公开(公告)号：US09099454B2

公开(公告)日：2015-08-04

申请号：US13964153

申请日：2013-08-12

Applicant: Infineon Technologies AG

Inventor： Ulrich Wachter ,  Veronika Huber ,  Thomas Kilger ,  Ralf Otremba ,  Bernd Stadler ,  Dominic Maier ,  Klaus Schiess ,  Andreas Schlögl ,  Uwe Wahl

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/36 ,  H01L21/56

CPC classification number: H01L23/49575 ,  H01L21/561 ,  H01L21/568 ,  H01L23/36 ,  H01L23/49562 ,  H01L24/24 ,  H01L24/25 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/96 ,  H01L27/14618 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/73273 ,  H01L2224/73277 ,  H01L2224/85 ,  H01L2224/96 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00014

Abstract: A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame.

Abstract translation: 通过在模具的第一侧提供具有端子的半导体模具来制造半导体封装，在模具的相对的第二侧提供耦合到模具的材料，并将模具嵌入模制化合物中，使得模具被覆盖 通过除第一面以外的所有侧面的模塑料。 模塑料在靠近模具的第二侧的模塑料的一侧变细，以在模具的第二面露出材料，而不暴露模具的第二面。 在模具的第一侧上的端子形成电连接。 在晶体管管芯的情况下，端子可以是源极端子，并且晶体管管芯可以源极地附接到诸如引线框架的管芯焊盘的金属块。

公开(公告)号：US20150041967A1

公开(公告)日：2015-02-12

申请号：US13964153

申请日：2013-08-12

Applicant: Infineon Technologies AG

Inventor： Ulrich Wachter ,  Veronika Huber ,  Thomas Kilger ,  Ralf Otremba ,  Bernd Stadler ,  Dominic Maier ,  Klaus Schiess ,  Andreas Schlögl ,  Uwe Wahl

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L21/561 ,  H01L21/568 ,  H01L23/36 ,  H01L23/49562 ,  H01L24/24 ,  H01L24/25 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/96 ,  H01L27/14618 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/73273 ,  H01L2224/73277 ,  H01L2224/85 ,  H01L2224/96 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00014

Abstract: A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame.

Abstract translation: 通过在模具的第一侧提供具有端子的半导体模具来制造半导体封装，在模具的相对的第二侧提供耦合到模具的材料，并将模具嵌入模制化合物中，使得模具被覆盖 通过除第一面以外的所有侧面的模塑料。 模塑料在靠近模具的第二侧的模塑料的一侧变细，以在模具的第二面露出材料，而不暴露模具的第二面。 在模具的第一侧上的端子形成电连接。 在晶体管管芯的情况下，端子可以是源极端子，并且晶体管管芯可以源极地附接到诸如引线框架的管芯焊盘的金属块。

公开(公告)号：US20170283247A1

公开(公告)日：2017-10-05

申请号：US15090010

申请日：2016-04-04

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Dominic Maier ,  Johannes Lodermeyer ,  Bernd Stadler

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0051 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00238 ,  B81C1/00325 ,  B81C2203/0145 ,  H01L2224/16225 ,  H01L2924/19105

Abstract: A semiconductor device includes a microelectromechanical system (MEMS) die, a lid, and an integrated circuit die. The lid is over the MEMS die and defines a cavity between the lid and the MEMS die. The integrated circuit die is attached to an inner side of the lid. The integrated circuit die is electrically coupled to the MEMS die.