公开(公告)号：US20170141078A1

公开(公告)日：2017-05-18

申请号：US15416447

申请日：2017-01-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Anson J. Call ,  Erwin B. Cohen ,  Dany Minier ,  Wolfgang Sauter ,  David B. Stone ,  Eric W. Tremble

IPC: H01L25/065 ,  H01L23/00 ,  H01L21/66 ,  H01L25/00

Abstract: A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads include split pad and a conventional pad; a first solder ball in direct physical contact with a contiguous bottom surface of the conventional pad and connected to a next level of packaging under the conventional pad, wherein the first solder ball has a first height; and a second solder ball in direct physical contact with first and second sections of the split pad separated by a gap, wherein the second solder ball has a second height that is sufficiently less than the first height such that the second solder ball is not connected to the next level of packaging.

公开(公告)号：US09633914B2

公开(公告)日：2017-04-25

申请号：US14854553

申请日：2015-09-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Anson J. Call ,  Erwin B. Cohen ,  Dany Minier ,  Wolfgang Sauter ,  David B. Stone ,  Eric W. Tremble

IPC: H01L21/66 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L25/0652 ,  H01L21/4853 ,  H01L22/14 ,  H01L22/20 ,  H01L22/32 ,  H01L23/49816 ,  H01L23/49844 ,  H01L23/5381 ,  H01L23/5383 ,  H01L24/05 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05551 ,  H01L2224/05572 ,  H01L2224/05578 ,  H01L2224/05655 ,  H01L2224/13006 ,  H01L2224/13028 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a first active component attached to a first group of the first pads and a second active component attached to a second group of the first pads; wherein at least one pad of the second pads is a split pad having a first section and a non-contiguous second section separated by a gap, the first section connected by a first wire of the multiple wires to a pad of the first group of first pads and the second section is connected by a second wire of the multiple wires to a pad of the second group of first pads.

公开(公告)号：US20170077000A1

公开(公告)日：2017-03-16

申请号：US14854553

申请日：2015-09-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Anson J. Call ,  Erwin B. Cohen ,  Dany Minier ,  Wolfgang Sauter ,  David B. Stone ,  Eric W. Tremble

IPC: H01L21/66 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L25/0652 ,  H01L21/4853 ,  H01L22/14 ,  H01L22/20 ,  H01L22/32 ,  H01L23/49816 ,  H01L23/49844 ,  H01L23/5381 ,  H01L23/5383 ,  H01L24/05 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05551 ,  H01L2224/05572 ,  H01L2224/05578 ,  H01L2224/05655 ,  H01L2224/13006 ,  H01L2224/13028 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A multi-chip module and method of fabricating a multi-chip module. The multi-chip module includes: a substrate having a top surface and a bottom surface and containing multiple wiring layers, first pads on the top surface of the substrate and second pads on the bottom surface of the substrate; a first active component attached to a first group of the first pads and a second active component attached to a second group of the first pads; wherein at least one pad of the second pads is a split pad having a first section and a non-contiguous second section separated by a gap, the first section connected by a first wire of the multiple wires to a pad of the first group of first pads and the second section is connected by a second wire of the multiple wires to a pad of the second group of first pads.

Abstract translation: 一种制造多芯片模块的多芯片模块和方法。 所述多芯片模块包括：具有顶表面和底表面并且包含多个布线层的基板，所述基板的顶表面上的第一焊盘和所述基板的底表面上的第二焊盘; 连接到第一组第一焊盘的第一有源部件和附接到第二焊盘组的第二有源部件; 其中所述第二焊盘的至少一个焊盘是具有第一部分和由间隙隔开的不连续的第二部分的裂缝焊盘，所述第一部分通过所述多条焊丝的第一焊丝连接到所述第一焊接区域的焊盘 焊盘，第二部分通过多条导线的第二线连接到第二组第一焊盘的焊盘。

公开(公告)号：US10483233B2

公开(公告)日：2019-11-19

申请号：US15416447

申请日：2017-01-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Anson J. Call ,  Erwin B. Cohen ,  Dany Minier ,  Wolfgang Sauter ,  David B. Stone ,  Eric W. Tremble

IPC: H01L25/065 ,  H01L21/66 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00 ,  H01L23/538

Abstract: A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads include split pad and a conventional pad; a first solder ball in direct physical contact with a contiguous bottom surface of the conventional pad and connected to a next level of packaging under the conventional pad, wherein the first solder ball has a first height; and a second solder ball in direct physical contact with first and second sections of the split pad separated by a gap, wherein the second solder ball has a second height that is sufficiently less than the first height such that the second solder ball is not connected to the next level of packaging.