公开(公告)号：US20240097292A1

公开(公告)日：2024-03-21

申请号：US17932794

申请日：2022-09-16

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer ,  Matthew Doyle ,  Kyle Schoneck ,  Layne A. Berge ,  Matthew A. Walther ,  Thomas W. Liang ,  John R. Dangler ,  Jason J. Bjorgaard

IPC: H01M50/583 ,  H05K1/11

CPC classification number: H01M50/583 ,  H05K1/111 ,  H05K2201/10037 ,  H05K2201/10181

Abstract: A voltage source watchdog comprising a passive device is placed in series between a voltage source and a load. The passive device includes an electromigration (EM) joint of known materials that will create an electromigration void after a specified amount of current passes through the EM joint. After a known amount of current as passed through, a void is created and a voltage will no longer be sensed, thus providing a sure safety mode situation. When the voltage source is a battery, the battery life may be extended by selectively enabling voltage measurement operations for the proposed watchdog.

公开(公告)号：US11122682B2

公开(公告)日：2021-09-14

申请号：US15944898

申请日：2018-04-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  John R. Dangler ,  Mark K. Hoffmeyer ,  William L. Brodsky ,  William Santiago-Fernandez ,  David C. Long ,  Silvio Dragone ,  Michael J. Fisher ,  Arthur J. Higby

IPC: H05K1/18 ,  H05K1/02 ,  G01N27/04 ,  H05K5/00

Abstract: Tamper-respondent assemblies and fabrication methods are provided which utilize liquid crystal polymer layers in solid form. The tamper-respondent assemblies include a circuit board, and an enclosure assembly mounted to the circuit board to enclose one or more electronic components coupled to the circuit board within a secure volume. The assembly includes a tamper-respondent sensor that is a three-dimensional multilayer sensor structure, which includes multiple liquid crystal polymer layers, and at least one tamper-detect circuit. The at least one tamper-detect circuit includes one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers. Further, a monitor circuit is provided disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event.

公开(公告)号：US20210114126A1

公开(公告)日：2021-04-22

申请号：US16659764

申请日：2019-10-22

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer ,  Timothy P. Younger

IPC: B23K1/018 ,  H05K3/34 ,  B23K1/008

Abstract: Provided is a method for removing an electronic socket from a printed wiring board. The method comprises placing an embrittlement sheet over an electronic socket on a printed wiring board. The electronic socket is mounted to the printed wiring board using a plurality of hidden solder joints. The method further comprises causing the embrittlement sheet to melt. The melted embrittlement sheet wets the plurality of hidden solder joints. The electronic socket is removed from the printed wiring board by breaking the embrittled solder joints.

公开(公告)号：US10756009B1

公开(公告)日：2020-08-25

申请号：US16574523

申请日：2019-09-18

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer ,  Brian Beaman ,  Yuet-Ying Yu ,  Theron Lee Lewis

IPC: H01L23/498 ,  H01L21/48 ,  H01R12/58

Abstract: An interposer comprises a metal-plated via that spans the depth of a printed circuit board. The interposer also comprises a metal plug inserted into a first end of the metal-plated via. The metal plug is attached to the metal-plated via. The metal plug may take the form of a solid plug or a sintered via plug. The interposer also comprises a solder ball soldered to the metal plug.

公开(公告)号：US09913361B2

公开(公告)日：2018-03-06

申请号：US14989271

申请日：2016-01-06

Applicant: International Business Machines Corporation

Inventor： David Barron ,  Jason R. Eagle ,  Roger D. Hamilton ,  Mark K. Hoffmeyer ,  Christopher W. Mann ,  Matthew T. Richardson

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K5/00 ,  H01L23/40 ,  H01L23/473

CPC classification number: H05K1/0204 ,  H01L23/40 ,  H01L23/4006 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/30 ,  H05K5/0008 ,  H05K7/20409 ,  H05K2201/066 ,  H05K2201/10409

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

公开(公告)号：US09640934B2

公开(公告)日：2017-05-02

申请号：US15219321

申请日：2016-07-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Mark K. Hoffmeyer

IPC: H01R13/42 ,  H01R43/20 ,  H01R12/58

CPC classification number: H01R43/205 ,  H01R12/585

Abstract: An eye-of-needle (EON) compliant pin that includes a compliant segment including two opposing spring arms defining a substantially planar opening. The Eon compliant pin includes a twisted segment connected between a top portion of the compliant segment and a bottom portion of a length segment. The compliant segment, the length segment, and the twisted segment together form a substantially straight solid body. The twisted segment is twisted about a longitudinal axis of the substantially straight solid body such that the substantially planar opening of the compliant segment is rotated at an angle with respect to the length segment.

公开(公告)号：US20170093110A1

公开(公告)日：2017-03-30

申请号：US15219321

申请日：2016-07-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Mark K. Hoffmeyer

IPC: H01R43/20 ,  H01R12/58

CPC classification number: H01R43/205 ,  H01R12/585

Abstract: An eye-of-needle (EON) compliant pin that includes a compliant segment including two opposing spring arms defining a substantially planar opening. The Eon compliant pin includes a twisted segment connected between a top portion of the compliant segment and a bottom portion of a length segment. The compliant segment, the length segment, and the twisted segment together form a substantially straight solid body. The twisted segment is twisted about a longitudinal axis of the substantially straight solid body such that the substantially planar opening of the compliant segment is rotated at an angle with respect to the length segment.

公开(公告)号：US20230371221A1

公开(公告)日：2023-11-16

申请号：US18354957

申请日：2023-07-19

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer ,  Timothy P. Younger

IPC: H05K13/04 ,  B23K1/018

CPC classification number: H05K13/0486 ,  B23K1/018 ,  H05K2203/043

Abstract: Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking the embrittled lead.

公开(公告)号：US20220232746A1

公开(公告)日：2022-07-21

申请号：US17657775

申请日：2022-04-04

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer ,  Timothy P. Younger

IPC: H05K13/04 ,  B23K1/018

Abstract: Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking the embrittled lead.

公开(公告)号：US11310950B2

公开(公告)日：2022-04-19

申请号：US16659750

申请日：2019-10-22

Applicant: International Business Machines Corporation

Inventor： Mark K. Hoffmeyer ,  Timothy P. Younger

IPC: B23K1/00 ,  H05K13/04 ,  B23K1/018

Abstract: Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking the embrittled lead.