摘要:
A process is presented for forming an anisotropic graphite article, comprising forming a laminate comprising a plurality of flexible graphite sheets which comprise graphene layers; and directionally aligning the graphene layers of the laminate.
摘要:
The invention provides to thermal management devices constructed from flexible graphite. In one embodiment, the thermal management device includes a wick structure inside a shell. In certain preferred embodiments, the wick structure is composed of a mass of expanded graphite. In a another embodiment, the shell of the device includes flexible graphite and an optional wick structure. In certain preferred embodiments, the flexible graphite shell is fluid impermeable. The invention further includes methods of making the aforementioned thermal management devices.
摘要:
A release lined pressure sensitive adhesive flexible graphite sheet article is provided having low thermal resistance properties comparable to the flexible graphite material itself when compared to prior art PSA sheet products and wherein the release liner is easily removed with the sheet is to be used without any significant delamination of the flexible graphite. The flexible graphite sheet comprises a flexible graphite substrate, an adhesive primer coating thereon, a pressure sensitive adhesive coating on the adhesive primer coating and a release liner applied to the pressure sensitive adhesive coating. Double sided pressure sensitive adhesive flexible graphite sheets can also be made using the method of the invention. It has been found that the use of an adhesive primer coating on the flexible graphite substrate applied from an emulsion as a coating and dried instead of the prior art adhesive containing polymer layer applied as a solid film, such as Mylar film, provide the above desired thermal resistance properties and also enable the use of less pressure sensitive adhesive on the sheet thereby maintaining the low thermal resistance properties of the flexible graphite. Partial coverage of the pressure sensitive adhesive on the sheet article surface for minimizing the thermal resistance of the sheet is also provided.
摘要:
A uniform heat conduction installation includes a reflection layer and a graphite uniform heat conduction layer with the latter provided on the lower surface of the former; certain portion of thermal energy generated by a heat source disposed on top of the reflection layer is reflected and dissipated by the reflection layer, and the remainder of the thermal energy passes through the reflection layer and is transmitted to the graphite uniform heat conduction layer for the thermal energy to be consistently spread up over the entire surface of the uniform heat conduction installation due to the inherited nature of providing uniform heat conduction effects of the graphite so to achieve better heat dissipation results due to increased area for heat diffusion.
摘要:
The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a thermal management system that includes a heat sink formed from a graphite article.
摘要:
The invention presented relates to a process for providing increased electrical and/or thermal conductivity to a material, and to the materials prepared by the process. More particularly, the invention relates to a process involving applying particles of expanded graphite to a substrate or material in order to increase its conductivity. The particles of expanded graphite can be applied to the substrate or material through coating of the substrate with a composition comprising the expanded graphite particles, or by incorporating particles of expanded graphite into the substrate or material itself.
摘要:
A heat sink for a light emitting diode includes a light emitting diode disposed on a circuit board; a through hole is provided on the circuit board corresponding to where the light emitting diode is located; a heat sink is disposed to the through hole; the heat sink is secured to the circuit board by means of the through hole to directly contact the light emitting diode; and the heat generated from the light emitting diode in operation is effectively dissipated by the heat sink.
摘要:
A mold for an LED lampshade comprising: an upper mold defined with a cavity in the bottom surface thereof; a lower mold defined with a slide recess corresponding to the cavity of the upper mold, a movable ejection block being received in the slide recess, the movable ejection block being movable back and forth along the slide recess, a cavity being defined in the top surface of the movable ejection block; and multiple ejection rods respectively disposed at the lower mold and at opposite sides of the movable ejection block and extending from the bottom of the lower mold to the top of the lower mold. When the mold of the present invention is used to injection mold, the LED lampshade is ejected by the movable ejection block in a manner of surface contact thereby preventing ejection marks on the surface of the LED lampshade.