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公开(公告)号：US08232636B2
公开(公告)日：2012-07-31
申请号：US12693646
申请日：2010-01-26
申请人： James N Humenik , Sushumna Iruvanti , Richard Langlois , Hsichang Liu , Govindarajan Natarajan , Kamal K Sikka , Hilton T Toy , Jiantao Zheng , Gregg B Monjeau , Mark Kapfhammer
发明人： James N Humenik , Sushumna Iruvanti , Richard Langlois , Hsichang Liu , Govindarajan Natarajan , Kamal K Sikka , Hilton T Toy , Jiantao Zheng , Gregg B Monjeau , Mark Kapfhammer
CPC分类号： H01L23/42 , H01L23/10 , H01L23/3675 , H01L23/3736 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.
摘要翻译： 芯片的前端结合到芯片载体的顶表面。 密封材料被分配在芯片载体的顶表面的周边。 提供具有第一侧和第二侧的焊料TIM。 TIM的第一面接触芯片的背面。 进行回流以融化TIM。 TIM的第二面粘合到盖子上。 密封材料固化。 盖子附接到芯片载体的顶表面。 回填材料被注入到芯片载体的顶表面和盖子之间的空间中。 回填材料邻接TIM的两侧。 回填材料固化。 TIM焊料裂纹和相关的热降解得到缓解。
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公开(公告)号：US20090095444A1
公开(公告)日：2009-04-16
申请号：US12338092
申请日：2008-12-18
IPC分类号： F28F7/00
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体，并在垂直于目标表面的方向上去除废热流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。
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公开(公告)号：US07992627B2
公开(公告)日：2011-08-09
申请号：US12338092
申请日：2008-12-18
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体并在与目标表面正交的方向上去除用过的热的流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。
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公开(公告)号：US07516776B2
公开(公告)日：2009-04-14
申请号：US10908622
申请日：2005-05-19
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体并在与目标表面正交的方向上去除用过的热的流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。
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公开(公告)号：US20090109628A1
公开(公告)日：2009-04-30
申请号：US11928165
申请日：2007-10-30
IPC分类号： H01L23/367 , F28F7/00
CPC分类号： H01L23/367 , F28F13/00 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： Integrated circuit chip cooling methods and systems are disclosed. A method for cooling an integrated circuit chip may comprise: providing a cooling mechanism; positioning an interface medium between the cooling mechanism and the integrated circuit chip; and interfacing the cooling mechanism and the integrated circuit chip through the interface medium; wherein at least one of the cooling mechanism, the integrated circuit chip, or the interface medium includes a convex portion on an interface surface thereof.
摘要翻译： 公开了集成电路芯片的冷却方法和系统。 用于冷却集成电路芯片的方法可以包括：提供冷却机构; 在冷却机构和集成电路芯片之间定位界面介质; 并通过接口介质与冷却机构和集成电路芯片接口; 其中所述冷却机构，所述集成电路芯片或所述界面介质中的至少一个在其界面表面上包括凸部。
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公开(公告)号：US07908906B2
公开(公告)日：2011-03-22
申请号：US11468089
申请日：2006-08-29
申请人： Govindarajan Natarajan , Emmanuel Delamarche , Eric A Eckberg , James N Humenik , Kathleen A McGroddy-Goetz , Scott Partington , Christopher F Perrera , Marco G Trivella , Timothy M Wiwel
发明人： Govindarajan Natarajan , Emmanuel Delamarche , Eric A Eckberg , James N Humenik , Kathleen A McGroddy-Goetz , Scott Partington , Christopher F Perrera , Marco G Trivella , Timothy M Wiwel
IPC分类号： G01N13/04
CPC分类号： G01N13/04 , A61B2010/0067
摘要： An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.
摘要翻译： 用于测定流体渗透压的装置，系统和方法。 该系统包括具有：具有基本平坦的顶表面的芯片的装置; 第一电路部分和第二电路部分，每个具有设置在顶表面上的多个冗余导电线; 以及设置在第一电路部分和第二电路部分之间的间隙，其中当流体样品桥接间隙并连接第一电路部分和第二电路部分时产生电路。
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公开(公告)号：US07684194B2
公开(公告)日：2010-03-23
申请号：US12132882
申请日：2008-06-04
CPC分类号： H01L23/473 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.
摘要翻译： 提供了通过在将电子设备与散热器分隔开的间隙中的增强的热传导来冷却电子设备的系统和方法。 在一个实施例中，用于冷却电子设备的系统包括：通过间隙与集成电路隔开的散热器; 以及配置成将包含雾化液体和载气的混合物供给到所述间隙的起泡器和雾化器。
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公开(公告)号：US20090303684A1
公开(公告)日：2009-12-10
申请号：US12132882
申请日：2008-06-04
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.
摘要翻译： 提供了通过在将电子设备与散热器分隔开的间隙中的增强的热传导来冷却电子设备的系统和方法。 在一个实施例中，用于冷却电子设备的系统包括：通过间隙与集成电路隔开的散热器; 以及配置成将包含雾化液体和载气的混合物供给到所述间隙的起泡器和雾化器。
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公开(公告)号：US20080057569A1
公开(公告)日：2008-03-06
申请号：US11468089
申请日：2006-08-29
申请人： Govindarajan Natarajan , Emmanuel Delamarche , Eric A. Eckberg , James N. Humenik , Kathleen A. McGroddy-Goetz , Scott Partington , Christopher F Perrera , Marco G. Trivella , Timothy M. Wiwel
发明人： Govindarajan Natarajan , Emmanuel Delamarche , Eric A. Eckberg , James N. Humenik , Kathleen A. McGroddy-Goetz , Scott Partington , Christopher F Perrera , Marco G. Trivella , Timothy M. Wiwel
IPC分类号： C12M1/34
CPC分类号： G01N13/04 , A61B2010/0067
摘要： An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.
摘要翻译： 用于测定流体渗透压的装置，系统和方法。 该系统包括具有：具有基本平坦的顶表面的芯片的装置; 第一电路部分和第二电路部分，每个具有设置在顶表面上的多个冗余导电线; 以及设置在第一电路部分和第二电路部分之间的间隙，其中当流体样品桥接间隙并连接第一电路部分和第二电路部分时产生电路。
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公开(公告)号：US06955777B2
公开(公告)日：2005-10-18
申请号：US10338093
申请日：2003-01-07
申请人： Govindarajan Natarajan , Umar Ahmad , Raschid J. Bezama , James N. Humenik , John U. Knickerbocker , Rao V. Vallabhaneni
发明人： Govindarajan Natarajan , Umar Ahmad , Raschid J. Bezama , James N. Humenik , John U. Knickerbocker , Rao V. Vallabhaneni
CPC分类号： B32B18/00 , B01J2219/00286 , B01J2219/00317 , B01L3/502707 , B01L3/5085 , B01L2200/12 , B01L2300/0816 , B01L2300/0819 , B01L2300/0887 , B01L2300/12 , B81B2203/0338 , B81B2203/0353 , B81C1/00119 , C04B35/645 , C04B2235/6567 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/62 , C04B2237/704
摘要： A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.
摘要翻译： 在制药工业中用于混合和测试材料的板材是通过一种方法形成的，其中通过材料去除工艺形成一组绿叶片中的孔，至少一些孔被填充有在烧结过程中逸出的逃逸材料 。
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