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    Electronic device
    2.
    发明授权
    Electronic device 有权

    公开(公告)号：US12266852B2

    公开(公告)日：2025-04-01

    申请号：US18401885

    申请日：2024-01-02

    Applicant: InnoLux Corporation

    Inventor： Chia-Ping Tseng ,  Ker-Yih Kao ,  Chia-Chi Ho ,  Ming-Yen Weng ,  Hung-I Tseng ,  Shu-Ling Wu ,  Huei-Ying Chen

    IPC: H01Q1/38 ,  G02F1/1343 ,  H01L21/04 ,  H01L27/12 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/04 ,  G02F1/1333

    Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

    Method of forming alignment film
    3.
    发明授权
    Method of forming alignment film 有权
    形成取向膜的方法

    公开(公告)号：US08802358B2

    公开(公告)日：2014-08-12

    申请号：US13669659

    申请日：2012-11-06

    Applicant: Innocom Technology(Shenzhen)Co., Ltd. ,  Chimei Innolux Corporation

    Inventor： Yao-Jen Ou ,  Han-Lang Lee ,  Chien-Chih Wang ,  Hung-I Tseng

    IPC: G03F7/20

    CPC classification number: G03F7/2022 ,  G02F1/133788 ,  G02F2001/133757

    Abstract: A method of forming an alignment film is provided. A photosensitive polymer material is provided, wherein the photosensitive polymer material defines a first pixel area and a second pixel area respectively defining a first sub-pixel area and the second sub-pixel area. In a first exposure, the photosensitive polymer material is irradiate by a first exposure light and a second exposure light to form a first alignment portion and a second alignment portion with different alignment directions in the first sub-pixel of the first pixel area and the second sub-pixel of the second pixel area respectively. In a second exposure, the photosensitive polymer material is irradiated with the first exposure light and the second exposure light to form a third alignment portion and a fourth alignment portion with different alignment directions in the first sub-pixel of the second pixel area and the second sub-pixel of the first pixel area respectively.

    Abstract translation: 提供了形成取向膜的方法。 提供一种光敏聚合物材料，其中感光聚合物材料限定分别限定第一子像素区域和第二子像素区域的第一像素区域和第二像素区域。 在第一曝光中，通过第一曝光光和第二曝光光照射光敏聚合物材料，以在第一像素区域的第一子像素中形成具有不同取向方向的第一对准部分和第二对准部分， 第二像素区域的子像素。 在第二曝光中，用第一曝光光和第二曝光光照射光敏聚合物材料，以在第二像素区域的第一子像素中形成具有不同取向方向的第三对准部分和第四对准部分，而第二曝光 第一像素区域的子像素。

    METHOD OF FORMING ALIGNMENT FILM
    5.
    发明申请
    METHOD OF FORMING ALIGNMENT FILM 有权
    形成对准膜的方法

    公开(公告)号：US20130130181A1

    公开(公告)日：2013-05-23

    申请号：US13669659

    申请日：2012-11-06

    Applicant: Innocom Technology(Shenzhen)Co., Ltd. ,  Chimei Innolux corporation

    Inventor： Yao-Jen Ou ,  Han-Lang Lee ,  Chien-Chih Wang ,  Hung-I Tseng

    IPC: G03F7/20

    CPC classification number: G03F7/2022 ,  G02F1/133788 ,  G02F2001/133757

    Abstract: A method of forming an alignment film is provided. A photosensitive polymer material is provided, wherein the photosensitive polymer material defines a first pixel area and a second pixel area respectively defining a first sub-pixel area and the second sub-pixel area. In a first exposure, the photosensitive polymer material is irradiate by a first exposure light and a second exposure light to form a first alignment portion and a second alignment portion with different alignment directions in the first sub-pixel of the first pixel area and the second sub-pixel of the second pixel area respectively. In a second exposure, the photosensitive polymer material is irradiated with the first exposure light and the second exposure light to form a third alignment portion and a fourth alignment portion with different alignment directions in the first sub-pixel of the second pixel area and the second sub-pixel of the first pixel area respectively.

    Abstract translation: 提供了形成取向膜的方法。 提供一种光敏聚合物材料，其中感光聚合物材料限定分别限定第一子像素区域和第二子像素区域的第一像素区域和第二像素区域。 在第一曝光中，通过第一曝光光和第二曝光光照射光敏聚合物材料，以在第一像素区域的第一子像素中形成具有不同取向方向的第一对准部分和第二对准部分， 第二像素区域的子像素。 在第二曝光中，用第一曝光光和第二曝光光照射光敏聚合物材料，以在第二像素区域的第一子像素中形成具有不同取向方向的第三对准部分和第四对准部分，而第二曝光 第一像素区域的子像素。

    Manufacturing method of package structure of electronic device
    6.
    发明授权
    Manufacturing method of package structure of electronic device 有权

    公开(公告)号：US12191197B2

    公开(公告)日：2025-01-07

    申请号：US17747940

    申请日：2022-05-18

    Applicant: Innolux Corporation

    Inventor： Ching-Wei Chen ,  Yu-Jen Chang ,  Tzu-Yen Chiu ,  Hung-I Tseng ,  Chuan-Ming Yeh ,  Heng-Shen Yeh

    IPC: H01L21/00 ,  H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532

    Abstract: A manufacturing method of a package structure of an electronic device, including the following steps, is provided. A first seed layer is formed on a carrier plate. A first metal layer is formed on the first seed layer. A first insulating layer is formed on the first metal layer, wherein the first insulating layer exposes a portion of the first metal layer. A first plasma treatment is performed on the first insulating layer and the exposed portion of the first metal layer. After performing the first plasma treatment, the carrier plate formed with the first seed layer, the first metal layer, and the first insulating layer is placed in a microenvironment controlling box. After taking the carrier plate out of the microenvironment controlling box, a second seed layer is formed on the first insulating layer and the exposed portion of the first metal layer.

    METHOD FOR MANUFACTURING COMPOSITE LAYER CIRCUIT STRUCTURE OF ELECTRONIC DEVICE
    7.
    发明公开
    METHOD FOR MANUFACTURING COMPOSITE LAYER CIRCUIT STRUCTURE OF ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230178447A1

    公开(公告)日：2023-06-08

    申请号：US17751653

    申请日：2022-05-23

    Applicant: Innolux Corporation

    Inventor： Yu-Jen Chang ,  Ching-Wei Chen ,  Tzu-Yen Chiu ,  Hung-I Tseng ,  Chun-Chin Fan

    IPC: H01L23/31 ,  H01L21/02 ,  H01L21/768

    CPC classification number: H01L23/3192 ,  H01L21/02271 ,  H01L21/76873 ,  H01L2924/181 ,  H01L2924/14

    Abstract: A method for manufacturing a composite layer circuit structure of an electronic device is provided. First, a first conductive layer is formed on a carrier plate. Next, a first photoresist layer is formed on the first conductive layer. The first photoresist layer includes multiple first openings exposing part of the first conductive layer. Next, a first electroplating layer is formed in the first openings. Then, the first photoresist layer is removed. Then, a first insulating layer is formed on the first conductive layer. The first insulating layer includes multiple second openings exposing part of the first electroplating layer. In the above, at least one heat treatment process is performed on the first electroplating layer before the first insulating layer is formed on the first conductive layer. A temperature when performing at least one heat treatment process is higher than or equal to 40° C. and lower than or equal to 300° C.

    MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE
    8.
    发明公开
    MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230238278A1

    公开(公告)日：2023-07-27

    申请号：US17747940

    申请日：2022-05-18

    Applicant: Innolux Corporation

    Inventor： Ching-Wei Chen ,  Yu-Jen Chang ,  Tzu-Yen Chiu ,  Hung-I Tseng ,  Chuan-Ming Yeh ,  Heng-Shen Yeh

    IPC: H01L21/768

    CPC classification number: H01L21/76826 ,  H01L21/76816 ,  H01L21/76873 ,  H01L21/76883 ,  H01L23/5226

    Abstract: A manufacturing method of a package structure of an electronic device, including the following steps, is provided. A first seed layer is formed on a carrier plate. A first metal layer is formed on the first seed layer. A first insulating layer is formed on the first metal layer, wherein the first insulating layer exposes a portion of the first metal layer. A first plasma treatment is performed on the first insulating layer and the exposed portion of the first metal layer. After performing the first plasma treatment, the carrier plate formed with the first seed layer, the first metal layer, and the first insulating layer is placed in a microenvironment controlling box. After taking the carrier plate out of the microenvironment controlling box, a second seed layer is formed on the first insulating layer and the exposed portion of the first metal layer.

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