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公开(公告)号：US20180130760A1
公开(公告)日：2018-05-10
申请号：US15394814
申请日：2016-12-30
Applicant: Industrial Technology Research Institute
Inventor： Chao-Jen Wang , Chih-Chia Chang , Jia-Chong Ho
IPC: H01L23/00 , H01L23/31 , H01L23/522 , H01L21/56 , H01L21/027 , H01L21/683 , H01L21/3105 , H01L23/367
CPC classification number: H01L24/20 , H01L21/027 , H01L21/3105 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3135 , H01L23/367 , H01L23/49811 , H01L23/5226 , H01L23/5384 , H01L23/5389 , H01L23/562 , H01L24/19 , H01L2221/68359 , H01L2224/16227 , H01L2224/211 , H01L2224/81005 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/15311 , H01L2924/18161 , H01L2924/3511 , H01L2224/81
Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.
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公开(公告)号：US20170208682A1
公开(公告)日：2017-07-20
申请号：US15394831
申请日：2016-12-30
Applicant: Industrial Technology Research Institute
Inventor： Chao-Jen Wang , Jia-Chong Ho
CPC classification number: H05K1/0281 , B29C37/0082 , B29C73/02 , B29K2995/0092 , H05K1/0269 , H05K3/22 , H05K3/28 , H05K13/08 , H05K2201/0104 , H05K2203/16
Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.
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公开(公告)号：US20180107313A1
公开(公告)日：2018-04-19
申请号：US15591120
申请日：2017-05-10
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Kun-Lin Chuang , Chao-Jen Wang
CPC classification number: G06F3/0412 , B32B7/12 , B32B37/025 , B32B2255/26 , B32B2363/00 , B32B2457/208 , G06F1/1652 , G06F3/044 , G06F2203/04102 , G06F2203/04103
Abstract: According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10−2 g/m2-day.
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公开(公告)号：US10444912B2
公开(公告)日：2019-10-15
申请号：US15394840
申请日：2016-12-30
Applicant: Industrial Technology Research Institute
Inventor： Sheng-Po Wang , Chih-Chia Chang , Chao-Jen Wang
IPC: G06F3/044 , G06F3/041 , G06F3/045 , G06F3/0338
Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.
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公开(公告)号：US20170332477A1
公开(公告)日：2017-11-16
申请号：US15229095
申请日：2016-08-04
Applicant: Industrial Technology Research Institute
Inventor： Chao-Jen Wang , Chih-Chia Chang , Chiung-Hsun Hsieh
Abstract: According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.
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Patent Agency Ranking
公开(公告)号：US10275062B2
公开(公告)日：2019-04-30
申请号：US15591120
申请日：2017-05-10
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Kun-Lin Chuang , Chao-Jen Wang
Abstract: According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10−2 g/m2-day.
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公开(公告)号：US10090272B2
公开(公告)日：2018-10-02
申请号：US15394814
申请日：2016-12-30
Applicant: Industrial Technology Research Institute
Inventor： Chao-Jen Wang , Chih-Chia Chang , Jia-Chong Ho
IPC: H01L23/00 , H01L23/31 , H01L23/522 , H01L21/56 , H01L21/027 , H01L21/683 , H01L21/3105 , H01L23/367
Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.
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公开(公告)号：US20180188843A1
公开(公告)日：2018-07-05
申请号：US15394840
申请日：2016-12-30
Applicant: Industrial Technology Research Institute
Inventor： Sheng-Po Wang , Chih-Chia Chang , Chao-Jen Wang
CPC classification number: G06F3/044 , G06F3/0338 , G06F3/0414 , G06F3/045 , G06F2203/04102
Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.
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公开(公告)号：US09860976B1
公开(公告)日：2018-01-02
申请号：US15394827
申请日：2016-12-30
Applicant: Industrial Technology Research Institute
Inventor： Sheng-Po Wang , Chih-Chia Chang , Chao-Jen Wang , Jui-Chang Chuang
CPC classification number: H05K1/0283 , H05K2201/09063 , H05K2201/09081 , H05K2201/09254 , H05K2201/09263 , H05K2201/10106 , H05K2201/10128 , H05K2201/10151
Abstract: According to an embodiment of the present disclosure, a flexible electronic device may include a unit structure including a substrate unit and a wiring structure. The substrate unit has slits to divide connecting portions between respective ends of two slits and wiring regions arranged outwardly from at least one unit center sequentially. The wiring structure is disposed on the substrate unit and includes wirings distributed in the wiring regions. Each wiring includes circumferential portions and radial portions connected between the circumferential portions. The radial portion connected to a first end of each circumferential portion extends toward the unit center from the first end. Each circumferential portion includes a first section and a second section. The first section is closer to the first end and has greater anti-stretching ability than the second section.
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公开(公告)号：US09763322B2
公开(公告)日：2017-09-12
申请号：US15394831
申请日：2016-12-30
Applicant: Industrial Technology Research Institute
Inventor： Chao-Jen Wang , Jia-Chong Ho
CPC classification number: H05K1/0281 , B29C37/0082 , B29C73/02 , B29K2995/0092 , H05K1/0269 , H05K3/22 , H05K3/28 , H05K13/08 , H05K2201/0104 , H05K2203/16
Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.
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