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    Substrate structure and device employing the same
    3.
    发明授权
    Substrate structure and device employing the same 有权
    基板结构及其使用方法

    公开(公告)号：US09373817B2

    公开(公告)日：2016-06-21

    申请号：US14737882

    申请日：2015-06-12

    Applicant: Industrial Technology Research Institute

    Inventor： Hsiao-Fen Wei ,  Kun-Lin Chuang

    IPC: H01L23/48 ,  H01L51/52

    CPC classification number: H01L51/5253

    Abstract: A substrate structure and a device employing the same are disclosed. An embodiment of the disclosure provides the substrate structure including a flexible substrate and a first barrier layer. The flexible substrate has a top surface, a side surface, and a bottom surface. The first barrier layer is disposed on and contacting the top surface of the flexible substrate, wherein the first barrier layer consists of Si, N, and Z atoms, wherein the Z atom is selected from a group of H, C, and O atoms, and wherein Si of the first barrier layer is present in an amount from 35 to 42 atom %, N of the first barrier layer is present in an amount from 10 to 52 atom %, and Z of the first barrier layer is present in an amount from 6 to 48 atom %.

    Abstract translation: 公开了一种基板结构和使用其的器件。 本公开的实施例提供了包括柔性衬底和第一阻挡层的衬底结构。 柔性基板具有顶表面，侧表面和底表面。 第一阻挡层设置在柔性基板的顶表面上并与其接触，其中第一阻挡层由Si，N和Z原子组成，其中Z原子选自H，C和O原子， 并且其中第一阻挡层的Si以35至42原子％的量存在，第一阻挡层的N以10至52原子％的量存在，并且第一阻挡层的Z以存在的量 6〜48原子％。

    PACKAGE OF ELECTRONIC DEVICE AND DISPLAY PANEL
    9.
    发明申请
    PACKAGE OF ELECTRONIC DEVICE AND DISPLAY PANEL 审中-公开

    公开(公告)号：US20190058158A1

    公开(公告)日：2019-02-21

    申请号：US16104956

    申请日：2018-08-20

    Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

    Inventor： Hsiao-Fen Wei ,  Kun-Lin Chuang ,  Yen-Ching Kuo

    IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

    Abstract: A package of electronic device including a substrate, at least one electronic device and an encapsulation layer is provided. The substrate has a device area and a light transmitting area located outside the device area. The at least one electronic device is disposed on the device area of the substrate. The encapsulation layer is disposed on the substrate and covers the at least one electronic device. The encapsulation layer extends continuously from the device area to the light transmitting area, and a nitrogen content of the encapsulation layer on the device area is higher than a nitrogen content of the encapsulation layer on the light transmitting area. A display panel is also provided.

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