公开(公告)号：US20140204553A1

公开(公告)日：2014-07-24

申请号：US14119841

申请日：2012-05-23

Applicant: JUMATECH GmbH

Inventor： Markus Wölfel

IPC: H05K1/02 ,  H01F27/28

Abstract: A printed circuit board and a method for the production thereof. The printed circuit board can include a shaped part made of an electrically conducting material and can be used to manage the currents and heat volumes that occur in the field of power electronics.

Abstract translation: 印刷电路板及其制造方法。 印刷电路板可以包括由导电材料制成的成形部件，并且可以用于管理在电力电子领域中发生的电流和热量。

公开(公告)号：US20150237738A1

公开(公告)日：2015-08-20

申请号：US14429070

申请日：2013-08-30

Applicant: JUMATECH GMBH

Inventor： Markus Wölfel

IPC: H05K3/10 ,  H05K1/09

CPC classification number: H05K3/10 ,  H05K1/09 ,  H05K3/103 ,  H05K3/385 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/1028 ,  H05K2201/10287 ,  Y10T29/302

Abstract: A method for producing a circuit board element, and a corresponding circuit board element, with which it is possible to suppress the risk of delamination in the region of a component (e.g. a wire or a plate-like shaped part) that is embedded in the circuit board element. To this end, the present invention suggests that the surface of the component should be roughened, at least partially, in order to ensure a better adhesive bond with the surrounding cover layer (e.g. a prepreg made of an insulating material compound). The component surface can be roughened by chemical methods such as etching or by purely mechanical methods such as sand blasting.

Abstract translation: 一种用于制造电路板元件的方法和相应的电路板元件，通过该方法可以抑制嵌入在该电路板元件中的部件（例如线或板状成形部）的区域中的分层的风险 电路板元件。 为此，本发明提出，至少部分地，组件的表面应该被粗糙化，以确保与周围的覆盖层（例如，由绝缘材料化合物制成的预浸料）的更好的粘合剂粘结。 组分表面可以通过诸如蚀刻的化学方法或通过纯机械方法如喷砂来粗糙化。

公开(公告)号：US09474149B2

公开(公告)日：2016-10-18

申请号：US14443231

申请日：2013-11-15

Applicant: JUMATECH GMBH

Inventor： Markus Wölfel

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/20

CPC classification number: H05K1/028 ,  H05K1/0265 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/202 ,  H05K2201/0275 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/057 ,  H05K2201/09027 ,  H05K2201/0969 ,  H05K2201/1028 ,  Y10T29/49156

Abstract: The invention relates to an angle-adjustable and/or printed circuit board structure having at least two printed circuit board sections arrangeable or arranged angularly with respect to one another, wherein the printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads, wherein the two contact pads are situated on different printed circuit board sections, wherein the printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. In order to improve the electrical and mechanical connection between the printed circuit board sections, the invention provides for the conduction element to have a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section. A corresponding method for producing this printed circuit board structure is like wise claimed.

Abstract translation: 本发明涉及一种角度可调节和/或印刷电路板结构，其具有至少两个相对于彼此成角度布置或布置的印刷电路板部分，其中印刷电路板结构包含至少一个传导元件，其至少嵌入 主要在印刷电路板结构中并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘，其中两个接触焊盘位于不同的印刷电路板部分上，其中印刷电路板部分是角度可调节的和/ 或相对于彼此成角度，同时维持接触焊盘和至少一个导电元件之间的连接，并且经由印刷电路板部分之间的弯曲边缘弯曲至少一个导电元件。 为了改善印刷电路板部分之间的电气和机械连接，本发明提供了导电元件沿着弯曲边缘比垂直于其更大的程度，如横截面所示。 用于制造该印刷电路板结构的相应方法如所示。