公开(公告)号：US08129803B2

公开(公告)日：2012-03-06

申请号：US12804213

申请日：2010-07-16

Applicant: John R. Martin ,  Timothy J. Brosnihan ,  Craig Core ,  Thomas Kieran Nunan ,  Jason Weigold ,  Xin Zhang

Inventor： John R. Martin ,  Timothy J. Brosnihan ,  Craig Core ,  Thomas Kieran Nunan ,  Jason Weigold ,  Xin Zhang

IPC: H01L21/02 ,  H01L21/84

CPC classification number: H04R3/00 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81C1/00182 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/15151 ,  H04R19/005 ,  H04R2499/11

Abstract: A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.

Abstract translation: 微机械麦克风由硅或绝缘体上硅（SOI）晶片形成。 用于麦克风的固定感测电极由晶片的顶部硅层形成。 通过沉积形成结构的至少一个氧化物层，然后通过形成的沟槽从顶部硅层的背面去除结构物下面的氧化物的一部分，形成在顶部硅层前侧上的各种多晶硅麦克风结构 通过顶层硅层。 沟槽允许声波从顶部硅层的背面到达隔膜。 在SOI晶片中，通过底部硅层和中间氧化物层形成空腔，以露出沟槽，以去除氧化物并允许声波到达隔膜。 惯性传感器可以形成在相同的晶片上，其中各种惯性传感器结构基本上在同一时间形成并且使用与对应的麦克风结构基本上相同的过程。

公开(公告)号：US20100054495A1

公开(公告)日：2010-03-04

申请号：US12546073

申请日：2009-08-24

Applicant: Kieran P. Harney ,  Jason Weigold ,  Gary Elko

Inventor： Kieran P. Harney ,  Jason Weigold ,  Gary Elko

IPC: H04R3/00

CPC classification number: H04R1/04 ,  H04M1/0214 ,  H04M1/03 ,  H04M1/035 ,  H04M1/19 ,  H04M1/6008 ,  H04R1/245 ,  H04R3/005 ,  H04R2410/05

Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The first microphone apparatus may have a first back-side cavity and the second microphone may have a second back-side cavity. The first and second back-side cavities may be fluidly unconnected. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.

Abstract translation: 麦克风系统具有与第一和第二麦克风装置耦合的基座。 第一麦克风装置能够产生具有噪声分量的第一输出信号，而第二麦克风装置能够产生第二输出信号。 第一麦克风装置可以具有第一后侧腔，并且第二麦克风可以具有第二后侧空腔。 第一和第二后侧空腔可以是流体不连接的。 该系统还具有与第一麦克风装置和第二麦克风装置操作耦合的组合逻辑。 组合逻辑使用第二输出信号从第一输出信号中去除噪声分量的至少一部分。

公开(公告)号：US08270634B2

公开(公告)日：2012-09-18

申请号：US11828049

申请日：2007-07-25

Applicant: Kieran P. Harney ,  Jason Weigold ,  Gary Elko

Inventor： Kieran P. Harney ,  Jason Weigold ,  Gary Elko

IPC: H04B15/00

CPC classification number: H04R3/005 ,  H04R1/245 ,  H04R2410/05

Abstract: A microphone system has a primary microphone for producing a primary signal, a secondary microphone for producing a secondary signal, and a selector operatively coupled with both the primary microphone and the secondary microphone. The system also has an output for delivering an output audible signal principally produced by one of the to microphones. The selector selectively permits either 1) at least a portion of the primary signal and/or 2) at least a portion of the secondary signal to be forwarded to the output as a function of the noise in the primary signal.

Abstract translation: 麦克风系统具有用于产生主信号的主麦克风，用于产生辅助信号的次麦克风，以及可操作地与主麦克风和次麦克风耦合的选择器。 该系统还具有用于传送主要由麦克风之一产生的输出可听信号的输出。 选择器选择性地允许1）主信号的至少一部分和/或2）辅助信号的至少一部分作为主信号中的噪声的函数被转发到输出。

公开(公告)号：US08130979B2

公开(公告)日：2012-03-06

申请号：US11492314

申请日：2006-07-25

Applicant: Kieran P. Harney ,  Jason Weigold ,  Gary Elko

Inventor： Kieran P. Harney ,  Jason Weigold ,  Gary Elko

IPC: H04B15/00

CPC classification number: H04R3/005 ,  H04M1/035 ,  H04M1/19 ,  H04M1/6008 ,  H04R1/245 ,  H04R2410/05

Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.

Abstract translation: 麦克风系统具有与第一和第二麦克风装置耦合的基座。 第一麦克风装置能够产生具有噪声分量的第一输出信号，而第二麦克风装置能够产生第二输出信号。 该系统还具有与第一麦克风装置和第二麦克风装置操作耦合的组合逻辑。 组合逻辑使用第二输出信号从第一输出信号中去除噪声分量的至少一部分。

公开(公告)号：US20050255677A1

公开(公告)日：2005-11-17

申请号：US11044612

申请日：2005-01-27

Applicant: Jason Weigold ,  Thomas Chen ,  Denis O'Kane ,  Claire Leveugle ,  Stephen Brown ,  William Nevin

Inventor： Jason Weigold ,  Thomas Chen ,  Denis O'Kane ,  Claire Leveugle ,  Stephen Brown ,  William Nevin

IPC: B81B7/00 ,  B81B7/02 ,  H01L21/322 ,  H01L21/762 ,  H01L21/30

CPC classification number: H01L21/3226 ,  B81B7/0038 ,  B81B7/02

Abstract: An integrated circuit with an interface between a semiconductor layer (having a selected region) and a second layer has a barrier with a gettering effect that 1) substantially circumscribes the selected region and 2) extends to the interface. Despite the fact that its gettering effect extends to the interface, the barrier does not penetrate the second layer.

Abstract translation: 具有半导体层（具有选定区域）和第二层之间的界面的集成电路具有阻挡层，其具有吸气效应，其1）基本上限制所选择的区域，以及2）延伸到界面。 尽管它的吸气效应延伸到界面，但屏障并不穿透第二层。

公开(公告)号：US20080049953A1

公开(公告)日：2008-02-28

申请号：US11828049

申请日：2007-07-25

Applicant: Kieran Harney ,  Jason Weigold ,  Gary Elko

Inventor： Kieran Harney ,  Jason Weigold ,  Gary Elko

IPC: H04B15/00

CPC classification number: H04R3/005 ,  H04R1/245 ,  H04R2410/05

Abstract: A microphone system has a primary microphone for producing a primary signal, a secondary microphone for producing a secondary signal, and a selector operatively coupled with both the primary microphone and the secondary microphone. The system also has an output for delivering an output audible signal principally produced by one of the to microphones. The selector selectively permits either 1) at least a portion of the primary signal and/or 2) at least a portion of the secondary signal to be forwarded to the output as a function of the noise in the primary signal.

Abstract translation: 麦克风系统具有用于产生主信号的主麦克风，用于产生辅助信号的次麦克风，以及可操作地与主麦克风和次麦克风耦合的选择器。 该系统还具有用于传送主要由麦克风之一产生的输出可听信号的输出。 选择器选择性地允许1）主信号的至少一部分和/或2）辅助信号的至少一部分作为主信号中的噪声的函数被转发到输出。

公开(公告)号：US20070092983A1

公开(公告)日：2007-04-26

申请号：US11613003

申请日：2006-12-19

Applicant: Jason Weigold

Inventor： Jason Weigold

IPC: H01L21/00

CPC classification number: B81C1/00944 ,  B81B2201/0257 ,  H04R19/005

Abstract: A method of forming a microphone forms a backplate, and a flexible diaphragm on at least a portion of a wet etch removable sacrificial layer. The method adds a wet etch resistant material, where a portion of the wet etch resistant material is positioned between the diaphragm and the backplate to support the diaphragm. Some of the wet etch resistant material is not positioned between the diaphragm and backplate. The method then removes the sacrificial material before removing any of the wet etch resistant material added during the prior noted act of adding. The wet etch resistant material then is removed substantially in its entirety after removing at least part of the sacrificial material.

Abstract translation: 形成麦克风的方法在湿蚀刻可移除牺牲层的至少一部分上形成背板和柔性隔膜。 该方法添加了耐湿蚀刻材料，其中一部分耐湿蚀刻材料位于隔膜和背板之间以支撑隔膜。 一些耐湿蚀刻材料不位于隔膜和背板之间。 然后，该方法在去除在先前提及的添加作用之前添加的任何耐湿蚀蚀材料之前，去除牺牲材料。 然后在去除至少部分牺牲材料之后基本上全部除去耐湿蚀刻材料。

公开(公告)号：US20070047744A1

公开(公告)日：2007-03-01

申请号：US11492314

申请日：2006-07-25

Applicant: Kieran Harney ,  Jason Weigold ,  Gary Elko

Inventor： Kieran Harney ,  Jason Weigold ,  Gary Elko

IPC: H04R3/00

CPC classification number: H04R3/005 ,  H04M1/035 ,  H04M1/19 ,  H04M1/6008 ,  H04R1/245 ,  H04R2410/05

Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.

Abstract translation: 麦克风系统具有与第一和第二麦克风装置耦合的基座。 第一麦克风装置能够产生具有噪声分量的第一输出信号，而第二麦克风装置能够产生第二输出信号。 该系统还具有与第一麦克风装置和第二麦克风装置操作耦合的组合逻辑。 组合逻辑使用第二输出信号从第一输出信号中去除噪声分量的至少一部分。

公开(公告)号：US20060237806A1

公开(公告)日：2006-10-26

申请号：US11113925

申请日：2005-04-25

Applicant: John Martin ,  Timothy Brosnihan ,  Craig Core ,  Thomas Kieran Nunan ,  Jason Weigold ,  Xin Zhang

Inventor： John Martin ,  Timothy Brosnihan ,  Craig Core ,  Thomas Kieran Nunan ,  Jason Weigold ,  Xin Zhang

IPC: H01L29/84 ,  H01L21/00

CPC classification number: H04R3/00 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81C1/00182 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/15151 ,  H04R19/005 ,  H04R2499/11

Abstract: A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.

Abstract translation: 微机械麦克风由硅或绝缘体上硅（SOI）晶片形成。 用于麦克风的固定感测电极由晶片的顶部硅层形成。 通过沉积形成结构的至少一个氧化物层，然后通过形成的沟槽从顶部硅层的背面去除结构物下面的氧化物的一部分，形成在顶部硅层前侧上的各种多晶硅麦克风结构 通过顶层硅层。 沟槽允许声波从顶部硅层的背面到达隔膜。 在SOI晶片中，通过底部硅层和中间氧化物层形成空腔，以露出沟槽，以去除氧化物并允许声波到达隔膜。 惯性传感器可以形成在相同的晶片上，其中各种惯性传感器结构基本上在同一时间形成并且使用与对应的麦克风结构基本上相同的过程。

公开(公告)号：US20060115958A1

公开(公告)日：2006-06-01

申请号：US11262303

申请日：2005-10-28

Applicant: Jason Weigold ,  Thomas Chen ,  Denis O'Kane ,  David Collins ,  Andrew Bain

Inventor： Jason Weigold ,  Thomas Chen ,  Denis O'Kane ,  David Collins ,  Andrew Bain

IPC: H01L21/84 ,  H01L21/30

CPC classification number: H01L21/76251 ,  H01L21/2007 ,  H01L21/84

Abstract: A method of forming a SOI wafer obtains an intermediate apparatus having a first wafer, a second wafer, and an insulator material bonding the first and second wafers together. The first wafer has an oxygen precipitate concentration sufficient for gettering. The method reduces the profile of at least a portion of the first wafer to form an exposed surface, and adds a layer of material to the exposed surface of the first wafer. The layer of material substantially integrates with the first wafer to have substantially the same structure.

Abstract translation: 形成SOI晶片的方法获得具有将第一和第二晶片接合在一起的第一晶片，第二晶片和绝缘体材料的中间设备。 第一晶片具有足以吸除的氧沉淀浓度。 该方法减少了第一晶片的至少一部分的轮廓以形成暴露的表面，并且在第一晶片的暴露表面上添加一层材料。 材料层基本上与第一晶片集成以具有基本上相同的结构。