Abstract:
A method of forming low-k material is provided. The method includes providing a plurality of core-shell particles. The core of the core-shell particles has a first ceramic with a low melting point. The shell of the core-shell particles has a second ceramic with a low melting point and a low dielectric constant. The core-shell particles are sintered and molded to form a low-k material. The shell of the core-shell particles is connected to form a network structure of a microcrystal phase.
Abstract:
A P-type metal oxide semiconductor material is provided. The P-type metal oxide semiconductor material has a formula of In(1−3)Ga(1−b)Zn(1+a+b)O4, wherein 0≦a≦0.1, 0≦b≦0.1, and 0
Abstract translation:提供了P型金属氧化物半导体材料。 P型金属氧化物半导体材料具有In(1-3)Ga(1-b)Zn(1 + a + b)O4的式,其中0&nlE; a&nlE; 0.1,0&amp; nlE; b&nlE; 0.1和0 < a + b&nlE; 0.16。 特别是,P型金属氧化物半导体材料的空穴载流子浓度为1×10 11 cm -3〜5×10 18 cm -3。
Abstract:
A core-shell particle includes a core and a shell that is wrapped around the core. The core includes aluminum nitride. The shell includes aluminum and a dopant, and the dopant is yttrium, calcium, magnesium, lanthanum, niobium, titanium, copper, or a combination thereof. The aluminum and the dopant in the shell have a weight ratio of 90:10 to 99.9:0.1. The core-shell particle can be sintered to form a ceramic bulk.
Abstract:
The disclosure provides a p-type metal oxide semiconductor material. The p-type metal oxide semiconductor material has the following formula: In1−xGa1−yMx+yZnO4+m, wherein M is Ca, Mg, or Cu, 0