摘要:
A surge arrester (1) includes varistor elements (2) forming a stack (3) and having opposed end surfaces (4a, 4b). The varistor stack is electrically connected via the opposed end surfaces to end terminals (7a, 7b) having circumferential ridges (32a, 32b), which, in the event of failure of the varistor elements, are designed to relocate the resulting arc and direct it in a manner which reduces or minimizes damage to the surge arrester. The ridges serve as damage-tolerant sacrificial rooting points for an arc in the event of varistor element failure by presenting a substantial metal mass for the arc to erode away.
摘要:
A surge arrester includes varistor elements forming a stack and having opposed end surfaces. The varistor stack is electrically connected via the opposed end surfaces to end terminals having circumferential ridges, which, in the event of failure of the varistor elements, are designed to relocate the resulting arc and direct it in a manner which reduces or minimizes damage to the surge attester. The ridges serve as damage-tolerant sacrificial rooting points for an arc in the event of varistor element failure by presenting a substantial metal mass for the arc to erode away.
摘要:
A surge arrester has a single varistor element or a stack of varistor elements held between two end terminals by a plurality of elongate strength members disposed therearound. The ends of the strength members are inserted into recesses in the end terminals. Crimping of the end terminals distorts the recesses sufficiently to hold the strength members firmly therewithin, but without shearing and crushing (or otherwise damaging) the strength members.
摘要:
A surge arrester has end terminals having circumferential ridges, which, in the event of failure of varistor elements of the surge arrester, are designed to relocate the resulting arc and direct it in a manner which reduces or minimizes damage to the surge arrester. Grooves lead from the inner surface of the terminals to the ridges, to facilitate arc relocation.
摘要:
A sealed vented surge arrester and method of manufacture is described wherein the valve elements are held under compressive loading while strength members including a moisture sealing void filling compound are pressed fit from the sides of the unit with a shed applied over it. The design achieves all the desirable features of tubular strength members with an ease of manufacture from utilizing half-shell or more members which can be applied from the sides along the longitudinal axis of the valve elements during manufacture to provide better void filling between the structural members and the valve elements.
摘要:
A double-walled article in the form of a tube having a small volume filling of a friction-reducing liquid or solid between its two walls. The article is able to revolve over a substrate by relative sliding motion between its two walls, to provide environmental or electrical protection.
摘要:
A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.
摘要:
A double-walled article in the form of a tube having a small volume filling of a friction-reducing liquid or solid between its two walls. The article is able to revolve over a substrate by relative sliding motion between its two walls, to provide environmental or electrical protection.
摘要:
Optoelectronic modules and methods of manufacturing the same are disclosed. Some of the disclosed modules employ a tape automated bonding substrate (TAB) which is surface mounted with circuit elements. In some examples, the TAB is mounted to a rigid substrate after a fiber submount is passively positioned on the substrate. This modular manufacturing technique limits the value of yield loss. In some example modules, only one active alignment is employed to manufacture the module. Some of the disclosed modules include an optically pluggable connector.
摘要:
A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.