Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
    1.
    发明授权
    Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner 有权
    柔性石墨带非载体压敏粘合剂背衬和剥离衬垫

    公开(公告)号:US06245400B1

    公开(公告)日:2001-06-12

    申请号:US09167865

    申请日:1998-10-07

    IPC分类号: B32B3300

    摘要: A release lined pressure sensitive adhesive flexible graphite sheet article is provided having low thermal resistance properties comparable to the flexible graphite material itself when compared to prior art PSA sheet products and wherein the release liner is easily removed with the sheet is to be used without any significant delamination of the flexible graphite. The flexible graphite sheet comprises a flexible graphite substrate, an adhesive primer coating thereon, a pressure sensitive adhesive coating on the adhesive primer coating and a release liner applied to the pressure sensitive adhesive coating. Double sided pressure sensitive adhesive flexible graphite sheets can also be made using the method of the invention. It has been found that the use of an adhesive primer coating on the flexible graphite substrate applied from an emulsion as a coating and dried instead of the prior art adhesive containing polymer layer applied as a solid film, such as Mylar film, provide the above desired thermal resistance properties and also enable the use of less pressure sensitive adhesive on the sheet thereby maintaining the low thermal resistance properties of the flexible graphite. Partial coverage of the pressure sensitive adhesive on the sheet article surface for minimizing the thermal resistance of the sheet is also provided.

    摘要翻译: 与现有技术的粘合片产品相比,提供了具有低柔性石墨材料本身的低耐热性能的剥离衬里的压敏粘合剂柔性石墨片制品,并且其中使用片材容易除去的剥离衬垫将没有任何显着的 柔性石墨的分层。 柔性石墨片包括柔性石墨基底,其上的粘合底漆涂层,粘合底漆涂层上的压敏粘合剂涂层和施加到压敏粘合剂涂层上的剥离衬垫。 双面压敏粘合剂柔性石墨片也可以使用本发明的方法制成。 已经发现,使用由乳液作为涂层施加的柔性石墨基底上的粘合剂底漆涂层,并且干燥而不是作为固体膜(例如Mylar膜)施加的现有技术的含有粘合剂的聚合物层提供了上述期望的 并且还能够在片材上使用较少的压敏粘合剂,从而保持柔性石墨的低耐热性能。 还提供了用于使片材的热阻最小化的片材制品表面上的压敏粘合剂的部分覆盖。

    Uniform heat conduction installation
    5.
    发明申请
    Uniform heat conduction installation 审中-公开
    均匀导热安装

    公开(公告)号:US20080180904A1

    公开(公告)日:2008-07-31

    申请号:US11699068

    申请日:2007-01-29

    IPC分类号: G06F1/20

    CPC分类号: G06F1/203

    摘要: A uniform heat conduction installation includes a reflection layer and a graphite uniform heat conduction layer with the latter provided on the lower surface of the former; certain portion of thermal energy generated by a heat source disposed on top of the reflection layer is reflected and dissipated by the reflection layer, and the remainder of the thermal energy passes through the reflection layer and is transmitted to the graphite uniform heat conduction layer for the thermal energy to be consistently spread up over the entire surface of the uniform heat conduction installation due to the inherited nature of providing uniform heat conduction effects of the graphite so to achieve better heat dissipation results due to increased area for heat diffusion.

    摘要翻译: 均匀的热传导装置包括反射层和石墨均匀的导热层,后者设置在前者的下表面上; 由设置在反射层顶部的热源产生的热能的一定部分被反射层反射并消散,其余的热能通过反射层,并被传递到石墨均匀的导热层,用于 由于提供石墨的均匀热传导效应的遗传性质,热能一直在均匀热传导装置的整个表面上扩散,从而由于增加的热扩散面积而获得更好的散热结果。

    LED heat sink
    8.
    发明申请
    LED heat sink 审中-公开
    LED散热片

    公开(公告)号:US20080180014A1

    公开(公告)日:2008-07-31

    申请号:US11699071

    申请日:2007-01-29

    IPC分类号: H01K1/58

    摘要: A heat sink for a light emitting diode includes a light emitting diode disposed on a circuit board; a through hole is provided on the circuit board corresponding to where the light emitting diode is located; a heat sink is disposed to the through hole; the heat sink is secured to the circuit board by means of the through hole to directly contact the light emitting diode; and the heat generated from the light emitting diode in operation is effectively dissipated by the heat sink.

    摘要翻译: 用于发光二极管的散热器包括设置在电路板上的发光二极管; 在对应于发光二极管的位置的电路​​板上设置通孔; 散热器设置在通孔中; 散热器通过通孔固定到电路板上,以直接接触发光二极管; 并且由运行中的发光二极管产生的热量被散热器有效地消散。

    MOLD FOR AN LED LAMPSHADE
    9.
    发明申请
    MOLD FOR AN LED LAMPSHADE 审中-公开
    用于LED灯的模具

    公开(公告)号:US20070196533A1

    公开(公告)日:2007-08-23

    申请号:US11308671

    申请日:2006-04-20

    IPC分类号: B29C45/40

    摘要: A mold for an LED lampshade comprising: an upper mold defined with a cavity in the bottom surface thereof; a lower mold defined with a slide recess corresponding to the cavity of the upper mold, a movable ejection block being received in the slide recess, the movable ejection block being movable back and forth along the slide recess, a cavity being defined in the top surface of the movable ejection block; and multiple ejection rods respectively disposed at the lower mold and at opposite sides of the movable ejection block and extending from the bottom of the lower mold to the top of the lower mold. When the mold of the present invention is used to injection mold, the LED lampshade is ejected by the movable ejection block in a manner of surface contact thereby preventing ejection marks on the surface of the LED lampshade.

    摘要翻译: 一种用于LED灯罩的模具,包括:在其底表面中限定有空腔的上模具; 限定有与上模具的空腔对应的滑动凹部的下模具,可移动的喷射块被容纳在滑动凹部中,可动喷射块可沿着滑动凹部前后移动,空腔限定在顶面 的移动喷射块; 以及多个排出杆,分别设置在下模具处和可移动喷射块的相对侧并且从下模具的底部延伸到下模具的顶部。 当本发明的模具用于注射模具时,LED灯罩以可表面接触的方式由可移动喷射块喷射,从而防止LED灯罩的表面上的喷射痕迹。

    LED leadframe
    10.
    外观设计
    LED leadframe 有权
    LED引线框架

    公开(公告)号:USD530684S1

    公开(公告)日:2006-10-24

    申请号:US29243744

    申请日:2005-11-29

    申请人: Jing-Wen Tzeng

    设计人: Jing-Wen Tzeng