Flat panel display and method for driving the same
    1.
    发明授权
    Flat panel display and method for driving the same 有权
    平板显示器及其驱动方法

    公开(公告)号:US07995023B2

    公开(公告)日:2011-08-09

    申请号:US11478169

    申请日:2006-06-28

    IPC分类号: G09G3/38

    摘要: A flat panel display and method for driving the same. The flat panel display includes a conductive substrate forming an image display unit having at least one thin film transistor and a pad unit including a plurality of terminals, wherein the conductive substrate is laminated with a plurality of insulating layers to form the image display unit and the pad unit; a substrate-exposing part for exposing the conductive substrate is formed by removing at least one area of the insulating layers formed on the pad unit; a system control panel for supplying a reverse bias voltage through the substrate-exposing part, wherein the system control panel is electrically connected with the pad unit; and a metal member for transferring the reverse bias voltage to the conductive substrate, wherein the metal member is formed between the substrate-exposing part and the system control panel.

    摘要翻译: 一种平板显示器及其驱动方法。 平板显示器包括形成具有至少一个薄膜晶体管的图像显示单元的导电基板和包括多个端子的焊盘单元,其中导电基板层叠有多个绝缘层以形成图像显示单元,并且 垫单位 通过去除在衬垫单元上形成的绝缘层的至少一个区域来形成用于暴露导电衬底的衬底暴露部分; 用于通过所述衬底暴露部分提供反向偏置电压的系统控制面板,其中所述系统控制面板与所述衬垫单元电连接; 以及用于将所述反向偏置电压传送到所述导电基板的金属构件,其中所述金属构件形成在所述基板曝光部和所述系统控制面板之间。

    Flat panel display and method for driving the same
    2.
    发明授权
    Flat panel display and method for driving the same 有权
    平板显示器及其驱动方法

    公开(公告)号:US07727823B2

    公开(公告)日:2010-06-01

    申请号:US11477101

    申请日:2006-06-27

    IPC分类号: H01L21/00 H01L21/84

    摘要: A flat panel display for preventing a thin film transistor from deteriorating due to voltage, static electricity, and external force, accidentally applied to a substrate, and a method for driving the same. The flat panel display includes a conductive substrate, at least one insulating layer formed on the conductive substrate, at least one thin film transistor formed on the conductive substrate, and a ground formed in a region of the conductive substrate to ground the conductive substrate. Thus, the deterioration of the thin film transistor that would be generated by voltage, static electricity, or external force, accidentally applied to the conductive substrate can be substantially prevented and the performance of the display is enhanced.

    摘要翻译: 用于防止薄膜晶体管由于电压,静电和外力而意外施加到基板的劣化的平板显示器及其驱动方法。 平板显示器包括导电基板,形成在导电基板上的至少一个绝缘层,形成在导电基板上的至少一个薄膜晶体管,以及形成在导电基板的区域中的接地导电基板的接地。 因此,可以基本上防止意外地施加到导电基板上的由电压,静电或外力产生的薄膜晶体管的劣化,从而提高显示器的性能。

    Thin film transistor and the manufacturing method thereof
    4.
    发明授权
    Thin film transistor and the manufacturing method thereof 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US07655951B2

    公开(公告)日:2010-02-02

    申请号:US11433177

    申请日:2006-05-12

    IPC分类号: H01L29/786

    摘要: A thin film transistor and a method for manufacturing the same capable of reducing a change in a threshold voltage of the thin film transistor formed on a flexible substrate. The thin film transistor includes: a substrate, the substrate being flexible; a buffer layer having a low dielectric constant from about 1.2 to about 4.0 and formed on the substrate; a semiconductor layer formed on the buffer layer; a gate electrode; first insulation layer formed between the gate electrode and the semiconductor layer; a second insulation layer formed on the semiconductor layer and the gate electrode; and a source/drain electrode electrically connected to the semiconductor layer through a contact hole formed in the second insulation layer. Therefore, the thin film transistor can reduce a change in its threshold voltage, thereby reducing changes in brightness, gray scale, contrast, etc., of light-emitting devices using the thin film transistor.

    摘要翻译: 一种薄膜晶体管及其制造方法,能够减小形成在柔性基板上的薄膜晶体管的阈值电压的变化。 所述薄膜晶体管包括:基板,所述基板是柔性的; 缓冲层,其介电常数为约1.2至约4.0,并形成在基底上; 形成在缓冲层上的半导体层; 栅电极; 形成在所述栅电极和所述半导体层之间的第一绝缘层; 形成在所述半导体层和所述栅电极上的第二绝缘层; 以及源极/漏极,其通过形成在第二绝缘层中的接触孔与半导体层电连接。 因此,薄膜晶体管可以减小其阈值电压的变化,从而减少使用薄膜晶体管的发光器件的亮度,灰度,对比度等的变化。

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    9.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
    半导体器件的制造方法

    公开(公告)号:US20110092032A1

    公开(公告)日:2011-04-21

    申请号:US12766958

    申请日:2010-04-26

    IPC分类号: H01L21/336

    CPC分类号: H01L29/78603 H01L21/84

    摘要: Provided is a manufacturing methods of a semiconductor device. The methods includes: forming an active layer on a first substrate; bonding a top surface of the active layer with a second substrate and separating the active layer from the first substrate; forming conductive impurity regions corresponding to source and drain regions of the active layer bonded on the second substrate; bonding a third substrate on a bottom surface of the active layer and removing the second substrate; and forming a gate electrode on a top between the conductive impurity regions of the active layer bonded on the third substrate and forming source and drain electrodes on the conductive impurity regions.

    摘要翻译: 提供半导体器件的制造方法。 所述方法包括:在第一基板上形成有源层; 将有源层的顶表面与第二衬底结合并将有源层与第一衬底分离; 形成对应于结合在所述第二基板上的所述有源层的源区和漏区的导电杂质区; 将第三衬底接合在有源层的底表面上并移除第二衬底; 以及在结合在第三基板上的有源层的导电杂质区之间的顶部上形成栅电极,并在导电杂质区上形成源电极和漏电极。

    METHOD OF AND APPARATUS FOR FORMING A METAL PATTERN
    10.
    发明申请
    METHOD OF AND APPARATUS FOR FORMING A METAL PATTERN 审中-公开
    用于形成金属图案的方法和装置

    公开(公告)号:US20120141665A1

    公开(公告)日:2012-06-07

    申请号:US13309807

    申请日:2011-12-02

    IPC分类号: H05K3/02 B05C5/00

    CPC分类号: B41F17/26 B05C1/0808

    摘要: Provided are methods of and apparatuses for forming a metal pattern. In the method, an initiator and a metal pattern are sequentially combined on a previously-formed bonding agent pattern improving adhesion and/or junction properties between the substrate and the metal. The bonding agent pattern may be formed using a reverse offset printing method. The metal pattern may be formed using an electroless electrochemical plating method. The metal pattern can be formed with improved uniformity in thickness and planar area.

    摘要翻译: 提供了用于形成金属图案的方法和装置。 在该方法中,引发剂和金属图案依次组合在预先形成的粘合剂图案上,从而提高基材和金属之间的粘合性和/或结合性。 粘合剂图案可以使用反胶版印刷法形成。 金属图案可以使用无电镀电镀法形成。 可以形成具有改善的厚度均匀性和平坦面积的金属图案。