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    Methods of bonding pure rhenium to a substrate
    4.
    发明授权
    Methods of bonding pure rhenium to a substrate 有权
    将纯铼结合到基底上的方法

    公开(公告)号：US07998594B2

    公开(公告)日：2011-08-16

    申请号：US12028893

    申请日：2008-02-11

    申请人： Don Mittendorf ,  Scott Sperl

    发明人： Don Mittendorf ,  Scott Sperl

    IPC分类号： B32B15/04

    CPC分类号： C23C28/023 ,  B32B15/01 ,  C23C18/165 ,  C23C18/1692 ,  C23C18/32 ,  C25D3/50 ,  Y10T428/12771 ,  Y10T428/12778 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12931 ,  Y10T428/12944

    摘要： Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.

    摘要翻译： 提供了将纯铼粘合到包含材料的基底上的方法。 还提供了被配置为与另一部件摩擦接触的非润滑部件。 在一个实施例中，仅作为示例，一种方法包括在基底上设置共晶合金以形成内层，该共晶合金基本上由基础合金和一种或多种熔点降低剂组成，并且熔融温度较低 比基底材料的熔融温度和铼的熔融温度，将纯铼放置在层之间，并将层间加热至基本等于或大于共晶合金的熔融温度的温度，但也就是说 低于基底材料的熔融温度和纯铼的熔融温度，以将纯铼结合到基底上。

    METHODS OF BONDING PURE RHENIUM TO A SUBSTRATE
    5.
    发明申请
    METHODS OF BONDING PURE RHENIUM TO A SUBSTRATE 有权
    将纯铑与基材结合的方法

    公开(公告)号：US20090202863A1

    公开(公告)日：2009-08-13

    申请号：US12028893

    申请日：2008-02-11

    申请人： Don Mittendorf ,  Scott Sperl

    发明人： Don Mittendorf ,  Scott Sperl

    IPC分类号： B32B15/01 ,  C25D3/00 ,  C23C16/06 ,  C23C14/34 ,  B05D3/02 ,  C23C4/08

    CPC分类号： C23C28/023 ,  B32B15/01 ,  C23C18/165 ,  C23C18/1692 ,  C23C18/32 ,  C25D3/50 ,  Y10T428/12771 ,  Y10T428/12778 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12931 ,  Y10T428/12944

    摘要： Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.

    摘要翻译： 提供了将纯铼粘合到包含材料的基底上的方法。 还提供了被配置为与另一部件摩擦接触的非润滑部件。 在一个实施例中，仅作为示例，一种方法包括在基底上设置共晶合金以形成内层，该共晶合金基本上由基础合金和一种或多种熔点降低剂组成，并且熔融温度较低 比基底材料的熔融温度和铼的熔融温度，将纯铼放置在层之间，并将层间加热至基本等于或大于共晶合金的熔融温度的温度，但也就是说 低于基底材料的熔融温度和纯铼的熔融温度，以将纯铼结合到基底上。

    Blades, turbine blade assemblies, and methods of forming blades
    7.
    发明授权
    Blades, turbine blade assemblies, and methods of forming blades 有权
    叶片，涡轮叶片组件以及形成叶片的方法

    公开(公告)号：US08535005B2

    公开(公告)日：2013-09-17

    申请号：US12771789

    申请日：2010-04-30

    申请人： Don Mittendorf

    发明人： Don Mittendorf

    IPC分类号： F01D5/18

    CPC分类号： F01D5/28 ,  C30B11/00 ,  C30B29/52 ,  F01D5/288 ,  F05C2201/0466 ,  F05D2230/90 ,  F05D2240/307 ,  F05D2300/134 ,  F05D2300/143 ,  F05D2300/607 ,  F05D2300/611 ,  Y02T50/67

    摘要： Blades, turbine blade assemblies, and methods of forming blades are provided. The blade includes an airfoil including a convex suction side wall, a concave pressure side wall, a leading edge, a trailing edge, a root, and a tip, the convex suction side wall, the concave pressure side wall, and the tip each including interior surfaces that together define an internal cooling circuit, the airfoil including a single crystal superalloy, and a cladding layer disposed over the tip, the cladding layer including a zirconia grain stabilized platinum alloy.

    摘要翻译： 提供叶片，涡轮叶片组件以及形成叶片的方法。 叶片包括具有凸吸入侧壁，凹压侧壁，前缘，后缘，根部和顶端的翼型件，凸起的吸入侧壁，凹形压力侧壁和端部各自包括 共同限定内部冷却回路的内表面，包括单晶超合金的翼型以及设置在尖端上的包层，所述包覆层包括氧化锆晶粒稳定的铂合金。

    Methods of bonding pure rhenium to a substrate
    8.
    发明授权
    Methods of bonding pure rhenium to a substrate 有权
    将纯铼结合到基底上的方法

    公开(公告)号：US08118989B2

    公开(公告)日：2012-02-21

    申请号：US13208108

    申请日：2011-08-11

    申请人： Don Mittendorf ,  Scott Sperl

    发明人： Don Mittendorf ,  Scott Sperl

    IPC分类号： C25D5/50 ,  C25D3/00 ,  C23C16/06 ,  C23C14/34 ,  C23C4/08

    CPC分类号： C23C28/023 ,  B32B15/01 ,  C23C18/165 ,  C23C18/1692 ,  C23C18/32 ,  C25D3/50 ,  Y10T428/12771 ,  Y10T428/12778 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12931 ,  Y10T428/12944

    摘要： Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.

    摘要翻译： 提供了将纯铼粘合到包含材料的基底上的方法。 还提供了被配置为与另一部件摩擦接触的非润滑部件。 在一个实施例中，仅作为示例，一种方法包括在基底上设置共晶合金以形成内层，该共晶合金基本上由基础合金和一种或多种熔点降低剂组成，并且熔融温度较低 比基底材料的熔融温度和铼的熔融温度，将纯铼放置在层之间，并将层间加热至基本等于或大于共晶合金的熔融温度的温度，但也就是说 低于基底材料的熔融温度和纯铼的熔融温度，以将纯铼结合到基底上。

    METHODS OF BONDING PURE RHENIUM TO A SUBSTRATE
    9.
    发明申请
    METHODS OF BONDING PURE RHENIUM TO A SUBSTRATE 有权
    将纯铑与基材结合的方法

    公开(公告)号：US20110293845A1

    公开(公告)日：2011-12-01

    申请号：US13208108

    申请日：2011-08-11

    申请人： Don Mittendorf ,  Scott Sperl

    发明人： Don Mittendorf ,  Scott Sperl

    IPC分类号： B05D1/00 ,  C23C4/08 ,  C25D5/50 ,  C23C14/34 ,  C23C16/06 ,  B05D3/02 ,  B05D7/14

    CPC分类号： C23C28/023 ,  B32B15/01 ,  C23C18/165 ,  C23C18/1692 ,  C23C18/32 ,  C25D3/50 ,  Y10T428/12771 ,  Y10T428/12778 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12931 ,  Y10T428/12944

    摘要： Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.

    摘要翻译： 提供了将纯铼粘合到包含材料的基底上的方法。 还提供了被配置为与另一部件摩擦接触的非润滑部件。 在一个实施例中，仅作为示例，一种方法包括在基底上设置共晶合金以形成内层，该共晶合金基本上由基础合金和一种或多种熔点降低剂组成，并且熔融温度较低 比基底材料的熔融温度和铼的熔融温度，将纯铼放置在层之间，并将层间加热至基本等于或大于共晶合金的熔融温度的温度，但也就是说 低于基底材料的熔融温度和纯铼的熔融温度，以将纯铼结合到基底上。