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公开(公告)号：US09601454B2
公开(公告)日：2017-03-21
申请号：US14850500
申请日：2015-09-10
Applicant: Invensas Corporation
Inventor： Zhijun Zhao , Roseann Alatorre
IPC: H01L21/44 , H01L23/00 , H01L23/31 , H01L23/498 , H01L25/10 , H01L21/56 , H01L23/538
CPC classification number: H01L24/43 , H01L21/56 , H01L21/565 , H01L23/3128 , H01L23/3135 , H01L23/49811 , H01L23/5389 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/73257 , H01L2224/78301 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/2075 , H01L2924/20754 , H01L2224/05599 , H01L2924/00012
Abstract: Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.
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Patent Agency Ranking
2.发明授权Method of making wire bond vias and microelectronic package having wire bond vias 有权制造引线键合通孔的方法和具有引线键合通孔的微电子封装公开(公告)号：US08940630B2
公开(公告)日：2015-01-27
申请号：US13757673
申请日：2013-02-01
Applicant: Invensas Corporation
Inventor： Philip Damberg , Zhijun Zhao , Ellis Chau
IPC: H01L21/00 , H01L21/44 , H01L21/768
CPC classification number: H01L23/4952 , H01L21/4853 , H01L23/49541 , H01L23/49811 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L25/105 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45644 , H01L2224/45664 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/48464 , H01L2224/49171 , H01L2224/73257 , H01L2224/78301 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00 , H01L2924/00012
Abstract: Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.
Abstract translation: 本文公开了形成这种微电子部件的微电子部件和方法。 微电子部件可以包括从衬底的接合表面延伸的线接合形式的多个导电通孔，例如在衬底的表面处的导电元件的表面。
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公开(公告)号：US20150380375A1
公开(公告)日：2015-12-31
申请号：US14850500
申请日：2015-09-10
Applicant: Invensas Corporation
Inventor： Zhijun Zhao , Roseann Alatorre
CPC classification number: H01L24/43 , H01L21/56 , H01L21/565 , H01L23/3128 , H01L23/3135 , H01L23/49811 , H01L23/5389 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/73257 , H01L2224/78301 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/2075 , H01L2924/20754 , H01L2224/05599 , H01L2924/00012
Abstract: Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.
Abstract translation: 本文公开了形成这种微电子部件的微电子部件和方法。 微电子部件可以包括从衬底的接合表面延伸的线接合形式的多个导电通孔，例如在衬底的表面处的导电元件的表面。
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公开(公告)号：US20140217619A1
公开(公告)日：2014-08-07
申请号：US13757677
申请日：2013-02-01
Applicant: INVENSAS CORPORATION
Inventor： Zhijun Zhao , Roseann Alatorre
CPC classification number: H01L24/43 , H01L21/56 , H01L21/565 , H01L23/3128 , H01L23/3135 , H01L23/49811 , H01L23/5389 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/73257 , H01L2224/78301 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/2075 , H01L2924/20754 , H01L2224/05599 , H01L2924/00012
Abstract: Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.
Abstract translation: 本文公开了形成这种微电子部件的微电子部件和方法。 微电子部件可以包括从衬底的接合表面延伸的线接合形式的多个导电通孔，例如在衬底的表面处的导电元件的表面。
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公开(公告)号：US09136254B2
公开(公告)日：2015-09-15
申请号：US13757677
申请日：2013-02-01
Applicant: Invensas Corporation
Inventor： Zhijun Zhao , Roseann Alatorre
IPC: H01L23/48 , H01L23/52 , H01L29/40 , H01L23/04 , H01L25/10 , H01L23/31 , H01L23/498 , H01L21/56 , H01L23/538 , H01L23/00
CPC classification number: H01L24/43 , H01L21/56 , H01L21/565 , H01L23/3128 , H01L23/3135 , H01L23/49811 , H01L23/5389 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/73257 , H01L2224/78301 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/2075 , H01L2924/20754 , H01L2224/05599 , H01L2924/00012
Abstract: Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.
Abstract translation: 本文公开了形成这种微电子部件的微电子部件和方法。 微电子部件可以包括从衬底的接合表面延伸的线接合形式的多个导电通孔，例如在衬底的表面处的导电元件的表面。
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6.发明申请METHOD OF MAKING WIRE BOND VIAS AND MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS 有权制造线束VIAS的方法和具有线束VIAS的微电子封装公开(公告)号：US20140220744A1
公开(公告)日：2014-08-07
申请号：US13757673
申请日：2013-02-01
Applicant: INVENSAS CORPORATION
Inventor： Philip Damberg , Zhijun Zhao , Ellis Chau
IPC: H01L21/768
CPC classification number: H01L23/4952 , H01L21/4853 , H01L23/49541 , H01L23/49811 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L25/105 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45644 , H01L2224/45664 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/48464 , H01L2224/49171 , H01L2224/73257 , H01L2224/78301 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00 , H01L2924/00012
Abstract: Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.
Abstract translation: 本文公开了形成这种微电子部件的微电子部件和方法。 微电子部件可以包括从衬底的接合表面延伸的线接合形式的多个导电通孔，例如在衬底的表面处的导电元件的表面。
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