Monolithic RF circuit and method of fabricating the same
    2.
    发明申请
    Monolithic RF circuit and method of fabricating the same 审中-公开
    单片RF电路及其制造方法

    公开(公告)号:US20070188049A1

    公开(公告)日:2007-08-16

    申请号:US11649824

    申请日:2007-01-05

    IPC分类号: H01L41/00

    CPC分类号: H03H3/02 H03H9/0542 H03H9/173

    摘要: A monolithic radio frequency (RF) circuit and a method of fabricating the monolithic RF circuit are provided. The monolithic RF circuit includes: a base substrate; a filter part including first and second support layers formed on the base substrate, a first air gap formed between the first and second support layers, a first electrode formed on the second support layer and the first air gap, a first piezoelectric layer formed on the first support layer and the first electrode, and a second electrode formed on the first piezoelectric layer; and a switch part including a third support layer adjacent to the second support layer, a second air gap formed between the second and third support layers, a first switch electrode formed on the second air gap and the third support layer, and a second piezoelectric layer formed on the first switch electrode.

    摘要翻译: 提供单片射频(RF)电路和制造单片RF电路的方法。 单片RF电路包括:基底; 过滤器部分,包括形成在基底基板上的第一和第二支撑层,形成在第一和第二支撑层之间的第一气隙,形成在第二支撑层和第一气隙上的第一电极,形成在第一和第二支撑层上的第一压电层 第一支撑层和第一电极,以及形成在第一压电层上的第二电极; 以及开关部分,包括与第二支撑层相邻的第三支撑层,形成在第二和第三支撑层之间的第二气隙,形成在第二气隙和第三支撑层上的第一开关电极和第二压电层 形成在第一开关电极上。

    MEMS switch and method for manufacturing the same
    5.
    发明授权
    MEMS switch and method for manufacturing the same 失效
    MEMS开关及其制造方法

    公开(公告)号:US07619289B2

    公开(公告)日:2009-11-17

    申请号:US11472312

    申请日:2006-06-22

    IPC分类号: H01L29/78

    摘要: A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.

    摘要翻译: MEMS开关包括在下基板的上表面上具有信号线的下基板; 在其上具有空腔的上基板,与下基板的上表面隔开一段距离,并且在上基板的下表面上具有膜层; 形成在膜层上的上基板的空腔中的双金属层; 形成在所述膜层的下表面上的加热层; 以及形成在所述加热层的下表面上的接触构件。 接触构件可以与信号线接触或分离。 制造MEMS开关的方法包括制备上基板和下基板并将其组合,使得具有信号线的表面面向具有接触构件的表面,并且上下基板分开一定距离。

    MEMS switch and method for manufacturing the same
    7.
    发明申请
    MEMS switch and method for manufacturing the same 失效
    MEMS开关及其制造方法

    公开(公告)号:US20070012654A1

    公开(公告)日:2007-01-18

    申请号:US11472312

    申请日:2006-06-22

    IPC分类号: C23F1/00 H01B13/00

    摘要: A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.

    摘要翻译: MEMS开关包括在下基板的上表面上具有信号线的下基板; 在其上具有空腔的上基板,与下基板的上表面隔开一段距离,并且在上基板的下表面上具有膜层; 形成在膜层上的上基板的空腔中的双金属层; 形成在所述膜层的下表面上的加热层; 以及形成在所述加热层的下表面上的接触构件。 接触构件可以与信号线接触或分离。 制造MEMS开关的方法包括制备上基板和下基板并将其组合,使得具有信号线的表面面向具有接触构件的表面,并且上下基板分开一定距离。