公开(公告)号：US20230305057A1

公开(公告)日：2023-09-28

申请号：US17701323

申请日：2022-03-22

Applicant: Intel Corporation

Inventor： Xianghong Tong ,  Martin Von Haartman ,  Zhiyong Ma ,  Jennifer J. Huening ,  Hyuk Ju Ryu ,  Christopher Morgan ,  Shuai Zhao ,  Ramune Nagisetty ,  Tuyen K. Tran ,  Wen-Hsien Chuang

IPC: G01R31/307 ,  G01R1/073

CPC classification number: G01R31/307 ,  G01R1/07342

Abstract: Wafer level electron beam prober systems, devices, and techniques, are described herein related to providing wafer level testing for fabricated device structures. Such wafer level testing contacts a first side of a die of a wafer with a probe to provide test signals to the die under test and performs e-beam imaging of the first side of the die while the test signals are provided to the die under test.

公开(公告)号：US20240006302A1

公开(公告)日：2024-01-04

申请号：US17856777

申请日：2022-07-01

Applicant: Intel Corporation

Inventor： Richard H. Livengood ,  Muhammad Usman Raza ,  Waqas Ali ,  Tahir Malik ,  Shida Tan ,  Martin Von Haartman ,  Mauro Kobrinsky ,  Amir Raveh ,  Clifford J. Engle

IPC: H01L23/50 ,  H01L23/528 ,  H01L29/06 ,  H01L29/08 ,  H01L29/423 ,  H01L29/786

CPC classification number: H01L23/50 ,  H01L23/5286 ,  H01L29/0673 ,  H01L29/0873 ,  H01L29/42392 ,  H01L29/78696

Abstract: Techniques and structures are disclosed related to coupling to gate-all-around transistors for test and/or debug of an integrated circuit. The gate-all-around transistors, which may also be referred to as 3D stacked transistors or ribbon-FET transistors are contacted directly from the back side or they are contacted using a dedicated probe point on the back side of the gate-all-around transistors. Such contact may be made to probe the devices and/or to provide edit wires to modify the integrated circuit.

公开(公告)号：US20230317408A1

公开(公告)日：2023-10-05

申请号：US17711785

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Xianghong Tong ,  Martin Von Haartman ,  Wen-Hsien Chuang ,  Zhiyong Ma ,  Hyuk Ju Ryu ,  Prasoon Joshi ,  May Ling Oh ,  Jennifer Huening ,  Shuai Zhao ,  Charles Peterson ,  Ira Jewell ,  Hasan Faraby

IPC: H01J37/26 ,  H01J37/28 ,  H01J37/244

CPC classification number: H01J37/265 ,  H01J37/28 ,  H01J37/244 ,  H01J2237/2443 ,  H01J2237/2814 ,  H01J2237/2801 ,  H01J2237/221

Abstract: Pulsed beam prober systems, devices, and techniques are described herein related to providing a beam detection frequency that is less than a electrical test frequency. An electrical test signal at the electrical test frequency is provided to die under test. A pulsed beam is applied to the die such that the pulsed beam has packets of beam pulses or a frequency delta with respect to the electrical test frequency. The packets of beam pulses or the frequency delta elicits a detectable beam modulation in an imaging signal reflected from the die such that the imaging signal is modulated at a detection frequency less than the electrical test frequency.