公开(公告)号：US07836935B2

公开(公告)日：2010-11-23

申请号：US12105600

申请日：2008-04-18

申请人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk, Jr. ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

发明人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk, Jr. ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

IPC分类号： B32B37/00

CPC分类号： B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

摘要翻译： 一种用于为多层陶瓷芯片载体层压层提供均匀的轴向载荷分布的装置，包括：底板，其被配置为在其上支撑多个生片层，所述底板具有至少一个弹性安装的负载支撑杆，其邻近所述底座的外边缘设置 盘子。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。

公开(公告)号：US08156990B2

公开(公告)日：2012-04-17

申请号：US12105494

申请日：2008-04-18

申请人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk, Jr. ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

发明人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk, Jr. ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

IPC分类号： B32B37/00

CPC分类号： B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

摘要翻译： 一种用于为多层陶瓷芯片载体层压层提供均匀的轴向载荷分布的装置，包括：底板，其被配置为在其上支撑多个生片层，所述底板具有至少一个弹性安装的负载支撑杆，其邻近所述底座的外边缘设置 盘子。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。

公开(公告)号：US07947143B2

公开(公告)日：2011-05-24

申请号：US12105622

申请日：2008-04-18

申请人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk, Jr. ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

发明人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk, Jr. ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

IPC分类号： B32B37/00

CPC分类号： B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

摘要翻译： 一种用于为多层陶瓷芯片载体层压层提供均匀的轴向载荷分布的装置，包括：底板，其被配置为在其上支撑多个生片层，所述底板具有至少一个弹性安装的负载支撑杆，其邻近所述底座的外边缘设置 盘子。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。

公开(公告)号：US20080190565A1

公开(公告)日：2008-08-14

申请号：US12105494

申请日：2008-04-18

申请人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

发明人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

IPC分类号： B32B37/00

CPC分类号： B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

摘要翻译： 一种用于为多层陶瓷芯片载体层压层提供均匀的轴向载荷分布的装置，包括：底板，其被配置为在其上支撑多个生片层，所述底板具有至少一个弹性安装的负载支撑杆，其邻近所述底座的外边缘设置 盘子。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。

公开(公告)号：US20080190545A1

公开(公告)日：2008-08-14

申请号：US12105622

申请日：2008-04-18

申请人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

发明人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

IPC分类号： B32B37/26 ,  B32B37/10

CPC分类号： B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

摘要翻译： 一种用于为多层陶瓷芯片载体层压层提供均匀的轴向载荷分布的装置，包括：底板，其被配置为在其上支撑多个生片层，所述底板具有至少一个弹性安装的负载支撑杆，其邻近所述底座的外边缘设置 盘子。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。

公开(公告)号：US20080190566A1

公开(公告)日：2008-08-14

申请号：US12105600

申请日：2008-04-18

申请人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

发明人： Jay A. Bunt ,  Donald W. Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin R. Gottschalk ,  Lisa A. Hamilton ,  Thomas A. Kline ,  Mark J. LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga A. Otieno ,  Renee L. Weisman

IPC分类号： B32B37/00

CPC分类号： B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

公开(公告)号：US20070113950A1

公开(公告)日：2007-05-24

申请号：US11164437

申请日：2005-11-22

申请人： Jay Bunt ,  Donald Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin Gottschalk ,  Lisa Hamilton ,  Thomas Kline ,  Mark LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga Otieno ,  Renee Weisman

发明人： Jay Bunt ,  Donald Diangelo ,  Cristian Docu ,  Thomas Foley ,  Melvin Gottschalk ,  Lisa Hamilton ,  Thomas Kline ,  Mark LaPlante ,  Hsichang Liu ,  Sebastian Loscerbo ,  Govindarajan Natarajan ,  Olga Otieno ,  Renee Weisman

IPC分类号： C03B29/00 ,  B32B37/00 ,  B29C65/00

CPC分类号： B32B37/0007 ,  B32B37/26 ,  B32B2315/02 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2203/0169 ,  H05K2203/068 ,  Y10T156/1052 ,  Y10T156/108

摘要： An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

摘要翻译： 一种用于为多层陶瓷芯片载体层压层提供均匀的轴向载荷分布的装置，包括：底板，其被配置为在其上支撑多个生片层，所述底板具有至少一个弹性安装的负载支撑杆，其邻近所述底座的外边缘设置 盘子。 负载支撑杆安装在一个或多个偏压构件上，使得支撑杆的顶表面在基板的顶表面上延伸选定的距离。

公开(公告)号：US06562169B2

公开(公告)日：2003-05-13

申请号：US09765027

申请日：2001-01-17

申请人： Govindarajan Natarajan ,  Raschid J. Bezama ,  Jon A. Casey ,  Amy C. Flack ,  Robert W. Pasco ,  Arnold W. Terpening ,  Renee L. Weisman

发明人： Govindarajan Natarajan ,  Raschid J. Bezama ,  Jon A. Casey ,  Amy C. Flack ,  Robert W. Pasco ,  Arnold W. Terpening ,  Renee L. Weisman

IPC分类号： B32B3118

CPC分类号： B32B18/00 ,  C04B2235/6562 ,  C04B2237/068 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/366 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T156/1056 ,  Y10T156/1057

摘要： A method of processing greensheets, wherein the following steps are performed: a) providing a greensheet having a width, length, thickness, a first side and a second side; b) bonding to the first side of the greensheet at least one strip, wherein the strip lies in a first plane; c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane; d) processing the greensheet; and e) removing the strips from the processed greensheet.

摘要翻译： 一种处理毛坯的方法，其中执行以下步骤：a）提供具有宽度，长度，厚度，第一侧面和第二侧面的毛坯; b）将至少一个条带结合到毛坯的第一侧，其中 所述条带位于第一平面中; c）将至少一个条带连接到所述生片的第二侧，其中所述条位于第二平面中; d）处理所述毛坯; 从处理过的毛坯上去除条带。

公开(公告)号：US08232636B2

公开(公告)日：2012-07-31

申请号：US12693646

申请日：2010-01-26

申请人： James N Humenik ,  Sushumna Iruvanti ,  Richard Langlois ,  Hsichang Liu ,  Govindarajan Natarajan ,  Kamal K Sikka ,  Hilton T Toy ,  Jiantao Zheng ,  Gregg B Monjeau ,  Mark Kapfhammer

发明人： James N Humenik ,  Sushumna Iruvanti ,  Richard Langlois ,  Hsichang Liu ,  Govindarajan Natarajan ,  Kamal K Sikka ,  Hilton T Toy ,  Jiantao Zheng ,  Gregg B Monjeau ,  Mark Kapfhammer

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/42 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3736 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.

摘要翻译： 芯片的前端结合到芯片载体的顶表面。 密封材料被分配在芯片载体的顶表面的周边。 提供具有第一侧和第二侧的焊料TIM。 TIM的第一面接触芯片的背面。 进行回流以融化TIM。 TIM的第二面粘合到盖子上。 密封材料固化。 盖子附接到芯片载体的顶表面。 回填材料被注入到芯片载体的顶表面和盖子之间的空间中。 回填材料邻接TIM的两侧。 回填材料固化。 TIM焊料裂纹和相关的热降解得到缓解。

公开(公告)号：US08916017B2

公开(公告)日：2014-12-23

申请号：US13456516

申请日：2012-04-26

申请人： Govindarajan Natarajan ,  Nathaniel David Wetmore

发明人： Govindarajan Natarajan ,  Nathaniel David Wetmore

IPC分类号： B29C65/00 ,  B32B37/00 ,  B32B17/00 ,  B32B17/10 ,  C03C27/00 ,  G02C7/00 ,  B60J1/00 ,  E06B3/00 ,  E06B5/00 ,  E06B7/00 ,  E06B3/24

CPC分类号： B32B17/10018 ,  B32B17/10889 ,  B32B17/10954 ,  B32B37/12 ,  B32B38/1841 ,  B32B38/1858 ,  B32B38/1866 ,  B32B2315/08 ,  B32B2457/20

摘要： A contoured glass sheet laminating system may include a glass-side vacuum bed, a laminate-side vacuum bed and a lamination actuator. The glass-side vacuum bed may include a vacuum backside and a mold-receiving side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the glass-side vacuum bed between the vacuum backside and the mold-receiving side of the glass-side vacuum bed. The laminate-side vacuum bed may include a vacuum backside and a thin-film loading side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the laminate-side vacuum bed between the vacuum backside and the thin-film loading side of the of the laminate-side vacuum bed.

摘要翻译： 成型玻璃板层压系统可以包括玻璃侧真空床，层压板真空床和层压致动器。 玻璃侧真空床可以包括真空背面和模具接收侧，并且可以具有足够的渗透性，以允许真空系统在真空背面和模具接收之间拉动真空穿过玻璃侧真空床的厚度 侧玻璃侧真空床。 层压体侧真空床可以包括真空背面和薄膜装载侧，并且可以具有足够的渗透性，以允许真空系统在真空背面和薄膜真空床之间拉动层压体侧真空床的厚度， 层压板真空床的膜装载侧。