摘要:
A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.
摘要:
A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.
摘要:
A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3%. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m·K can be manufactured.
摘要:
A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3%. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m·K can be manufactured.
摘要:
A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10−3 and not more than 10×10−3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.
摘要:
A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10−3 and not more than 10×10−3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.
摘要:
An object is to obtain a stable electric connection resistance under a mild crimping condition. The present invention is a terminal connector 12 that includes a crimp portion 30 to be crimped to an electric wire. The crimp portion 30 includes a base material, an aluminum layer or an aluminum alloy layer a surface on the base material, and a hard layer on a surface of the aluminum layer or the aluminum alloy layer. The hard layer is harder than the base material. The present invention may be an electric wire with a terminal connector 10 that includes the above terminal connector 12 and a covered electric wire 40 that includes a core wire 42 made of aluminum or aluminum alloy. The crimp portion 30 of the terminal connector 12 is crimped to the core wire 42.
摘要:
An aluminum alloy wire having excellent bending characteristics, strength, and electrically conductive characteristics, an aluminum alloy stranded wire, a covered electric wire including the above-described alloy wire or stranded wire, and a wire harness including the covered electric wire are provided. The aluminum alloy wire contains not less than 0.1% and not more than 1.5% by mass of Mg, not less than 0.03% and not more than 2.0% of Si, not less than 0.05% and not more than 0.5% of Cu, and a remainder including Al and an impurity, satisfies 0.8≦Mg/Si ratio by mass ≦3.5, has an electrical conductivity from 35% IACS to 58% IACS, a tensile strength from 150 MPa to 400 MPa, and an elongation not less than 2%. The aluminum alloy wire is manufactured through the steps of casting→rolling→wiredrawing→solution heat treatment.
摘要:
A coaxial cable including a core conductor, an insulator arranged around the outer periphery of the core conductor, and an outer conductor arranged around the outer periphery of the insulator coaxially relative to the core conductor, where the electrical conductivity is 20% IACS or more and the Young's modulus of the core conductor is 245 GPa or more. In the present invention, the core conductor is preferably made of a material of one or more kinds selected from the group including tungsten, tungsten alloy, molybdenum, and molybdenum alloy.
摘要:
An object is to obtain a stable electric connection resistance under a mild crimping condition. The present invention is a terminal connector 12 that includes a crimp portion 30 to be crimped to an electric wire. The crimp portion 30 includes a base material, an aluminum layer or an aluminum alloy layer a surface on the base material, and a hard layer on a surface of the aluminum layer or the aluminum alloy layer. The hard layer is harder than the base material. The present invention may be an electric wire with a terminal connector 10 that includes the above terminal connector 12 and a covered electric wire 40 that includes a core wire 42 made of aluminum or aluminum alloy. The crimp portion 30 of the terminal connector 12 is crimped to the core wire 42.