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公开(公告)号：US11333975B2
公开(公告)日：2022-05-17
申请号：US16848589
申请日：2020-04-14
发明人： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
IPC分类号： G03F7/023 , C08G73/10 , C08G73/14 , C08G73/22 , G03F7/022 , G03F7/038 , G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40
摘要： Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.
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公开(公告)号：US20210317270A1
公开(公告)日：2021-10-14
申请号：US16848439
申请日：2020-04-14
发明人： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
IPC分类号： C08G73/14 , C07C63/49 , G03F7/039 , G03F7/022 , G03F7/038 , C07C211/49 , C07C233/65
摘要： Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X1 to X3 represent any of —CO2—, —CONRX1—, —O—, —NRX1—, —S—, —SO2—, —SO3— and —SO2NRX1— and may be the same as or different from each other, provided that RX1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L1 and L2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.
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公开(公告)号：US11572442B2
公开(公告)日：2023-02-07
申请号：US16848439
申请日：2020-04-14
发明人： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
IPC分类号： C08G73/14 , G03F7/023 , G03F7/038 , G03F7/38 , G03F7/40 , C07C63/49 , C07C211/49 , C07C233/65 , G03F7/022 , G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32
摘要： Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X1 to X3 represent any of —CO2—, —CONRX1—, —O—, —NRX1—, —S—, —SO2—, —SO3— and —SO2NRX1— and may be the same as or different from each other, provided that RX1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L1 and L2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.
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公开(公告)号：US20210317268A1
公开(公告)日：2021-10-14
申请号：US16848589
申请日：2020-04-14
发明人： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
摘要： Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.
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公开(公告)号：US20190324367A1
公开(公告)日：2019-10-24
申请号：US16379032
申请日：2019-04-09
摘要： A photoacid generator having formula (1a) is provided. A chemically amplified resist composition comprising the PAG forms a pattern of rectangular profile with a good balance of sensitivity and LWR when processed by photolithography using ArF excimer laser, EB or EUV.
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公开(公告)号：US11022881B2
公开(公告)日：2021-06-01
申请号：US16379032
申请日：2019-04-09
摘要： A photoacid generator having formula (1a) is provided. A chemically amplified resist composition comprising the PAG forms a pattern of rectangular profile with a good balance of sensitivity and LWR when processed by photolithography using ArF excimer laser, EB or EUV.
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公开(公告)号：US10173975B2
公开(公告)日：2019-01-08
申请号：US15730066
申请日：2017-10-11
IPC分类号： G03F7/004 , C07C381/12 , H01L21/027 , C08F220/18 , C08F220/38 , G03F7/20 , C08F220/24 , G03F7/26 , C07C317/04 , C07C317/28 , C08K5/36 , G03F7/033 , G03F7/32 , C08L33/08 , C08L33/10 , C08L33/16 , G01R33/46
摘要： A sulfonium compound having formula (1) is provided wherein R1, R2 and R3 are a C1-C20 monovalent hydrocarbon group which may contain a heteroatom, p=0-5, q=0-5, and r=0-4. A resist composition comprising the sulfonium compound is processed by lithography to form a resist pattern with improved LWR and pattern collapse.
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公开(公告)号：US11768434B2
公开(公告)日：2023-09-26
申请号：US16512589
申请日：2019-07-16
发明人： Katsuya Takemura , Masashi Iio , Hiroyuki Urano , Kazuya Honda
IPC分类号： G03F7/023 , G03F7/40 , C08G73/10 , C08G73/14 , C08G73/22 , C08G69/26 , G03F7/004 , G03F7/039 , G03F7/038 , G03F7/16 , G03F7/20 , G03F7/32
CPC分类号： G03F7/0233 , C08G69/26 , C08G73/1039 , C08G73/1042 , C08G73/1053 , C08G73/1071 , C08G73/14 , C08G73/22 , G03F7/0045 , G03F7/0382 , G03F7/0392 , G03F7/162 , G03F7/168 , G03F7/2004 , G03F7/2037 , G03F7/322 , G03F7/40
摘要： The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution.
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公开(公告)号：US10323113B2
公开(公告)日：2019-06-18
申请号：US15623561
申请日：2017-06-15
IPC分类号： H01S3/00 , G03F7/004 , G03F7/038 , G03F7/039 , C08F220/30 , C08F220/38 , C09D133/14
摘要： A resist composition comprising a base polymer and a sulfonium or iodonium salt of iodized benzoyloxy-containing fluorinated sulfonic acid offers a high sensitivity and minimal LWR or improved CDU independent of whether it is of positive or negative tone.
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公开(公告)号：US10919918B2
公开(公告)日：2021-02-16
申请号：US16196281
申请日：2018-11-20
发明人： Hiroyuki Urano , Hiroki Takano , Masashi Iio , Katsuya Takemura , Kazuya Honda
IPC分类号： C07F7/08 , C08G73/10 , G03F7/039 , G03F7/038 , C08G77/46 , G03F7/075 , G03F7/023 , C08G77/04 , C09D179/08 , G03F7/32 , G03F7/16 , G03F7/20
摘要： An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).
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