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1.Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board 有权
标题翻译: 铜散热材料,载体铜箔,连接器,端子,层压板,屏蔽材料,印刷线路板,金属加工构件,电子设备及制造印刷线路板的方法公开(公告)号:US20160120017A1
公开(公告)日:2016-04-28
申请号:US14919357
申请日:2015-10-21
发明人: HAJIME MOMOI , SATORU MORIOKA , TOSHIYUKI ONO , HIDETA ARAI , RYO FUKUCHI , ATSUSHI MIKI
IPC分类号: H05K1/02 , H05K7/20 , H01R13/03 , B32B38/10 , B32B15/01 , B32B15/04 , B32B15/20 , H01L23/373 , B32B3/26
CPC分类号: B32B15/20 , B32B3/263 , B32B7/12 , B32B15/01 , B32B15/043 , B32B15/08 , B32B15/18 , B32B27/18 , B32B27/20 , B32B27/281 , B32B27/304 , B32B27/322 , B32B27/34 , B32B27/36 , B32B27/38 , B32B37/02 , B32B38/10 , B32B2255/06 , B32B2255/205 , B32B2255/26 , B32B2307/202 , B32B2307/302 , B32B2307/538 , B32B2457/00 , B32B2457/08 , B32B2457/20 , B32B2457/202 , C22C9/06 , C25D3/12 , C25D3/38 , C25D7/06 , C25D7/0614 , C25D9/08 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H01M4/662 , H01R13/03 , H05K1/0204 , H05K1/09 , H05K3/025 , H05K3/108 , H05K2201/0338 , H05K2201/0355 , H05K2201/0358 , H01L2924/00
摘要: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.
摘要翻译: 提供具有令人满意的散热性能的铜散热材料。 铜散热材料在一个或两个表面上具有包含选自Cu,Co,Ni,W,P,Zn,Cr,Fe,Sn和Mo中的至少一种金属的合金层,其中,一个或两个表面的表面粗糙度Sz 通过激光显微镜使用波长为405nm的激光测量的两个表面为5μm以上。