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公开(公告)号:US20170069988A1
公开(公告)日:2017-03-09
申请号:US14847482
申请日:2015-09-08
Applicant: Intel Corporation
Inventor: GONG OUYANG , KAI XIAO , LU-VONG T. PHAN
IPC: H01R12/70
CPC classification number: H01R12/7076 , H01R12/716 , H01R13/7036 , H01R13/71 , H01R24/60
Abstract: One embodiment provides an electrical connector. The electrical connector includes a housing defining a slot; and a pin. The pin includes a stub member comprising a first portion and a second portion, the first portion to couple to a first printed circuit board; and a movable member operable to engage the second portion of the stub member to create a conductive path, wherein the stub member is only engaged with the movable member when a second printed circuit board is inserted into the slot.
Abstract translation: 一个实施例提供一种电连接器。 电连接器包括限定狭槽的壳体; 和一个针。 所述销包括短截线构件,所述短柱构件包括第一部分和第二部分,所述第一部分耦合到第一印刷电路板; 以及可动构件,其可操作以接合所述短截段构件的第二部分以形成导电路径,其中当第二印刷电路板插入所述槽时,所述短截线构件仅与所述可动构件接合。
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公开(公告)号:US20170207146A1
公开(公告)日:2017-07-20
申请号:US15036385
申请日:2015-06-26
Applicant: Intel Corporation
Inventor: GONG OUYANG , BEOM-TAEK LEE
CPC classification number: H01L23/48 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/07 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48464 , H01L2224/48472 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/19107 , H01L2224/05599 , H01L2924/00012 , H01L2924/20752 , H01L2924/00 , H01L2224/85399
Abstract: Some embodiments of the present disclosure describe an integrated circuit (IC) package assembly having first, second, and third insulated wires wire bonded with die pads on an IC die, with an outer surface of the second insulated wire located at a distance of less than an outer cross-sectional diameter of the second insulated wire from an outer surface of the first insulated wire at a first location and located at a distance of less than the outer cross-sectional diameter from an outer surface of the third insulated wire at a second location. Other embodiments may be described and/or claimed.
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