Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
    1.
    发明授权
    Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device 有权
    用于在发热装置中实现温度均匀性和热点冷却的方法和装置

    公开(公告)号:US07104312B2

    公开(公告)日:2006-09-12

    申请号:US10698304

    申请日:2003-10-30

    IPC分类号: F28F7/00

    摘要: A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

    摘要翻译: 一种控制与热交换器的热交换表面接触的热源的温度的方法,其中所述热交换表面沿着平面基本上对齐。 该方法包括将第一温度流体引导到热交换表面,其中第一温度流体沿着热交换表面与热源进行热交换。 该方法包括从热交换表面引导第二温度流体,其中流体被引导以最小化沿着热源的温度差。 通过优化和控制热交换器中的流体和热电阻来最小化温差。 对流体的阻力受传热特征,多个泵,固定和可变阀以及流体路径中的流量阻抗元件,流体的压力和流量控制等因素的尺寸,体积和表面积的影响。

    Liquid cooling loops for server applications
    6.
    发明申请
    Liquid cooling loops for server applications 有权
    用于服务器应用的液体冷却回路

    公开(公告)号:US20070201204A1

    公开(公告)日:2007-08-30

    申请号:US11707350

    申请日:2007-02-16

    IPC分类号: H05K7/20

    摘要: Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

    摘要翻译: 液体冷却溶液,用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板(MCP)。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP,服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中,用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板,流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

    Liquid cooling loops for server applications
    7.
    发明授权
    Liquid cooling loops for server applications 有权
    用于服务器应用的液体冷却回路

    公开(公告)号:US07599184B2

    公开(公告)日:2009-10-06

    申请号:US11707350

    申请日:2007-02-16

    IPC分类号: H05K7/20

    摘要: Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

    摘要翻译: 液体冷却溶液,用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板(MCP)。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP,服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中,用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板,流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

    Apparatus and method of efficient fluid delivery for cooling a heat producing device
    8.
    发明授权
    Apparatus and method of efficient fluid delivery for cooling a heat producing device 有权
    用于冷却发热装置的有效流体输送的装置和方法

    公开(公告)号:US07188662B2

    公开(公告)日:2007-03-13

    申请号:US11049313

    申请日:2005-02-01

    IPC分类号: F28D7/02

    摘要: A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

    摘要翻译: 热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。 热交换器包括热量从热源传递到流体的界面层。 歧管层耦合到界面层。 歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。 歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径,用于从界面层移除流体。 优选地,热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。 上层可以包括多个突出特征和多孔结构中的至少一个。 优选地,多孔结构沿着界面层设置。

    Apparatus and method of efficient fluid delivery for cooling a heat producing device
    9.
    发明申请
    Apparatus and method of efficient fluid delivery for cooling a heat producing device 有权
    用于冷却发热装置的有效流体输送的装置和方法

    公开(公告)号:US20050269061A1

    公开(公告)日:2005-12-08

    申请号:US11049313

    申请日:2005-02-01

    IPC分类号: H01L23/473 H05K7/20

    摘要: A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

    摘要翻译: 热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。 热交换器包括热量从热源传递到流体的界面层。 歧管层耦合到界面层。 歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。 歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径,用于从界面层移除流体。 优选地,热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。 上层可以包括多个突出特征和多孔结构中的至少一个。 优选地,多孔结构沿着界面层设置。