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公开(公告)号：US20150145544A1
公开(公告)日：2015-05-28
申请号：US14560138
申请日：2014-12-04
Applicant: International Business Machines Corporation
Inventor： Robert D. Edwards , Oleg Gluschenkov , Louis V. Medina , Tso-Hui Ting , Ping-Chuan Wang , Yongchun Xin
CPC classification number: G01R31/2891 , G01R1/06794 , G01R1/07364
Abstract: A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.
Abstract translation: 晶片探测系统包括探针卡组件，其具有构造成与安装在马达驱动晶片卡盘上的半导体晶片接触的多个单独的探针结构，每个探针结构配置有与其集成的压力感测单元; 以及控制器，被配置为用一个或多个压电驱动器单元来驱动探针卡组件，以响应来自各个探针结构的压力感测单元的反馈。
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Patent Agency Ranking
公开(公告)号：US20160216321A1
公开(公告)日：2016-07-28
申请号：US15090717
申请日：2016-04-05
Applicant: International Business Machines Corporation
Inventor： Robert D. Edwards , Oleg Gluschenkov , Louis V. Medina , Tso-Hui Ting , Ping-Chuan Wang , Yongchun Xin
CPC classification number: G01R31/2891 , G01R1/06794 , G01R1/07364
Abstract: A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.
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公开(公告)号：US20140145351A1
公开(公告)日：2014-05-29
申请号：US14167240
申请日：2014-01-29
Applicant: International Business Machines Corporation
Inventor： Oleg Gluschenkov , Yunsheng Song , Tso-Hui Ting , Ping-Chuan Wang
IPC: H01L23/498
CPC classification number: H01L23/49827 , H01L21/486 , H01L22/20 , H01L23/13 , H01L23/481 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L2224/0401 , H01L2224/0603 , H01L2224/1403 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2225/06596 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/15311 , H05K1/0286 , H05K1/142 , H05K2201/2018 , H05K2203/1572 , Y10T29/49117 , H01L2924/00
Abstract: A modularized interposer includes a plurality of interposer units that are assembled to provide a complete set of electrical connections between two semiconductor chips. At least some of the plurality of interposer units can be replaced with other interposer units having an alternate configuration to enable selection of different functional parts of semiconductor chips to be connected through the modularized interposer. Bonding structures, connected to conductive metal pads located at peripheries of neighboring interposer units and an overlying or underlying portion of a semiconductor chip, can provide electrical connections between the neighboring interposer units. The interposer units can be provided by forming through-substrate vias (TSV's) in a substrate, forming patterned conductive structures on the substrate, and cutting the substrate into interposers.
Abstract translation: 模块化插入器包括多个插入器单元，其被组合以提供两个半导体芯片之间的完整的电连接。 多个插入单元中的至少一些可以被具有替代配置的其它插入单元替代，以便能够通过模块化插入器选择要连接的半导体芯片的不同功能部件。 连接到位于相邻插入单元周围的导电金属焊盘和半导体芯片的上部或下部的结合结构可以在相邻插入单元之间提供电连接。 可以通过在衬底中形成贯穿衬底通孔（TSV）来形成插入器单元，在衬底上形成图案化的导电结构，并将衬底切割成插入层。
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公开(公告)号：US09524930B2
公开(公告)日：2016-12-20
申请号：US14167240
申请日：2014-01-29
Applicant: International Business Machines Corporation
Inventor： Oleg Gluschenkov , Yunsheng Song , Tso-Hui Ting , Ping-Chuan Wang
IPC: H01L21/00 , H01L23/498 , H01L21/48 , H01L23/13 , H01L23/48 , H01L25/065 , H05K1/02 , H01L21/66 , H01L23/00 , H05K1/14
CPC classification number: H01L23/49827 , H01L21/486 , H01L22/20 , H01L23/13 , H01L23/481 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L2224/0401 , H01L2224/0603 , H01L2224/1403 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2225/06596 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/15311 , H05K1/0286 , H05K1/142 , H05K2201/2018 , H05K2203/1572 , Y10T29/49117 , H01L2924/00
Abstract: A modularized interposer includes a plurality of interposer units that are assembled to provide a complete set of electrical connections between two semiconductor chips. At least some of the plurality of interposer units can be replaced with other interposer units having an alternate configuration to enable selection of different functional parts of semiconductor chips to be connected through the modularized interposer. Bonding structures, connected to conductive metal pads located at peripheries of neighboring interposer units and an overlying or underlying portion of a semiconductor chip, can provide electrical connections between the neighboring interposer units. The interposer units can be provided by forming through-substrate vias (TSV's) in a substrate, forming patterned conductive structures on the substrate, and cutting the substrate into interposers.
Abstract translation: 模块化插入器包括多个插入器单元，其被组合以提供两个半导体芯片之间的完整的电连接。 多个插入单元中的至少一些可以被具有替代配置的其它插入单元替代，以便能够通过模块化插入器选择要连接的半导体芯片的不同功能部件。 连接到位于相邻插入单元周围的导电金属焊盘和半导体芯片的上部或下部的结合结构可以在相邻插入单元之间提供电连接。 可以通过在衬底中形成贯穿衬底通孔（TSV）来形成插入器单元，在衬底上形成图案化的导电结构，并将衬底切割成插入层。
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公开(公告)号：US09354252B2
公开(公告)日：2016-05-31
申请号：US14560138
申请日：2014-12-04
Applicant: International Business Machines Corporation
Inventor： Robert D. Edwards , Oleg Gluschenkov , Louis V. Medina , Tso-Hui Ting , Ping-Chuan Wang , Yongchun Xin
CPC classification number: G01R31/2891 , G01R1/06794 , G01R1/07364
Abstract: A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.
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公开(公告)号：US09702930B2
公开(公告)日：2017-07-11
申请号：US15090717
申请日：2016-04-05
Applicant: International Business Machines Corporation
Inventor： Robert D. Edwards , Oleg Gluschenkov , Louis V. Medina , Tso-Hui Ting , Ping-Chuan Wang , Yongchun Xin
CPC classification number: G01R31/2891 , G01R1/06794 , G01R1/07364
Abstract: A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.
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