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公开(公告)号:US20250106983A1
公开(公告)日:2025-03-27
申请号:US18373457
申请日:2023-09-27
Applicant: Intel Corporation
Inventor: Bohan SHAN , Kyle ARRINGTON , Dingying David XU , Ziyin LIN , Timothy GOSSELIN , Elah BOZORG-GRAYELI , Aravindha ANTONISWAMY , Wei LI , Haobo CHEN , Yiqun BAI , Jose WAIMIN , Ryan CARRAZZONE , Hongxia FENG , Srinivas Venkata Ramanuja PIETAMBARAM , Gang DUAN , Bin MU , Mohit GUPTA , Jeremy D. ECTON , Brandon C. MARIN , Xiaoying GUO , Ashay DANI
Abstract: Embodiments disclosed herein include glass core package substrates with a stiffener. In an embodiment, an apparatus comprises a substrate with a first layer with a first width, where the first layer is a glass layer, a second layer under the first layer, where the second layer has a second width that is smaller than the first width, and a third layer over the first layer, where the third layer has a third width that is smaller than the first width. In an embodiment, the apparatus further comprises a metallic structure with a first portion and a second portion, where the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.
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公开(公告)号:US20180190593A1
公开(公告)日:2018-07-05
申请号:US15396415
申请日:2016-12-30
Applicant: Intel Corporation
Inventor: Taylor GAINES , Anna M. PRAKASH , Suriyakala RAMALINGAM , Boxi LIU , Mohit GUPTA , Ziv BELMAN , Baruch SCHIFFMANN , Arnon HIRSHBERG , Vladimir MALAMUD , Ron WITTENBERG
IPC: H01L23/552 , H01L25/00 , H01L25/16 , H01L23/31 , H01L23/00
CPC classification number: H01L24/83 , H01L23/3142 , H01L23/552 , H01L24/27 , H01L24/32 , H01L25/167 , H01L25/50 , H01L31/107 , H01L2224/2731 , H01L2224/27318 , H01L2224/27418 , H01L2224/27505 , H01L2224/29111 , H01L2224/29113 , H01L2224/29139 , H01L2224/29147 , H01L2224/2919 , H01L2224/32245 , H01L2224/32503 , H01L2224/83191 , H01L2224/8322 , H01L2224/8384 , H01L2224/83851 , H01L2924/0133 , H01L2924/0635 , H01L2924/0665 , H01L2924/12042 , H01L2924/12043 , H01L2924/1434 , H01L2924/3025
Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.
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公开(公告)号:US20250112164A1
公开(公告)日:2025-04-03
申请号:US18374932
申请日:2023-09-29
Applicant: Intel Corporation
Inventor: Bohan SHAN , Onur OZKAN , Ryan CARRAZZONE , Rui ZHANG , Haobo CHEN , Ziyin LIN , Yiqun BAI , Kyle ARRINGTON , Jose WAIMIN , Hongxia FENG , Srinivas Venkata Ramanuja PIETAMBARAM , Gang DUAN , Dingying David XU , Bin MU , Mohit GUPTA , Jeremy D. ECTON , Brandon C. MARIN , Xiaoying GUO , Steve S. CHO , Ali LEHAF , Venkata Rajesh SARANAM , Shripad GOKHALE , Kartik SRINIVASAN , Edvin CETEGEN , Mine KAYA , Nicholas S. HAEHN , Deniz TURAN
IPC: H01L23/538 , H01L21/48 , H01L23/00 , H01L25/065
Abstract: A device comprises a substrate comprising a plurality of build-up layers and a cavity. A bridge die is located within the cavity and a plurality of cavity side bumps are on one side of the bridge die. A plurality of interconnect pads with variable heights are on one of the build-up layers of the substrate coupled to the plurality of the cavity side bumps to bond the bridge die to the substrate.
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公开(公告)号:US20190057936A1
公开(公告)日:2019-02-21
申请号:US15770626
申请日:2015-12-18
Applicant: Intel Corporation
Inventor: Mohit GUPTA , Mukul RENAVIKAR
IPC: H01L23/538 , H01L21/683 , H01L23/498 , H01L23/26 , H01L23/532 , H01L23/00
Abstract: A transmissive composite film is described that may be applied to the backside of a microelectronic device, for example an integrated circuit die or a bridge. A microelectronic die package in one example has a substrate, an integrated circuit die attached and electrically connected to the substrate, the die having a front side with electrical attachments and a backside, and a composite film attached to a backside of the die, the composite film having a polymer base with nano-fillers to protect the backside of the die.
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公开(公告)号:US20250112136A1
公开(公告)日:2025-04-03
申请号:US18374937
申请日:2023-09-29
Applicant: Intel Corporation
Inventor: Bohan SHAN , Jesse JONES , Zhixin XIE , Bai NIE , Shaojiang CHEN , Joshua STACEY , Mitchell PAGE , Brandon C. MARIN , Jeremy D. ECTON , Nicholas S. HAEHN , Astitva TRIPATHI , Yuqin LI , Edvin CETEGEN , Jason M. GAMBA , Jacob VEHONSKY , Jianyong MO , Makoyi WATSON , Shripad GOKHALE , Mine KAYA , Kartik SRINIVASAN , Haobo CHEN , Ziyin LIN , Kyle ARRINGTON , Jose WAIMIN , Ryan CARRAZZONE , Hongxia FENG , Srinivas Venkata Ramanuja PIETAMBARAM , Gang DUAN , Dingying David XU , Hiroki TANAKA , Ashay DANI , Praveen SREERAMAGIRI , Yi LI , Ibrahim EL KHATIB , Aaron GARELICK , Robin MCREE , Hassan AJAMI , Yekan WANG , Andrew JIMENEZ , Jung Kyu HAN , Hanyu SONG , Yonggang Yong LI , Mahdi MOHAMMADIGHALENI , Whitney BRYKS , Shuqi LAI , Jieying KONG , Thomas HEATON , Dilan SENEVIRATNE , Yiqun BAI , Bin MU , Mohit GUPTA , Xiaoying GUO
IPC: H01L23/498 , H01L23/15
Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.
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公开(公告)号:US20180342463A1
公开(公告)日:2018-11-29
申请号:US16035048
申请日:2018-07-13
Applicant: Intel Corporation
Inventor: Taylor GAINES , Anna M. PRAKASH , Suriyakala RAMALINGAM , Boxi LIU , Mohit GUPTA , Ziv BELMAN , Baruch SCHIFFMANN , Arnon HIRSHBERG , Vladimir MALAMUD , Ron WITTENBERG
IPC: H01L23/552 , H01L23/00 , H01L25/16 , H01L25/00 , H01L23/31 , H01L31/107 , H01S5/022
Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.
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