwiler ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bruno Michael ,  Chin Lee Ong ,  Cornelia K. Tsang

    IPC: H05K7/20

    CPC classification number: H05K7/20381 ,  H01L23/367 ,  H01L23/427 ,  H01L23/49816 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/81141 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H05K7/20309 ,  H05K7/20327

    Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.

    Abstract translation: 用于实现两相冷却的封装结构包括设置在基板上的芯片堆叠和封装芯片堆叠的封装盖。 芯片堆叠包括多个联合芯片，通过芯片堆叠的中心区域形成的中心入口歧管和外围出口歧管。 中央输入歧管包括入口喷嘴，用于将液体冷却剂供入形成在相邻联结芯片之间的流动空腔中。 外围出口歧管从流动腔输出加热的液体和蒸气。 包装盖包括与中心入口歧管对准的中心冷却剂供给入口和外围液体蒸气出口，以输出从外围出口歧管排出的加热的液体和蒸气。 引导壁可以包括在流动腔中以引导液体和蒸气的流动，并且引导壁可以被布置成形成由中央入口歧管的不同入口喷嘴供给的径向流动通道。

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