摘要:
A method for printing on an exposed polymerised thermoplastic or curable layer of the body of a portable data medium, and a portable data medium particularly a chip card, comprising a polymerised layer, are disclosed. The method comprises the steps of mixing a polymerisable thermoplastic or curable binder and at least one light-sensitive compound responsive to laser radiation having a predetermined wavelength in such a way that it changes from a first state to a second coloured state, in order to form a mixture, exposing the mixture to the laser radiation having a predetermined wavelength; and polymerising the mixture to form the polymerised layer of the body of the data medium. The method is particularly suitable for printing on smart cards.
摘要:
The invention relates to a process for fabricating a coating layer (8) and a portable support (1) provided with such layer, comprising a support body (3) provided on one of its sides (4) with said coating layer (8). The process of the invention is characterized in that, for the fabrication of the coating layer (8), a transient thermoplastic layer (17) is cross-linked so as to make it thermosettable. The invention applies particularly to the fabrication of chip based cards.
摘要:
Process for producing an electronic card comprising a micromodule inserted in the card body, wherein one layer of the body contacting the micromodule is of polymerized plastic material. A mixture containing a low viscosity liquid monomer is spread on a substrate used for producing the card and the polymerization of the monomer is initiated with a polymerization initiator. The process is particularly useful for the production of microcircuit cards such as contactless cards and advantageously uses an acrylic or methacrylic compound.
摘要:
In a method for producing a portable electronic device with an integrated circuit, a resin band is deposited around the chip of an integrated circuit and connection wires. The resin is highly viscous and can be polymerized with U.V. radiation. A low-viscosity filling resin which can be polymerized with U.V. radiation is deposited in the space defined by the resin band, and the protected resins are polymerized by exposure to U.V. radiation. The filling resin contains mechanically reinforcing fibers. The entire process can be carried out in a continuous manner.
摘要:
Adhesive compositions with thermoreversible crosslinking resulting from the reaction of a divinyl ether having the formula CH.sub.2 .dbd.CH--O--R--O--CH.dbd.CH.sub.2, R being aliphatic, aromatic or cycloaliphatic, with a copolymer resulting from the copolymerization of an olefin with an ethylenically unsaturated monocarboxylic acid and, optionally, an ester of an ethylenically unsaturated monocarboxylic acid, the proportion being 0.1 to 5 percent by weight of the divinyl ether to 99.9 to 95 percent by weight of the copolymer.
摘要:
New molecules having the general formula A:N—B, where A:N— is .alpha.-substituted conjugated cyclic amine, with N being the N atom; and B is an .alpha.-substituted cyclic radical. These materials have ferromagnetic properties and may be use in a variety of fields and particularly in any electromagnetooptical or magnetoresistive system.
摘要:
Process for the preparation of filled heat-curable compounds of the polyurethane type by reaction of condensation of the constituents of the desired compound in the presence of a pulverulent filler, which is characterized in that the said filler is predispersed in the presence of a stabilizing agent in a liquid organic phase compatible with the desired heat-curable compound in the course of its formation reaction, the said filler being then in the form of a homogeneous and stable suspension, and the suspension thus prepared is then introduced into the reaction mixture before, during or after the introduction of at least one of the constituents of the desired heat-curable compound.The process according to the invention makes it possible to produce compounds of the polyurethane type whose mechanical and physical characteristics are at least equivalent or even improved in relation to those of the unfilled identical compounds by virtue of the excellent distribution of the inorganic filler.
摘要:
Adhesive compositions with thermoreversible crosslinking resulting from the reaction of a divinyl ether having the formula CH.sub.2 .dbd.CH--O--R--O--CH.dbd.CH.sub.2, R being aliphatic, armomatic or cycloaliphatic, with a copolymer resulting from the copolymerization of an olefin with an ethylenically unsaturated monocarboxylic acid and, optionally, an ester of an ethylenically unsaturated monocarboxylic acid, the proportion being 0.1 to 5 percent by weight of the divinyl ether to 99.9 to 95 percent by weight of the copolymer.