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    Showerhead for Processing Chamber
    4.
    发明申请
    Showerhead for Processing Chamber 有权
    加工室喷头

    公开(公告)号：US20120156877A1

    公开(公告)日：2012-06-21

    申请号：US12973845

    申请日：2010-12-20

    Applicant: Lipyeow Yap ,  Jay DeDontney ,  Shouqian Shao ,  Jason Wright

    Inventor： Lipyeow Yap ,  Jay DeDontney ,  Shouqian Shao ,  Jason Wright

    IPC: H01L21/302 ,  B08B7/00 ,  B05C5/00 ,  H01L21/31 ,  B05B7/16 ,  H01L21/306

    CPC classification number: C23C16/45565 ,  C23C16/4557 ,  C23C16/45572 ,  C23C16/45574 ,  C23C16/5096

    Abstract: A top assembly for a processing chamber having a back plate and a hub is provided. The back plate has a first portion and a second portion. The first portion is connected to the second portion through a central region of the back plate, wherein a gap is defined between opposing surfaces of the first and second portions outside the central region. The first portion includes an embedded heating element. The hub is affixed to a top surface of the second portion of the back plate over the central region. The hub has a top surface with a plurality of channel openings defined within a central region of the hub and a bottom surface having a central extension with a plurality of channels defined therethrough. The bottom surface includes an annular extension spaced apart from the central extension.

    Abstract translation: 提供了具有背板和毂的用于处理室的顶部组件。 背板具有第一部分和第二部分。 第一部分通过背板的中心区域连接到第二部分，其中在中心区域外部的第一和第二部分的相对表面之间限定间隙。 第一部分包括嵌入式加热元件。 轮毂在中心区域上固定在背板的第二部分的顶表面上。 毂具有顶表面，其具有限定在毂的中心区域内的多个通道开口，底面具有中心延伸部，多个通道限定在其中。 底表面包括与中心延伸部间隔开的环形延伸部。

    High productivity vapor processing system
    5.
    发明授权
    High productivity vapor processing system 有权
    高效蒸汽处理系统

    公开(公告)号：US08900364B2

    公开(公告)日：2014-12-02

    申请号：US13306508

    申请日：2011-11-29

    Applicant: Jason Wright

    Inventor： Jason Wright

    IPC: C23C16/455 ,  C23F1/00 ,  H01L21/306 ,  C23C16/06 ,  C23C16/22

    CPC classification number: C23C16/4412 ,  C23C16/45565

    Abstract: A processing chamber is provided. The processing chamber includes a lid having a plurality of valves affixed thereto, the plurality of valves operable to enable process gases to flow into the chamber. The chamber includes a bottom portion, where the bottom portion includes a base and side walls extending from the base. A surface of the base is configured to support a substrate. A showerhead is affixed to a bottom surface of the lid. A bottom surface of the showerhead is configured to include a central port for providing process gases into the chamber. The central port is surrounded by an annular pump channel. The annular pump channel is surrounded by an annular purge channel, where a first ridge separates the delivery region and the annular pump channel and a second ridge separates the annular pump channel and the annular purge channel.

    Abstract translation: 提供处理室。 处理室包括具有固定到其上的多个阀的盖，多个阀可操作以使处理气体能够流入室中。 该腔室包括底部，底部包括底座和从基座延伸的侧壁。 基底的表面构造成支撑基底。 淋浴头固定在盖的底面上。 喷头的底表面构造成包括用于将工艺气体提供到室中的中心端口。 中央港口环绕着一个环形的泵通道。 环形泵通道被环形吹扫通道包围，其中第一脊分开输送区域和环形泵通道，第二脊分隔环形泵通道和环形清洗通道。

    Showerhead for processing chamber
    6.
    发明授权
    Showerhead for processing chamber 有权
    处理室用喷头

    公开(公告)号：US08733280B2

    公开(公告)日：2014-05-27

    申请号：US12973845

    申请日：2010-12-20

    Applicant: Lipyeow Yap ,  Jay DeDontney ,  Shouqian Shao ,  Jason Wright

    Inventor： Lipyeow Yap ,  Jay DeDontney ,  Shouqian Shao ,  Jason Wright

    IPC: C23C16/455 ,  C23C16/505 ,  H01L21/3065

    CPC classification number: C23C16/45565 ,  C23C16/4557 ,  C23C16/45572 ,  C23C16/45574 ,  C23C16/5096

    Abstract: A top assembly for a processing chamber having a back plate and a hub is provided. The back plate has a first portion and a second portion. The first portion is connected to the second portion through a central region of the back plate, wherein a gap is defined between opposing surfaces of the first and second portions outside the central region. The first portion includes an embedded heating element. The hub is affixed to a top surface of the second portion of the back plate over the central region. The hub has a top surface with a plurality of channel openings defined within a central region of the hub and a bottom surface having a central extension with a plurality of channels defined therethrough. The bottom surface includes an annular extension spaced apart from the central extension.

    Abstract translation: 提供了具有背板和毂的用于处理室的顶部组件。 背板具有第一部分和第二部分。 第一部分通过背板的中心区域连接到第二部分，其中在中心区域外部的第一和第二部分的相对表面之间限定间隙。 第一部分包括嵌入式加热元件。 轮毂在中心区域上固定在背板的第二部分的顶表面上。 毂具有顶表面，其具有限定在毂的中心区域内的多个通道开口，底面具有中心延伸部，多个通道限定在其中。 底表面包括与中心延伸部间隔开的环形延伸部。

    METHODS FOR IMPROVING WAFER TEMPERATURE UNIFORMITY
    7.
    发明申请
    METHODS FOR IMPROVING WAFER TEMPERATURE UNIFORMITY 审中-公开
    改善温度均匀性的方法

    公开(公告)号：US20130164948A1

    公开(公告)日：2013-06-27

    申请号：US13335261

    申请日：2011-12-22

    Applicant: Martin Romero ,  Jason Wright

    Inventor： Martin Romero ,  Jason Wright

    IPC: H01L21/26

    CPC classification number: C23C16/45565 ,  C23C16/46 ,  C23C16/52 ,  H01L21/67115

    Abstract: A method of improving temperature uniformity across a wafer or substrate is provided. The inventors have discovered that thermal radiation reflected from the showerhead injector affects the temperature uniformity across the wafer. Temperature uniformity across the wafer, particularly from the center to edge of the wafer, is improved by controlling the reflected energy from the showerhead. Control of the reflected energy from the showerhead is achieved by a variety of means, including changing the emissivity of the showerhead, creating different zones of emissivity of the showerhead, selectively heating the showerhead, varying the distance between the showerhead and the wafer, and increasing reflectivity of the showerhead in selected regions by employing an ring configured to emit thermal radiation to the showerhead which is then reflected back to the wafer.

    Abstract translation: 提供了一种改善晶片或衬底温度均匀性的方法。 发明人已经发现，从喷头喷射器反射的热辐射影响晶片上的温度均匀性。 通过控制来自喷头的反射能量来改善晶片上的温度均匀性，特别是从晶片的中心到边缘的温度均匀性。 通过各种手段来控制来自喷头的反射能量，包括改变喷头的发射率，产生喷头的不同发射率区域，选择性地加热喷头，改变喷头和晶片之间的距离，并增加 通过使用被配置为向喷头喷射热辐射的环，所述喷头在所选择的区域中的反射率，其然后被反射回到晶片。

    COMBINATORIAL DEPOSITION BASED ON A SPOT APPARATUS
    8.
    发明申请
    COMBINATORIAL DEPOSITION BASED ON A SPOT APPARATUS 审中-公开
    基于SPOT装置的组合沉积

    公开(公告)号：US20130125818A1

    公开(公告)日：2013-05-23

    申请号：US13302097

    申请日：2011-11-22

    Applicant: Jason Wright ,  Tony Chiang ,  Chi-I Lang

    Inventor： Jason Wright ,  Tony Chiang ,  Chi-I Lang

    IPC: C23C16/455 ,  C23C16/50

    CPC classification number: C23C16/45565 ,  C23C16/54

    Abstract: In some embodiments of the present invention, one or more small spot showerhead apparatus are used to deposit materials using CVD, PECVD, ALD, or PEALD on small spots in a site isolated, combinatorial manner. The small spot showerheads may be configured within a larger combinatorial showerhead to allow multi-layer film stacks to be deposited in a combinatorial manner.

    Abstract translation: 在本发明的一些实施例中，使用一个或多个小型喷头头装置，以分离，组合的方式在小斑点上沉积使用CVD，PECVD，ALD或PEALD的材料。 小型喷头可配置在更大的组合喷淋头内，以允许以组合方式沉积多层胶片堆叠。

    Substrate Processing Fluid Delivery System and Method
    9.
    发明申请
    Substrate Processing Fluid Delivery System and Method 审中-公开
    基板加工流体输送系统和方法

    公开(公告)号：US20130152857A1

    公开(公告)日：2013-06-20

    申请号：US13327597

    申请日：2011-12-15

    Applicant: Jason Wright ,  Tony P. Chiang

    Inventor： Jason Wright ,  Tony P. Chiang

    IPC: C23C16/455 ,  F15D1/00

    CPC classification number: C23C16/4482 ,  Y10T137/0318 ,  Y10T137/5283

    Abstract: Embodiments provided herein describe substrate processing fluid delivery systems and methods. The substrate processing fluid delivery systems include a flow regulator. A fluid conduit assembly is coupled to the flow regulator and a processing chamber of a substrate processing apparatus. A plurality of processing fluid containers is coupled to the fluid conduit assembly. A plurality of valves is coupled to the fluid conduit assembly. The plurality of valves are configurable to selectively place each of the plurality of processing fluid containers in fluid communication with only the flow regulator or the processing chamber of the substrate processing apparatus through the fluid conduit assembly.

    Abstract translation: 本文提供的实施方案描述了基底处理流体递送系统和方法。 基板处理流体输送系统包括流量调节器。 流体导管组件联接到流量调节器和衬底处理装置的处理室。 多个处理流体容器联接到流体导管组件。 多个阀联接到流体导管组件。 多个阀可配置成选择性地将多个处理流体容器中的每一个通过流体导管组件与基板处理装置的流量调节器或处理室流体连通。

    HIGH PRODUCTIVITY VAPOR PROCESSING SYSTEM
    10.
    发明申请
    HIGH PRODUCTIVITY VAPOR PROCESSING SYSTEM 有权
    高生产率蒸汽加工系统

    公开(公告)号：US20130133580A1

    公开(公告)日：2013-05-30

    申请号：US13306508

    申请日：2011-11-29

    Applicant: Jason Wright

    Inventor： Jason Wright

    IPC: C23C16/455

    CPC classification number: C23C16/4412 ,  C23C16/45565

    Abstract: A processing chamber is provided. The processing chamber includes a lid having a plurality of valves affixed thereto, the plurality of valves operable to enable process gases to flow into the chamber. The chamber includes a bottom portion, where the bottom portion includes a base and side walls extending from the base. A surface of the base is configured to support a substrate. A showerhead is affixed to a bottom surface of the lid. A bottom surface of the showerhead is configured to include a central port for providing process gases into the chamber. The central port is surrounded by an annular pump channel. The annular pump channel is surrounded by an annular purge channel, where a first ridge separates the delivery region and the annular pump channel and a second ridge separates the annular pump channel and the annular purge channel.

    Abstract translation: 提供处理室。 处理室包括具有固定到其上的多个阀的盖，多个阀可操作以使处理气体能够流入室中。 该腔室包括底部，底部包括底座和从基座延伸的侧壁。 基底的表面构造成支撑基底。 淋浴头固定在盖的底面上。 喷头的底表面构造成包括用于将工艺气体提供到室中的中心端口。 中央港口环绕着一个环形的泵通道。 环形泵通道被环形吹扫通道包围，其中第一脊分开输送区域和环形泵通道，第二脊分隔环形泵通道和环形清洗通道。

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