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    Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates
    2.
    发明授权
    Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates 失效

    公开(公告)号：US06900073B2

    公开(公告)日：2005-05-31

    申请号：US10249429

    申请日：2003-04-08

    申请人： Raschid J. Bezama ,  Renee L. Weisman

    发明人： Raschid J. Bezama ,  Renee L. Weisman

    IPC分类号： H05K3/22 ,  H01L21/48 ,  H01L23/12 ,  H01L21/44

    CPC分类号： H01L21/4807

    摘要： An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.