公开(公告)号：US20150294948A1

公开(公告)日：2015-10-15

申请号：US14248373

申请日：2014-04-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Stephen P. Ayotte ,  Sebastien S. Quesnel ,  Glen E. Richard ,  Timothy D. Sullivan ,  Timothy M. Sullivan

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/02126 ,  H01L2224/0345 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/0516 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05686 ,  H01L2224/10156 ,  H01L2224/10175 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/00014

Abstract: A method of applying inductive heating to join an integrated circuit chip to an electrical substrate using solder bumps including applying a magnetic field to a magnetic liner in thermal contact with a solder bump on the integrated circuit chip, the magnetic field causes Joule heating in the magnetic liner sufficient to melt the solder bump, the solder bump comprising a lower portion embedded in a first dielectric layer and an upper portion at least partially embedded in a second dielectric layer, the lower

Abstract translation: 一种使用焊料凸块来施加感应加热以将集成电路芯片连接到电气基板的方法，包括将磁场施加到与集成电路芯片上的焊料凸块热接触的磁性衬垫上，磁场引起磁场中的焦耳加热 衬垫足以熔化焊料凸块，焊料凸块包括嵌入第一电介质层中的下部和至少部分地嵌入第二电介质层中的上部，下部

公开(公告)号：US09190375B2

公开(公告)日：2015-11-17

申请号：US14248373

申请日：2014-04-09

Applicant: International Business Machines Corporation

Inventor： Stephen P. Ayotte ,  Sebastien S. Quesnel ,  Glen E. Richard ,  Timothy D. Sullivan ,  Timothy M. Sullivan

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/02126 ,  H01L2224/0345 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/0516 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05686 ,  H01L2224/10156 ,  H01L2224/10175 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/00014

Abstract: A method of applying inductive heating to join an integrated circuit chip to an electrical substrate using solder bumps including applying a magnetic field to a magnetic liner in thermal contact with a solder bump on the integrated circuit chip. The magnetic field causes Joule heating in the magnetic liner sufficient to melt the solder bump, which has a lower portion embedded in a first dielectric layer and an upper portion at least partially embedded in a second dielectric layer. The lower portion is in electrical contact with a conductive pad, the first dielectric layer is above the conductive pad and the second dielectric layer is on top of the first dielectric layer. The duration of application of the magnetic field is controlled to achieve a joining temperature that is approximately halfway between the storage and operating temperatures of the integrated circuit chip.

Abstract translation: 一种施加感应加热以将集成电路芯片连接到电气基板的方法，其使用焊料凸块，包括将磁场施加到与集成电路芯片上的焊料凸块热接触的磁性衬垫。 磁场使得磁性衬垫中的焦耳加热足以熔化焊料凸块，焊料凸块具有嵌入在第一电介质层中的下部和至少部分地嵌入第二介电层中的上部。 下部与导电焊盘电接触，第一介电层位于导电焊盘的上方，第二介电层位于第一介质层的顶部。 控制施加磁场的持续时间以实现大约在集成电路芯片的存储和工作温度之间的接合温度。