摘要:
Disclosed herein is an LC aligning agent using diamine having dendron side chains. In detail, the present invention relates to a composition for an LC alignment film which employs diamine having dendron side chains to produce polyamic acid, followed by imidization. When the LC alignment film is applied to a liquid crystal display device, high heat resistance, high penetration in a visible ray range, excellent alignment, and a high voltage holding ratio are assured. Even though it contains a small amount of functional diamine, a high pretilt angle can be assured. Thus, the pretilt angle is easily controlled and a vertical aligning force is improved.
摘要:
Disclosed herein is a novel functional diamine compound having a dendron structure, polyamic acid which is produced using functional diamine, aromatic cyclic diamine, aliphatic cyclic acid dianhydride, and aromatic cyclic acid dianhydride, polyimide which is produced by imidizing polyamic acid, and an LC alignment film produced using polyimide. Even if the diamine compound is used in a small amount, it is possible to realize a high pretilt angle, thus the pretilt angle is easily controlled. Therefore, it can be used to produce an LC alignment film using a twisted nematic (TN) mode, in which the pretilt angle of liquid crystal is low, and a vertically aligned (VA) mode, which requires a high pretilt angle of about 90°.
摘要:
Provided is a semiconductor optical device having a current-confined structure. The device includes a first semiconductor layer of a first conductivity type which is formed on a semiconductor substrate and includes one or more material layers, a second semiconductor layer which is formed on the first semiconductor layer and includes one or more material layers, and a third semiconductor layer of a second conductivity type which is formed on the second semiconductor layer and includes one or more material layers. One or more layers among the first semiconductor layer, the second semiconductor, and the third semiconductor layer have a mesa structure. A lateral portion of at least one of the material layers constituting the first semiconductor layer, the second semiconductor layer, and the third semiconductor layer is recessed, and the recess is partially or wholly filled with an oxide layer, a nitride layer or a combination of them. The semiconductor optical device having the current-confined region is mechanically reliable, highly thermally conductive, and commercially preferable and can be used in a wavelength range for optical communications.
摘要:
Provided is a method for fabricating a semiconductor optical device that can be used as a reflecting semiconductor mirror or an optical filter, in which two or more types of semiconductor layers having different etch rates are alternately stacked, at least one type of semiconductor layers is selectively etched to form an air-gap structure, and an oxide or a nitride having a good heat transfer property is deposited so that the air gap is buried, whereby it is possible to effectively implement the semiconductor reflector or the optical filter having a high reflectance in a small period because of the large index contrast between the oxide or the nitride buried in the air gap and the semiconductor layer.
摘要:
A slit coater including an apparatus for supplying coating solution by a coating method using a slit nozzle, which is configured to minimize contamination of coating solution, utilizing a filtering function, and supplying a controlled amount of photosensitive solution to a slit nozzle. The slit coater further includes a table on which an object to be processed is mounted, a slit nozzle unit that applies coating solution onto a surface of the object to be processed, and a coating solution supply apparatus including a storage tank that stores the coating solution, a pump that supplies the coating solution stored in the storage tank to the slit nozzle unit, and a buffer tank that is in fluid communication with the pump and the storage tank.
摘要:
A multi-insert cap blow-molding method for molding a hollow plastic product which is integrally formed with elongate fastening members. Each fastening member is seated in a groove defined in a lower mold. Each fastening member is composed of an elongate outer insert cap and an inner insert cap which is positioned in the outer insert cap to be separated from a bottom surface of the outer insert cap and to divide a space defined in the outer insert cap into an upper space and a lower space. A hollow parison is positioned between an upper mold and the lower mold. Hot air is blown into the parison with the upper and lower molds enclosing the parison to mold the parison and integrally fuse a portion of the parison to an inner surface of the fastening member. Then, the resultant product which is cooled, discharged and finished.
摘要:
Methods of forming spacers on sidewalls of features of semiconductor devices and structures thereof are disclosed. A preferred embodiment comprises a semiconductor device including a workpiece and at least one feature disposed over the workpiece. A first spacer is disposed on the sidewalls of the at least one feature, the first spacer comprising a first material. A first liner is disposed over the first spacer and over a portion of the workpiece proximate the first spacer, the first liner comprising the first material. A second spacer is disposed over the first liner, the second spacer comprising a second material. A second liner is disposed over the second spacer, the second liner comprising the first material.
摘要:
A multi-insert cap blow-molding method for molding a hollow plastic product which is integrally formed with elongate fastening members. Each fastening member is seated in a groove defined in a lower mold. Each fastening member is composed of an elongate outer insert cap and an inner insert cap which is positioned in the outer insert cap to be separated from a bottom surface of the outer insert cap and to divide a space defined in the outer insert cap into an upper space and a lower space. A hollow parison is positioned between an upper mold and the lower mold. Hot air is blown into the parison with the upper and lower molds enclosing the parison to mold the parison and integrally fuse a portion of the parison to an inner surface of the fastening member. Then, the resultant product which is cooled, discharged and finished.
摘要:
Integrated circuit transistors may be fabricated by simultaneously removing a photoresist layer on a first active area of an integrated circuit substrate and a carbon-containing layer on a second active area of the integrated circuit substrate, to expose a nitride stress-generating layer on the second active area. A single mask may be used to define the second active area for removal of the photoresist layer on the first active area and for implanting source/drain regions into the second active area.
摘要:
A spoiler for a vehicle has an integral stop lamp cover. The stop lamp cover comprises a cover body configured to be open at an upper end thereof, and having a stop lamp insertion opening, a stop lamp receiving space, and a flange part formed on an upper end of the cover body; and an upper plate coupled to the cover body, having a size capable of covering the stop lamp receiving space, and defining the stop lamp receiving space and a parison fusing section to which a parison for forming a spoiler body is fused. The stop lamp cover is inserted into a mold when implementing the blow molding process, the flange part is fused to the outer surface of the spoiler body to be integrated with the material of the spoiler without requiring the use of a separate coupling means, and the parison is fused to the parison fusing section.