摘要:
A method and apparatus for changing an input type in an input system using UPnP are provided. A control point requests input capability information of input devices, which are to perform input and receives the input capability information. The control point sets up a session by determining a receiving device for receiving an input signal and a transmitting device for transmitting the input signal, using the received input capability information. The receiving device receives input data from the transmitting device, and if an input type of the receiving device is changed, the receiving device transmits information about the changed input type to the transmitting device and receives a report descriptor including information about a format of input data according to the changed input type from the transmitting device.
摘要:
A method and apparatus for changing an input type in an input system using UPnP are provided. A control point requests input capability information of input devices, which are to perform input and receives the input capability information. The control point sets up a session by determining a receiving device for receiving an input signal and a transmitting device for transmitting the input signal, using the received input capability information. The receiving device receives input data from the transmitting device, and if an input type of the receiving device is changed, the receiving device transmits information about the changed input type to the transmitting device and receives a report descriptor including information about a format of input data according to the changed input type from the transmitting device.
摘要:
An apparatus, method, and system for providing information for a wireless network connection using Wi-Fi. Device information for at least one UPnP device is provided from a plurality of wireless devices including the at least one UPnP device, a device information announcement message including the device information for the at least one UPnP device is generated, and the generated device information announcement message is broadcasted. In this way, information on a UPnP device to which to connect a wireless device is provided in advance, and a user can easily perform a network connection.
摘要:
Methods of forming integrated circuit devices include patterning an electrically insulating layer to support dual-damascene interconnect structures therein. The steps of patterning the electrically insulating layer include using multiple planarization layers having different porosity characteristics. Forming an interconnect structure within an integrated circuit device may include forming an electrically insulating layer on a substrate and forming at least one via hole extending at least partially through the electrically insulating layer. The at least one via hole is filled with a first electrically insulating material having a first porosity. The filled at least one via hole is then covered with a second electrically insulating material layer having a second porosity lower than the first porosity. The second electrically insulating material layer is selectively etched back to expose a first portion of the first electrically insulating material in the at least one via hole. The electrically insulating layer is selectively etched to define a trench therein that exposes a second portion of the first electrically insulating material in the at least one via hole. The first electrically insulating material, which has a relatively high degree of porosity, is then removed from the at least one via hole. This removal step may be performed using a relatively mild ashing process because of the high porosity of the first electrically insulating material.
摘要:
In a MIM capacitor, and method of fabricating the same, the MIM capacitor includes an interlayer insulating layer on a semiconductor substrate, a lower metal interconnection and a lower metal electrode in the interlayer insulating layer, an intermetal dielectric layer covering the lower metal interconnection, the lower metal electrode, and the interlayer insulating layer, a via hole exposing the lower metal interconnection, an upper metal interconnection groove crossing over the via hole, at least one capacitor trench region exposing the lower metal electrode, an upper metal interconnection filling the upper metal interconnection groove, the upper metal interconnection being electrically connected to the lower metal interconnection through the via hole, a dielectric layer covering inner surfaces of the at least one capacitor trench region, and an upper metal electrode surrounded by the dielectric layer to fill the at least one capacitor trench region.
摘要:
In a method of fabricating a semiconductor device by selectively forming a diffusion barrier layer, and a semiconductor device fabricated thereby, a conductive pattern and an insulating layer, which covers the conductive pattern, are formed on a semiconductor substrate. The insulating layer is patterned, thereby forming an opening for exposing at least a portion of the conductive pattern. Then, a diffusion barrier layer is formed on the semiconductor substrate having the opening, using a selective deposition technique. The diffusion barrier layer is formed to a thickness that is less on the exposed conductive pattern than the thickness of the diffusion barrier layer on the insulating layer exposed inside the opening. Then, the diffusion barrier layer is etched, thereby forming a recessed diffusion barrier layer. In this manner, metal atoms are prevented from being diffused from a metal plug filling the opening or a metal interconnect to the insulating layer.
摘要:
An image sensor device and method for forming the same include a photodiode formed in a substrate, at least one electrical interconnection line electrically associated with the photodiode, a light passageway having a light inlet, the light passageway being positioned in alignment with the photodiode, a color filter positioned over the light inlet of the light passageway and a lens positioned over the color filter in alignment with the light passageway wherein the at least one electrical interconnection line includes a copper interconnection formation having a plurality of interlayer dielectric layers in a stacked configuration with a diffusion barrier layer between adjacent interlayer dielectric layers, and a barrier metal layer between the copper interconnection formation and the plurality of interlayer dielectric layers and intervening diffusion barrier layers. An image sensor device may employ copper interconnections if a barrier metal layer is removed from above a photodiode.
摘要:
A system and method for displaying document content using Universal Plug and Play (UPnP) is provided. A media server provides meta information corresponding to the document content to a control point if a user request for displaying the document content is received, the control point provides the meta information of the document content to a media renderer that can display the requested document content together with an operation performance command for displaying the requested document content, and the media renderer receives the document content from the media server and renders the document content in accordance with the operation performance command to display the document content on a screen.
摘要:
Provided is a method for storing a content flip list of a digital media server using user input feedback. The method includes receiving a content request message from a user and transmitting the received request message to a media server, converting information received as a response to the request message into a page format, defining the converted information as a current page, and receiving and storing previous and next pages of the current page, and outputting the received current page through an output part.
摘要:
In a method of manufacturing a semiconductor device, a pad including at least one insulating interlayer and at least one conductive wiring may be formed in a pad area of a substrate. At least one wiring may be formed adjacent to the conductive wiring. At least one insulation layer may be formed adjacent to the insulating interlayer. At least one crack preventing structure may be formed in the insulation layer. The crack preventing structure may continuously extend in the insulation layer and portions of the insulation layer may also be continuous. When a semiconductor device includes at least one crack preventing structure disposed adjacent to a pad, a degradation of the semiconductor chip caused by an external impact and/or a stress may be efficiently prevented by the crack preventing structure.