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公开(公告)号：US11333975B2
公开(公告)日：2022-05-17
申请号：US16848589
申请日：2020-04-14
发明人： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
IPC分类号： G03F7/023 , C08G73/10 , C08G73/14 , C08G73/22 , G03F7/022 , G03F7/038 , G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40
摘要： Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.
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公开(公告)号：US20210317270A1
公开(公告)日：2021-10-14
申请号：US16848439
申请日：2020-04-14
发明人： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
IPC分类号： C08G73/14 , C07C63/49 , G03F7/039 , G03F7/022 , G03F7/038 , C07C211/49 , C07C233/65
摘要： Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X1 to X3 represent any of —CO2—, —CONRX1—, —O—, —NRX1—, —S—, —SO2—, —SO3— and —SO2NRX1— and may be the same as or different from each other, provided that RX1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L1 and L2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.
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公开(公告)号：US11572442B2
公开(公告)日：2023-02-07
申请号：US16848439
申请日：2020-04-14
发明人： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
IPC分类号： C08G73/14 , G03F7/023 , G03F7/038 , G03F7/38 , G03F7/40 , C07C63/49 , C07C211/49 , C07C233/65 , G03F7/022 , G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32
摘要： Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X1 to X3 represent any of —CO2—, —CONRX1—, —O—, —NRX1—, —S—, —SO2—, —SO3— and —SO2NRX1— and may be the same as or different from each other, provided that RX1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L1 and L2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.
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公开(公告)号：US20210317268A1
公开(公告)日：2021-10-14
申请号：US16848589
申请日：2020-04-14
发明人： Dmitry Zubarev , Hiroyuki Urano , Katsuya Takemura , Masashi Iio , Kazuya Honda , Yoshio Kawai
摘要： Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.
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公开(公告)号：US10457779B2
公开(公告)日：2019-10-29
申请号：US15457493
申请日：2017-03-13
IPC分类号： G03F7/023 , G03F7/031 , G03F7/037 , G03F7/038 , G03F7/38 , G03F7/40 , C08G73/10 , C08G73/12 , C07C69/76 , C07C69/88 , G03F7/022 , C07C69/92 , G03F7/004 , G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32 , C09D179/08
摘要： The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X1 represents a tetravalent organic group; and R1 represents a group shown by the following general formula (2), wherein the dotted line represents a bond; Y1 represents an organic group with a valency of k+1; “k” represents 1 or 2; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition and usable as a base resin of a photosensitive resin composition.
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公开(公告)号：US10197914B2
公开(公告)日：2019-02-05
申请号：US15432127
申请日：2017-02-14
IPC分类号： G03F7/075 , G03F7/039 , H01L21/027 , C08L83/14 , C08G77/12 , C07C39/21 , C08G77/52 , G03F7/20 , C09D183/14 , H01L21/311 , C08G77/04 , C08G77/06 , G03F7/004 , G03F7/11 , G03F7/16 , G03F7/32 , G03F7/38 , G03F7/40
摘要： The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.
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7.发明授权Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrate 有权正型感光性树脂组合物，光固化型干膜及其制造方法，层叠体，图案化工序，基板等公开(公告)号：US09557645B2
公开(公告)日：2017-01-31
申请号：US14726909
申请日：2015-06-01
IPC分类号： G03F7/039 , G03F7/075 , G03F7/09 , G03F7/11 , G03F7/20 , G03F7/30 , G03F7/32 , G03F7/40 , G03F7/022 , G03F7/16 , G03F7/023
CPC分类号： G03F7/039 , G03F7/022 , G03F7/0226 , G03F7/0236 , G03F7/0757 , G03F7/09 , G03F7/11 , G03F7/16 , G03F7/20 , G03F7/30 , G03F7/32 , G03F7/40
摘要： A positive photosensitive resin composition containing a polymer compound obtained in the presence of an acid catalyst by condensation of at least a siloxane compound shown by formula (1), a phenol compounds shown by formula (2) and/or formula (3), and aldehydes and ketones shown by formula (4), a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, a crosslinker, and a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination generated on metal wiring, electrode, and substrate such as Cu and Al, especially on substrate SiN, and can form fine pattern having forward tapered shape without generating scum and footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer.
摘要翻译： 一种正性感光性树脂组合物，其含有在酸催化剂存在下得到的高分子化合物，所述高分子化合物通过至少由式（1）表示的硅氧烷化合物，式（2）和/或式（3）所示的酚化合物和 式（4）所示的醛和酮，能够通过光产生酸并增加在碱性水溶液，交联剂和溶剂中的溶解速率的感光材料。 可以提供一种可以解决金属布线，电极以及基板如Cu和Al，特别是在基板SiN上产生的分层问题的正型感光性树脂组合物，并且可以形成具有正锥形形状的精细图案而不产生浮渣和基底 当使用广泛使用的2.38％TMAH水溶液作为显影剂时，图案底部和基底上的轮廓。
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公开(公告)号：US12085856B2
公开(公告)日：2024-09-10
申请号：US17389866
申请日：2021-07-30
发明人： Masashi Iio , Hiroyuki Urano , Osamu Watanabe , Katsuya Takemura
CPC分类号： G03F7/0397 , G03F1/48 , G03F7/0045 , G03F7/075 , G03F7/11 , G03F7/161 , G03F7/2004 , G03F7/322
摘要： A positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution, the resin composition and a positive photosensitive dry film derived therefrom that enable formation of a fine pattern and high resolution, have excellent mechanical characteristics even when cured at low temperatures, and have no degradation in adhesive force between before and after a high temperature and high humidity test.
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公开(公告)号：US11892773B2
公开(公告)日：2024-02-06
申请号：US17469454
申请日：2021-09-08
发明人： Hiroyuki Urano , Masashi Iio , Katsuya Takemura
CPC分类号： G03F7/0757 , G03F7/0045 , G03F7/16 , G03F7/38 , G03F7/40
摘要： A photosensitive resin composition, a patterning process performed using the photosensitive resin composition, a cured film formed by curing the pattern, and an electronic component having the cured film. The photosensitive resin composition includes a resin, a photosensitizer, a surfactant containing a structural unit represented by formula (1), and a solvent, where Y1 and Y2 each independently represent a hydrogen atom, a methyl group, a phenyl group, or a group represented by formula (2), at least one of Y1 and Y2 is a group represented by formula (2), R1 to R6 are monovalent hydrocarbon groups that may be the same or different and optionally contain a heteroatom, having 1 to 20 carbon atoms, “1” and “n” are each independently integers of 1 to 100, and “m” is an integer of 0 to 100.
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10.发明授权Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film 有权含有硅氧烷结构的聚合物，负性抗蚀剂组合物，光固化型干膜，图案化工艺以及电子/电子部件保护膜公开(公告)号：US09377689B2
公开(公告)日：2016-06-28
申请号：US14807072
申请日：2015-07-23
IPC分类号： G03F7/075 , C08G77/52 , G03F7/40 , G03F7/38 , C07C39/21 , C09D183/14 , C08L83/14 , H01L21/312 , C08G77/12 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/038 , G03F7/09 , G03F7/11
CPC分类号： G03F7/0757 , C07C39/21 , C08G77/12 , C08G77/52 , C08L83/14 , C09D183/14 , G03F7/038 , G03F7/0382 , G03F7/09 , G03F7/11 , G03F7/168 , G03F7/2002 , G03F7/2037 , G03F7/32 , G03F7/38 , G03F7/40 , H01L21/312 , H01L21/321
摘要： A silicone structure-bearing polymer comprising recurring units derived from a bis(4-hydroxy-3-allylphenyl) derivative and having a Mw of 3,000-500,000 is provided. A chemically amplified negative resist composition comprising the polymer overcomes the stripping problem that a coating is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.
摘要翻译： 提供了含有衍生自双（4-羟基-3-烯丙基苯基）衍生物并具有3,000-500,000的Mw的重复单元的含硅结构的聚合物。 包含该聚合物的化学放大型负性抗蚀剂组合物克服了从Cu或Al，电极和SiN衬底的金属布线剥离涂层的剥离问题。
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