公开(公告)号：US06350549B1

公开(公告)日：2002-02-26

申请号：US09375746

申请日：1999-08-17

申请人： Ikuo Sakurai ,  Meguru Kashida

发明人： Ikuo Sakurai ,  Meguru Kashida

IPC分类号： G03F900

CPC分类号： H01L21/67103 ,  G03F1/62 ,  H01L21/68757 ,  Y10T156/108

摘要： There is disclosed a jig for producing a pellicle comprising a support frame having an opening, and an adhesive layer provided at periphery of the opening, wherein the adhesive layer is composed of a polymer material having a glass transition temperature within a range of 0° C. to 300° C. The jig of the present invention can be repeatedly used without reforming the adhesive layer after use.

摘要翻译： 公开了一种用于制造防护薄膜的夹具，其包括具有开口的支撑框架和设置在开口周边的粘合剂层，其中粘合剂层由玻璃化转变温度在0℃范围内的聚合物材料 至300℃。本发明的夹具可以重复使用，而不会在使用后重整粘合剂层。

公开(公告)号：US07417078B2

公开(公告)日：2008-08-26

申请号：US10250685

申请日：2002-03-20

申请人： Hironao Fujiki ,  Kazuhiko Tomaru ,  Ikuo Sakurai ,  Akio Suzuki ,  Kunihiko Mita

发明人： Hironao Fujiki ,  Kazuhiko Tomaru ,  Ikuo Sakurai ,  Akio Suzuki ,  Kunihiko Mita

IPC分类号： G21F1/10 ,  C08K3/10 ,  C08K3/22 ,  C08L83/06 ,  H05K7/20

CPC分类号： H05K9/0083

摘要： An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

摘要翻译： 使用电磁波吸收导热组合物形成电磁波吸收散热物品，其放置在发热电子部件之间，发热电子部件在运转时发热，达到高于室温的温度，作为电磁波发生源 ，以及散热部件。 组合物在电子组件操作之前在室温下是非流体的，但是在电子部件的操作期间获得低粘度，在发热时软化或熔化，以使组合物的至少一个表面流化，使得组合物基本上 填充电子部件和散热部件之间的任何间隙。

公开(公告)号：US08754165B2

公开(公告)日：2014-06-17

申请号：US13084641

申请日：2011-04-12

申请人： Nobuaki Matsumoto ,  Ikuo Sakurai ,  Kunihiro Yamada ,  Masaya Ueno

发明人： Nobuaki Matsumoto ,  Ikuo Sakurai ,  Kunihiro Yamada ,  Masaya Ueno

IPC分类号： C08K3/22 ,  C08K3/08

CPC分类号： C08L83/04 ,  C08G77/18 ,  C08L83/00

摘要： A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.

摘要翻译： 提供一种导热性硅氧烷润滑脂组合物，其包含（A）在25℃下粘度为0.1-1,000Pa·s的三烷氧基甲硅烷基封端的有机聚硅氧烷，（B）特定有机聚硅氧烷，（C）导热填料， 和（D）缩合催化剂。 该组合物最初可以涂覆，然后在室温下用水分增加其粘度，而不是固化，使其保持柔软性，易于重新加工和防流挂，消除了对冷藏和热应用的需要， 避免任何不希望的粘度累积，易于制造，并具有良好的热传递。

公开(公告)号：US07667943B2

公开(公告)日：2010-02-23

申请号：US11790635

申请日：2007-04-26

申请人： Akio Nakano ,  Ryuichi Handa ,  Ikuo Sakurai

发明人： Akio Nakano ,  Ryuichi Handa ,  Ikuo Sakurai

IPC分类号： H01L21/683

CPC分类号： H01L21/6833 ,  B32B9/005 ,  B32B15/08 ,  B32B15/20 ,  B32B25/02 ,  B32B25/08 ,  B32B25/20 ,  B32B27/06 ,  B32B27/281 ,  B32B27/36 ,  B32B2264/102 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/54 ,  B32B2457/08 ,  B32B2457/14

摘要： An electrostatic chuck comprises an insulating layer with an electrode embedded therein and having a surface to come in contact with a workpiece to be held. Formed on the insulating layer surface is a silicone rubber layer which is filled with reinforcing silica, but free of another filler having an average particle size of at least 0.5 μm. The ESC allows for an intimate contact with a wafer and has an improved cooling capacity.

摘要翻译： 静电卡盘包括具有嵌入其中的电极的绝缘层，并且具有与待保持的工件接触的表面。 在绝缘层表面上形成硅橡胶层，其填充有增强二氧化硅，但不含平均粒度为至少0.5μm的另一种填料。 ESC允许与晶片紧密接触并具有改善的冷却能力。

公开(公告)号：US06869683B2

公开(公告)日：2005-03-22

申请号：US10135387

申请日：2002-05-01

申请人： Ikuo Sakurai ,  Hironao Fujiki

发明人： Ikuo Sakurai ,  Hironao Fujiki

IPC分类号： C08K3/22 ,  B32B25/20 ,  C08L83/04 ,  H01Q17/00 ,  H05K9/00 ,  B32B9/04

CPC分类号： H05K9/0088 ,  B32B25/20 ,  H01Q17/00 ,  H01Q17/008 ,  Y10T428/31663

摘要： An electromagnetic wave (EM) absorber is constructed by integrally laminating an EM-absorbing layer having an EM-absorbing filler dispersed in a silicone resin on at least one surface of an EM-reflecting layer having an electrically conductive filler dispersed in a silicone resin. It has satisfactory EM-absorbing and shielding abilities and is workable, flexible, weather resistant and heat resistant due to the nature of the silicone resin itself. The use of the silicone resin in both the EM-absorbing and reflecting layers ensures that a firm bond is established between the layers. In a preferred embodiment wherein a heat conductive filler is blended, the absorber has a satisfactory heat transfer ability as well.

摘要翻译： 电磁波（EM）吸收体通过在具有分散在有机硅树脂中的导电填料的EM反射层的至少一个表面上整体地层叠具有分散在有机硅树脂中的吸收EM的吸收填料的EM吸收层。 它具有令人满意的电磁吸收和屏蔽能力，由于硅树脂本身的性质，它具有可操作性，柔韧性，耐候性和耐热性。 在吸收和反射层中使用有机硅树脂确保了层之间建立牢固的粘结。 在其中掺入导热填料的优选实施方案中，吸收体也具有令人满意的传热能力。

公开(公告)号：US20120012153A1

公开(公告)日：2012-01-19

申请号：US13255848

申请日：2010-03-05

申请人： Syuichi Azechi ,  Ikuo Sakurai ,  Masakatsu Hotta ,  Takeshi Hashimoto

发明人： Syuichi Azechi ,  Ikuo Sakurai ,  Masakatsu Hotta ,  Takeshi Hashimoto

IPC分类号： H01L31/05 ,  H05K1/09 ,  H01L31/18

CPC分类号： H01L31/02021 ,  C08G77/12 ,  C08G77/20 ,  C08K3/04 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K5/0025 ,  C09J183/04 ,  H01B1/22 ,  H01L31/0512 ,  Y02E10/50 ,  C08L83/04

摘要： Disclosed is a connection sheet for a solar battery cell electrode, which is a polymer sheet for use in the connection between an electrode for extracting an electric power from a solar battery cell and a wiring member through an electrically conductive adhesive material by heating and pressurizing, and which is intercalated between a heating/pressurizing member and the wiring member upon use.

摘要翻译： 公开了一种太阳能电池单元电极的连接片，其是用于通过加热和加压通过导电粘合剂材料从太阳能电池单元提取电力的电极和布线构件之间的连接中使用的聚合物片， 并且在使用时嵌入加热/加压构件和布线构件之间。

公开(公告)号：US07030172B2

公开(公告)日：2006-04-18

申请号：US10443806

申请日：2003-05-23

申请人： Ikuo Sakurai

发明人： Ikuo Sakurai

IPC分类号： G21F1/10

CPC分类号： C09D5/32 ,  C04B26/32 ,  C04B2111/00258 ,  C04B2111/00422 ,  C08K9/04 ,  C09D5/032 ,  C09D7/62 ,  H01Q17/00 ,  Y10T428/2991 ,  C04B14/34 ,  C04B20/1055 ,  C04B14/30 ,  C04B14/32

摘要： An electromagnetic wave-absorbing composition is obtained by dispersing in a base polymer a magnetic powder coated with electrically insulating inorganic fines and optionally, a heat conductive powder. The composition has a high breakdown voltage, and can be applied to any adequate site within electronic equipment without a need to pay substantial attention to short-circuits.

公开(公告)号：US07940512B2

公开(公告)日：2011-05-10

申请号：US12108650

申请日：2008-04-24

申请人： Ryuichi Handa ,  Akio Nakano ,  Ikuo Sakurai

发明人： Ryuichi Handa ,  Akio Nakano ,  Ikuo Sakurai

IPC分类号： H01T23/00

CPC分类号： H01L21/6831 ,  H02N13/00

摘要： This invention relates to a suitable electrostatic chuck to hold a substrate during the manufacture of a semiconductor integrated circuit having excellent cooling performance and insulation performance, and a low level of particulate generation, which is comprised of an electrostatic chuck, comprising a metal substrate, a first insulating layer of silicone rubber formed directly or via an adhesive layer on the metal substrate and having a thermal conductivity of 0.5 W/mK or more, an electrically conducting pattern formed directly or via an adhesive layer on this first insulating layer, a second insulating layer of an insulating polyimide film formed directly or via an adhesive layer on this electrically conducting pattern, and a third insulating layer formed directly or via an adhesive layer on this second insulating layer, wherein this third insulating layer is a silicone rubber containing reinforcing silica, this layer not containing any thermally conductive filler having an average particle size of 0.5 μm or more.

摘要翻译： 本发明涉及一种在制造具有优异的冷却性能和绝缘性能的半导体集成电路以及由静电卡盘组成的低水平颗粒产生时制成基板的合适的静电卡盘，该静电卡盘包括金属基板， 第一绝缘层硅橡胶直接或通过金属基底上的粘合剂层形成并且具有0.5W / mK以上的导热率，直接或经由该第一绝缘层上的粘合剂层形成的导电图案，第二绝缘层 直接或通过该导电图案上的粘合剂层形成的绝缘聚酰亚胺膜的层，以及直接形成或经由该第二绝缘层上的粘合剂层形成的第三绝缘层，其中该第三绝缘层是含有增强二氧化硅的硅橡胶， 该层不含任何具有平均值的导热填料 粒径为0.5μm以上。

公开(公告)号：US20080266746A1

公开(公告)日：2008-10-30

申请号：US12108650

申请日：2008-04-24

申请人： Ryuichi Handa ,  Akio Nakano ,  Ikuo Sakurai

发明人： Ryuichi Handa ,  Akio Nakano ,  Ikuo Sakurai

IPC分类号： H01T23/00

CPC分类号： H01L21/6831 ,  H02N13/00

摘要： This invention relates to a suitable electrostatic chuck to hold a substrate during the manufacture of a semiconductor integrated circuit having excellent cooling performance and insulation performance, and a low level of particulate generation, which is comprised of an electrostatic chuck, comprising a metal substrate, a first insulating layer of silicone rubber formed directly or via an adhesive layer on the metal substrate and having a thermal conductivity of 0.5 W/mK or more, an electrically conducting pattern formed directly or via an adhesive layer on this first insulating layer, a second insulating layer of an insulating polyimide film formed directly or via an adhesive layer on this electrically conducting pattern, and a third insulating layer formed directly or via an adhesive layer on this second insulating layer, wherein this third insulating layer is a silicone rubber containing reinforcing silica, this layer not containing any thermally conductive filler having an average particle size of 0.5 μm or more.

摘要翻译： 本发明涉及一种在制造具有优异的冷却性能和绝缘性能的半导体集成电路以及由静电卡盘组成的低水平颗粒产生时制成基板的合适的静电卡盘，该静电卡盘包括金属基板， 第一绝缘层硅橡胶直接或通过金属基底上的粘合剂层形成并且具有0.5W / mK以上的导热率，直接或经由该第一绝缘层上的粘合剂层形成的导电图案，第二绝缘层 直接或通过该导电图案上的粘合剂层形成的绝缘聚酰亚胺膜的层，以及直接形成或经由该第二绝缘层上的粘合剂层形成的第三绝缘层，其中该第三绝缘层是含有增强二氧化硅的硅橡胶， 该层不含任何具有平均值的导热填料 粒径为0.5μm以上。

公开(公告)号：US20080057325A1

公开(公告)日：2008-03-06

申请号：US11846862

申请日：2007-08-29

申请人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

发明人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

IPC分类号： C08G77/12

CPC分类号： C09J183/04 ,  C08G77/045 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K5/56 ,  C08L83/00 ,  Y10T428/31663

摘要： Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.

摘要翻译： 提供一种导热性有机硅组合物，其包含：（A）100体积份的具有特定结构的有机聚硅氧烷，（B）0.1〜50体积份作为润湿剂的有机硅化合物，并且含有三有机氧基甲硅烷基键合 通过可以被支链的亚烷基连接到一个末端，（C）100-2,500体积份的导热填料，和（D）有效量的固化剂。 还提供了通过固化该组合物获得的导热硅氧烷固化产物。 即使填充有大量导热填料以提供优异的导热性，导热硅氧烷组合物的粘度或塑性的增加也最小，并保持良好的操作性和成型性。 即使填充有大量的导热性填料，导热性硅酮固化物也具有优异的柔软性。 由发热电子部件产生的热可以通过将固化物夹在发热电子部件和散热部件之间而散发到散热部件中。